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Contents

README

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GBU1010A

Yangzhou Yangjie Elec Tech · Bridge Rectifiers · GBU

GBU1010A from Yangzhou Yangjie Elec Tech, in a GBU. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 - passive DC negative output terminal of the bridge, marked '-' on the body; average rectified output 10.0 A with heatsink (Tc=80℃), 3.6 A without (Ta=25℃).
2 AC1 passive AC input terminal marked 'AC' on the body; GBU1010A is rated VRRM 1000 V with 2.5 kV terminals-to-case dielectric strength.
3 AC2 passive Second AC input terminal marked 'AC' on the body; GBU1010A is rated VRRM 1000 V with IFSM 200 A surge current.
4 + passive DC positive output terminal of the bridge, marked '+' on the body; forward voltage drop 1.00 V per diode at IFM=5.0 A.

Key specifications

Parameter Value
Manufacturer Yangzhou Yangjie Elec Tech
Package GBU
Category Diodes
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak reverse voltage VRRM 1000 V GBU1010A column 1
Average rectified output current, with heatsink IO 10 A @60Hz half sine wave, R-load, Tc=80℃ 1
Average rectified output current, without heatsink IO 3.6 A @60Hz half sine wave, R-load, Ta=25℃ 1
Surge (non-repetitive) forward current IFSM 200 A @60Hz half sine wave, 1 cycle, Tj=25℃ 1
Current squared time I2t 166 A2S @1ms≤t≤8.3ms, Tj=25℃, rating per diode 1
Storage temperature Tstg -55 150 ℃ 1
Junction temperature Tj -55 150 ℃ 1
Dielectric strength Vdis 2.5 KV terminals to case, AC 1 minute 1
Mounting torque Tor 8 kg·cm recommended torque 5 kg·cm 1
Maximum instantaneous forward voltage drop per diode VF 1 V IFM=5.0A 1
Maximum DC reverse current at rated DC blocking voltage per diode IRRM 5 μA VRM=VRRM 1
Thermal resistance, junction to ambient, without heatsink RθJ-A 25 ℃/W without heatsink 2
Thermal resistance, junction to case, with heatsink RθJ-C 2.3 ℃/W with heatsink 2

CAD (KiCad official)

  • Symbol: GBU1010A
  • Footprint: Diode_THT:Diode_Bridge_Vishay_GBU
  • 3D model: GBU (KiCad packages3D, STEP)
  • 3D model files: gbu1010a-etched.step / gbu1010a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gbu1010a.step / gbu1010a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Yangzhou Yangjie Elec Tech datasheet (4 pp, sha256 87fd6400cb56ba0c, retrieved 2026-10-13, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF