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Contents

README

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GBU2010-SY

SY(顺烨) · IC · GBU

GBU2010-SY from SY(顺烨), in a GBU. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 - passive DC negative output of the bridge, the leftmost lead marked "−" on the body; the GBU2010 is rated 1000V VRRM and 20.0A average with heatsink.
2 2 passive AC input terminal marked "~"; the GBU2010 has 700V maximum RMS voltage and 250.0A peak forward surge current (8.3ms).
3 3 passive Second AC input terminal marked "~"; the GBU2010 has 700V maximum RMS voltage and 1.10V maximum forward voltage at 20.0A.
4 + passive DC positive output of the bridge, the rightmost lead marked "+" on the body; the GBU2010 is rated 1000V maximum DC blocking voltage.

Key specifications

Parameter Value
Manufacturer SY(顺烨)
Package GBU
Category
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum repetitive peak reverse voltage VRRM 1000 V GBU2010 column; ratings at 25 C ambient unless otherwise specified 1
Maximum DC blocking voltage VDC 1000 V GBU2010 column; ratings at 25 C ambient unless otherwise specified 1
Maximum RMS voltage VRMS 700 V GBU2010 column; ratings at 25 C ambient unless otherwise specified 1
Maximum average forward rectified current I(AV) 20 A Single phase half-wave 60Hz, resistive or inductive load 1
Peak forward surge current IFSM 250 A 8.3ms single half sine-wave superimposed on rated load 1
Maximum DC reverse current IR 5 uA TA=25 C, at rated DC blocking voltage 1
Typical junction capacitance CJ 55 pF Measured at 1MHz and applied reverse voltage of 4.0V D.C. 1
Typical thermal resistance RqJA 55 C/W 1
Operating junction and storage temperature range TJ,TSTG -55 150 C 1
Soldering temperature at terminals 250 C 10 seconds at terminals 1

CAD (KiCad official)

  • Symbol: GBU2010-SY
  • Footprint: Diode_THT:Diode_Bridge_Vishay_GBU
  • 3D model: GBU (KiCad packages3D, STEP)
  • 3D model files: gbu2010-sy-etched.step / gbu2010-sy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gbu2010-sy.step / gbu2010-sy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SY(顺烨) datasheet (2 pp, sha256 bfffa9c081484185, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF