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Ray Publish 0.1.0 a60d720 7d ago

GBU1010

MDD(Microdiode Electronics) · Bridge Rectifiers · GBU

GBU1010 from MDD(Microdiode Electronics), in a GBU. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 + power_out Positive DC output of the bridge rectifier; the datasheet symbol shows it as pin 1 marked +, with VRRM 1000 V and I(AV) 10.0 A for GBU1010.
2 2 passive AC input terminal of the bridge; the datasheet symbol shows it as pin 2 marked ~, with VRMS 700 V for GBU1010.
3 3 passive AC input terminal of the bridge; the datasheet symbol shows it as pin 3 marked ~, with VRMS 700 V for GBU1010.
4 - power_out Negative DC output of the bridge rectifier; the datasheet symbol shows it as pin 4 marked -, and it is the return for the 10.0 A average rectified output current.

Key specifications

Parameter Value
Manufacturer MDD(Microdiode Electronics)
Package GBU
Category Diodes
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum repetitive peak reverse voltage VRRM 1000 V 1
Maximum RMS voltage VRMS 700 V 1
Maximum DC blocking voltage VDC 1000 V 1
Maximum average forward rectified current I(AV) 10 A Tc=100°C (without heatsink) 1
Peak forward surge current IFSM 200 A 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) 1
Maximum forward voltage VF 1.1 V at 5.0A DC 1
Maximum DC reverse current IR 10 μA TA=25°C at rated DC blocking voltage 1
Maximum DC reverse current IR 0.5 mA TA=125°C at rated DC blocking voltage 1
Operating junction temperature range TJ -55 150 °C 1
Storage temperature range TSTG -55 150 °C 1
Typical Junction Capacitance CJ 70 pF Note 1: measured at 1.0MHz and applied reverse voltage of 4.0V DC 1
Typical Thermal Resistance RθJA 2.2 °C/W Note 2: device mounted on 75mm75mm1.6mm cu plate heatsink 1

CAD (KiCad official)

  • Symbol: GBU1010
  • Footprint: Diode_THT:Diode_Bridge_Vishay_GBU
  • 3D model: GBU (KiCad packages3D, STEP)
  • 3D model files: gbu1010-etched.step / gbu1010-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gbu1010.step / gbu1010.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MDD(Microdiode Electronics) datasheet (2 pp, sha256 dc9d23da8967239a, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF