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GBU2008

Changjing · Bridge Rectifiers · GBU

GBU2008 from Changjing, in a GBU. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 + passive Positive DC output terminal of the bridge rectifier, marked + on the package outline (leftmost lead).
2 AC1 passive AC input terminal of the single-phase bridge (second lead from the + end); the drawing does not label it.
3 AC2 passive AC input terminal of the single-phase bridge (third lead, next to the - end); the drawing does not label it.
4 - passive Negative DC output terminal of the bridge rectifier, marked - on the package outline (rightmost lead).

Key specifications

Parameter Value
Manufacturer Changjing
Package GBU
Category Diodes
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Average Rectified Output Current (with heatsink) IO 20 A 60Hz sine wave, R-load, With heatsink Tc =98℃ 1
Average Rectified Output Current (without heatsink) IO 3.6 A 60Hz sine wave, R-load, Without heatsink Ta =25℃ 1
Surge (Non-repetitive) Forward Current IFSM 260 A 60HZ sine wave, 1 cycle, Tj=25℃ 1
Current Squared Time I2t 280 A2S 1ms≤t<8.3ms Tj=25℃, Rating of per diode 1
Storage Temperature Tstg -55 150 ℃ 1
Junction Temperature Tj -55 150 ℃ 1
Dielectric Strength Vdis 2.5 KV Terminals to case, AC 1 minute 1
Mounting Torque Tor 8 kg·cm Recommend torque: 5kg·cm 1
Peak Forward Voltage VFM 1.1 V IFM=10.0A, Pulse measurement, Rating of per diode 1
Peak Reverse Current IRRM 10 μA VRM=VRRM, Pulse measurement, Rating of per diode 1
Thermal Resistance Junction to Ambient RθJ-A 22 ℃/W Between junction and ambient, Without heatsink 1
Thermal Resistance Junction to Case RθJ-C 1 ℃/W Between junction and case, With heatsink 1
Repetitive Peak Reverse Voltage (GBU2008 column) VRRM 800 V 1
Maximum RMS Voltage (GBU2008 column) VRMS 560 V 1

CAD (KiCad official)

  • Symbol: GBU2008
  • Footprint: Diode_THT:Diode_Bridge_Vishay_GBU
  • 3D model: GBU (KiCad packages3D, STEP)
  • 3D model files: gbu2008-etched.step / gbu2008-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gbu2008.step / gbu2008.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Changjing datasheet (3 pp, sha256 a0f046e019a4b384, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF