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GBU2506L

XCH(旭昌辉) · IC · GBU

GBU2506L from XCH(旭昌辉), in a GBU. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 - passive DC negative output of the bridge, the common anode node of the two lower diodes; bridge rated VRRM 600 V and IO 25.0 A with heatsink (Tc=100℃).
2 2 passive AC input terminal of the single-phase bridge; rated VRRM 600 V with 350 A non-repetitive surge (IFSM, 60Hz half sine).
3 3 passive Second AC input terminal of the single-phase bridge; rated VRRM 600 V with 350 A non-repetitive surge (IFSM, 60Hz half sine).
4 + passive DC positive output of the bridge, the common cathode node of the two upper diodes; IO 25.0 A with heatsink (Tc=100℃), VF 0.93 V max at IFM=12.5 A per diode.

Key specifications

Parameter Value
Manufacturer XCH(旭昌辉)
Package GBU
Category
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak reverse voltage VRRM 600 V 1
Average rectified output current, with heatsink IO 25 A @60Hz sine wave, R-load; with heatsink Tc=100℃ 1
Average rectified output current, without heatsink IO 3.5 A @60Hz sine wave, R-load; without heatsink Ta=25℃ 1
Surge (non-repetitive) forward current IFSM 350 A @60Hz half sine wave, 1 cycle, Tj=25℃ 1
Current squared time, rating per diode I2t 510 A2S @1ms≤t≤8.3ms Tj=25℃, rating per diode 1
Storage temperature Tstg -55 150 ℃ 1
Junction temperature Tj -55 150 ℃ 1
Dielectric strength Vdis 2.5 KV @terminals to case, AC 1 minute 1
Mounting torque Tor 8 kg·cm @recommend torque: 5kg·cm 1
Maximum instantaneous forward voltage drop per diode VF 0.8 V IFM= A (current value blank in source text) 1
Maximum instantaneous forward voltage drop per diode VF 0.84 V IFM=3.0A 1
Maximum instantaneous forward voltage drop per diode VF 0.93 V IFM=12.5 A 1
Maximum DC reverse current at rated DC blocking voltage per diode IRRM 5 μA VRM=VRRM 1
Thermal resistance, junction to ambient RθJ-A 23 ℃/W Between junction and ambient, without heatsink 1
Thermal resistance, junction to case RθJ-C 1.9 ℃/W Between junction and case, with heatsink 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin ● Terminals: Tin plated leads, solderable per J-STD-002 and JESD22-B102 1

CAD (KiCad official)

  • Symbol: GBU2506L
  • Footprint: Diode_THT:Diode_Bridge_Vishay_GBU
  • 3D model: GBU (KiCad packages3D, STEP)
  • 3D model files: gbu2506l-etched.step / gbu2506l-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gbu2506l.step / gbu2506l.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XCH(旭昌辉) datasheet (3 pp, sha256 6ee94b4e05e6ef61, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF