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Contents

README

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GBS60037TOB

GOSEMICON · MOSFETs · TO-247

GBS60037TOB from GOSEMICON, in a TO-247. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal of the N-channel MOSFET, rated for a gate-source voltage of ±30 V.
2 D passive Drain terminal of the N-channel MOSFET, rated for a drain-source voltage of 600 V.
3 S passive Source terminal of the N-channel MOSFET, carrying the continuous drain current rated at 60 A at Tc=25°C.

Key specifications

Parameter Value
Manufacturer GOSEMICON
Package TO-247
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source breakdown voltage V(BR)DSS 600 V VGS=0V, ID=1mA 2
Gate threshold voltage V(GS)th 3.4 4 4.6 V VDS=VGS, ID=1mA 3
Drain-source on state resistance RDS-ON 29 34 mΩ VGS=10V, ID=25A 3
Drain-source on state resistance at Tj=125°C RDS-ON 60 mΩ VGS=10V, ID=25A, Tj=125℃ 3
Gate-source leakage current IGSS 100 nA VGS=30V, VDS=0V 3
Drain-source leakage current IDSS 5 uA VGS=0V, VDS=600V 3
Drain-source leakage current at Tj=125°C IDSS 500 uA VGS=0V, VDS=600V, Tj=125℃ 3
Drain-source voltage VDS 600 V 2
Continuous drain current ID 60 A Tc=25°C 2
Continuous drain current ID 38 A Tc=100°C 2
Pulsed drain current ID-pulse 240 A 2
Gate-source voltage VGS -30 30 V 2
Single pulsed avalanche energy EAS 340 mJ ID=8A, VDD=50V 2
Repetitive avalanche energy EAR 1.7 mJ ID=8A, VDD=50V 2
Single pulsed avalanche current IAS 8 A 2
Power dissipation PD 300 W 2
MOSFET dv/dt ruggedness dv/dt 90 V/ns VDS=0~400V 2
Continuous diode forward current IS 60 A 2
Diode pulsed current IS-pulse 240 A 2
Reverse diode dv/dt dv/dt 70 V/ns VDS=0~400V, ISD<50A 2
Operating junction temperature Tj -55 150 °C 2
Storage temperature Tstg -55 150 °C 2
Thermal resistance, junction-case RθJC 0.416 °C/W 2
Thermal resistance, junction-ambient RθJA 62 °C/W 2
Soldering temperature Tsold 260 °C 2
Gate resistance Rg 3 Ω F=1MHz, open drain 3
Input capacitance Ciss 6345 pF VGS=0V, VDS=400V, f=250KHz 3
Output capacitance Coss 110 pF VGS=0V, VDS=400V, f=250KHz 3
Reverse transfer capacitance Crss 15 pF VGS=0V, VDS=400V, f=250KHz 3
Effective output capacitance, energy related Co(er) 225 pF VGS = 0V, VDS = 0V~400V 3
Effective output capacitance, time related Co(tr) 2435 pF 3
Turn-on delay time td(on) 46 ns VGS=15V, VDS=400V, ID=25A, RG=3Ω 3
Rise time tr 10 ns 3
Turn-off delay time td(off) 158 ns 3
Fall time tf 9 ns 3
Gate charge total Qg 146 nC VDS=400V, ID=25A, VGS=0~10V 3
Gate to drain charge Qgd 56 nC VDS=400V, ID=25A, VGS=0~10V 3
Gate to source charge Qgs 36 nC VDS=400V, ID=25A, VGS=0~10V 3
Gate plateau voltage Vplateau 5.9 V VDS=400V, ID=25A, VGS=0~10V 3
Diode forward voltage VSD 1.3 V VGS=0V, IF=25A, Tj=25°C 3
Reverse recovery time trr 148 ns 3
Reverse recovery charge Qrr 0.95 µC VR=400V, IF=25A, diF/dt=100A/µs 4
Peak reverse recovery current Irr 13 A VR=400V, IF=25A, diF/dt=100A/µs 4

CAD (KiCad official)

  • Symbol: GBS60037TOB
  • Footprint: Package_TO_SOT_THT:TO-247-3_Vertical
  • 3D model: TO-247 (KiCad packages3D, STEP)
  • 3D model files: gbs60037tob-etched.step / gbs60037tob-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gbs60037tob.step / gbs60037tob.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GOSEMICON datasheet (10 pp, sha256 ab538c9cad2c52c8, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus off (skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF