component
GBI1631SMAR
Public Made by Adomby adom
GOSEMICON DC-DC Converters, SOP-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownGBI1631SMAR
GOSEMICON · DC-DC Converters · SOP-8
GBI1631SMAR from GOSEMICON, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BOOT | power_in | Power supply for the high-side power MOSFET gate driver. Requires a 0.1µF or larger ceramic bootstrap capacitor connected between BOOT and SW. BOOT-to-SW rated 0 to 6V. |
| 2 | VIN | power_in | Power supply input, 4.5V to 60V operating range (65V absolute max). Must be locally bypassed with a ceramic input capacitor. |
| 3 | EN | input | Enable logic input; floating enables the device. High-voltage tolerant up to VIN. Precision enable thresholds 1.21V rising / 1.05V falling allow programmable UVLO via an external resistor divider from VIN. |
| 4 | RT | input | Resistor-programmed switching-frequency timing pin. Connect a resistor to GND to set fSW between 200kHz and 2.5MHz (R=200kΩ → ~500kHz typical). |
| 5 | FB | input | Buck converter output feedback sensing input. Connect a resistor divider from VOUT to FB and from FB to GND; the device regulates FB to the internal 0.8V (±1%) reference. |
| 6 | PG/SS | output | On GBI1631 this pin is the Power-Good (PG) open-drain flag; pull up with a 10kΩ to 100kΩ resistor to a logic rail or DC voltage ≤7V. On GBI1630 the same pin is SS (soft-start), where a capacitor to GND programs the soft-start time. For the GBI1631SMAR variant this pin functions as PG. |
| 7 | GND | power_in | Device ground return. Tie to the ground pour along with the thermal pad. |
| 8 | SW | output | Switching node of the buck converter; connect to the external inductor and freewheeling Schottky diode. Rated -0.6V to 65V (transient -3V, 20ns). |
| 9 | EP | power_in | Exposed thermal pad on the bottom of the eSOP-8L package. Must be soldered to the PCB ground plane for proper thermal dissipation (RθJC_bot = 3.8 °C/W). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | GOSEMICON |
| Package | SOP-8 |
| Category | PMIC |
| Pins | 9 |
Ordering variants
Same part, different packaging or reel option.
GBI1631SMARGBI1630SMAR
CAD (KiCad official)
- Symbol:
GBI1631SMAR - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
gbi1631smar-etched.step/gbi1631smar-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);gbi1631smar.step/gbi1631smar.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: GOSEMICON datasheet (22 pp, sha256
d362a5d7ac69f60c, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).