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GBU2506

Yangzhou Yangjie Elec Tech · Bridge Rectifiers · GBU

GBU2506 from Yangzhou Yangjie Elec Tech, in a GBU. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 - passive Negative DC output terminal of the bridge, marked "−" on the body, for a part rated 600 V VRRM and 25.0 A with heatsink (Tc=98℃).
2 AC passive AC input terminal, marked "AC" on the body, for a part rated 600 V VRRM, 300 A IFSM and 2.5 kV terminals-to-case dielectric strength.
3 AC passive Second AC input terminal, marked "AC" on the body, for a part rated 600 V VRRM, 300 A IFSM and 2.5 kV terminals-to-case dielectric strength.
4 + passive Positive DC output terminal of the bridge, marked "+" on the body, for a part rated 600 V VRRM and 25.0 A with heatsink (Tc=98℃).

Key specifications

Parameter Value
Manufacturer Yangzhou Yangjie Elec Tech
Package GBU
Category Diodes
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Average rectified output current, with heatsink IO 25 A @60Hz sine wave, R-load, Tc=98℃ 1
Average rectified output current, without heatsink IO 3.5 A @60Hz sine wave, R-load, Ta=25℃ 1
Maximum instantaneous forward voltage drop per diode VF 1 V IFM=12.5A 1
Maximum DC reverse current at rated DC blocking voltage per diode IRRM 5 μA VRM=VRRM 1
Repetitive peak reverse voltage (GBU2506 column) VRRM 600 V 1
Surge (non-repetitive) forward current IFSM 300 A @60Hz half sine wave, 1 cycle, Tj=25℃ 1
Current squared time, rating per diode I2t 373 A2S @1ms≤t≤8.3ms Tj=25℃ 1
Storage temperature Tstg -55 150 ℃ 1
Junction temperature Tj -55 150 ℃ 1
Dielectric strength, terminals to case Vdis 2.5 KV AC 1 minute 1
Mounting torque Tor 8 kg·cm recommended torque 5 kg·cm 1
Thermal resistance, junction to ambient, without heatsink RθJ-A 22 ℃/W Without heatsink 2
Thermal resistance, junction to case, with heatsink RθJ-C 3 ℃/W With heatsink 2

CAD (KiCad official)

  • Symbol: GBU2506
  • Footprint: Diode_THT:Diode_Bridge_Vishay_GBU
  • 3D model: GBU (KiCad packages3D, STEP)
  • 3D model files: gbu2506-etched.step / gbu2506-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gbu2506.step / gbu2506.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Yangzhou Yangjie Elec Tech datasheet (4 pp, sha256 6fe3885b2fa64d7f, retrieved 2026-10-14, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF