# GBLC08C

**MDD Microdiode Semiconductor** · ESD And Surge Protection (TVS/ESD) · SOD-323

GBLC08C from MDD Microdiode Semiconductor, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MDD Microdiode Semiconductor |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse working (stand-off) voltage | VRWM |  |  | 8 | V |  | 2 |
| Breakdown voltage | VB | 8.5 |  |  | V | IT = 1 mA | 2 |
| Clamping voltage @1A | VC@1A |  |  | 13.4 | V | 1 A | 2 |
| Clamping voltage | VC |  |  | 18.5 | V | 8 A | 2 |
| Reverse leakage current | IR |  |  | 1 | µA |  | 2 |
| Test current | IT |  |  | 1 | mA |  | 2 |
| Peak pulse power | PPP |  |  | 300 | W | tp=8/20us waveform | 1 |
| ESD per IEC 61000-4-2 (Air) | VESD | -30 |  | 30 | kV | TA=25°C | 1 |
| ESD per IEC 61000-4-2 (Contact) | VESD | -30 |  | 30 | kV | TA=25°C | 1 |
| Operating temperature | TOPT | -55 |  | 150 | °C |  | 1 |
| Storage temperature | TSTG | -55 |  | 150 | °C |  | 1 |
| Lead solder temperature maximum | TL |  |  | 260 | °C | 10 second duration | 1 |
| Junction capacitance | CT |  | 0.8 |  | pF |  | 2 |

## CAD (KiCad official)

- Symbol: `GBLC08C`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `gblc08c-etched.step` / `gblc08c-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `gblc08c.step` / `gblc08c.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MDD Microdiode Semiconductor datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757912253456887808) (4 pp, sha256 `3eef291afc368f01`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/gblc08c-datasheet.pdf)