# GBI1450SMAR

**GOSEMICON** · DC-DC Converters · ESOP-8

GBI1450SMAR from GOSEMICON, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BOOT | input | Supply for the high-side power MOSFET gate driver; a 0.1 uF or greater ceramic capacitor must be connected between BOOT and SW, with BOOT-to-SW recommended range 0 to 6 V and absolute maximum 6.5 V. |
| 2 | VIN | power_in | Power supply input with a recommended operating range of 4.0 V to 40 V; it must be locally bypassed. |
| 3 | EN | input | Enable logic input that supports voltages up to VIN, with thresholds of 1.21 V rising and 1.05 V falling; floating the pin enables the device and the hysteresis is set by an external resistor network. |
| 4 | RT | input | Switching frequency is set by a resistor from this pin to GND, which must not be left floating or shorted to GND; absolute maximum RT-to-GND voltage is 6.5 V. |
| 5 | FB | input | Output feedback sense input, regulated to the internal 0.8 V reference (0.79 V to 0.81 V); recommended range is 0 to 6 V, and it is connected to a resistor divider from VOUT to GND. |
| 6 | SS | input | Soft-start pin; a capacitor to GND sets the soft-start time, and with the pin floating the default soft-start time is typically 4.5 ms. |
| 7 | GND | power_in | Ground reference for the device. |
| 8 | SW | output | Switching node of the buck converter; absolute maximum range is -3 V to 42 V to GND. |
| 9 | Thermal Pad | power_in | Exposed thermal pad that must be grounded in the PCB layout. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | GOSEMICON |
| Package | ESOP-8 |
| Category | Power Management (PMIC) |
| Pins | 9 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating input voltage | VIN | 4 |  | 40 | V |  | 4 |
| Input UVLO VIN rising | VIN_UVLO |  | 3.6 | 3.8 | V | VIN rising | 4 |
| Shutdown current | ISHDN |  | 2 | 10 | uA | EN=0, No load, 4.0V≤VIN≤40V | 4 |
| Enable high threshold | VEN_H | 1.17 | 1.21 | 1.25 | V |  | 4 |
| Enable low threshold | VEN_L | 0.97 | 1.05 | 1.1 | V |  | 4 |
| Feedback Voltage | VFB | 0.79 | 0.8 | 0.81 | V |  | 4 |
| High side FET on-resistance | RDSON_H | 57 | 80 | 141 | mΩ |  | 4 |
| Switching frequency | fSW | 460 | 500 | 540 | KHz | RT=200k | 4 |
| Maximum duty cycle | DMAX |  |  | 95 | % | FSW=500kHz | 4 |
| Maximum switching frequency |  |  |  | 2.5 | MHz |  | 4 |
| Minimum on-time | tON_MIN | 100 |  |  | ns |  | 4 |
| HSD peak current limit | ILIM_HSD | 7.3 | 8 | 8.8 | A | VIN=24V | 5 |
| Input UVLO hysteresis |  |  | 350 |  | mV |  | 4 |
| Quiescent current | IQ |  | 100 |  | uA | EN=floating, No load, No switch, 4.0V≤VIN≤40V, BOOT-SW=5V | 4 |
| Soft start current | ISS |  | 4 |  | uA |  | 4 |
| Soft start time | TSS |  | 4.5 |  | ms | SS pin floating | 5 |
| Thermal shutdown threshold | TSD |  | 170 |  | °C |  | 5 |
| Thermal shutdown hysteresis |  |  | 30 |  | °C |  | 5 |
| Output over voltage protection rising | VOVP_H |  | 109 |  | % |  | 5 |
| Output over voltage protection falling | VOVP_L |  | 105 |  | % |  | 5 |
| Supply voltage range | VIN | 4 |  | 40 | V |  | 3 |
| BOOT to SW |  | 0 |  | 6 | V |  | 3 |
| FB |  | 0 |  | 6 | V |  | 3 |
| EN |  | 0 |  | 40 | V |  | 3 |
| Switching frequency range at RT mode | fSW | 200 |  | 2500 | kHz |  | 3 |
| Operating junction temperature | TJ | -40 |  | 125 | °C |  | 3 |
| Input voltage, VIN and EN to GND |  | -0.3 |  | 42 | V |  | 3 |
| FB to GND |  | -0.3 |  | 6.5 | V |  | 3 |
| SS to GND |  | -0.3 |  | 6.5 | V |  | 3 |
| RT to GND |  | -0.3 |  | 6.5 | V |  | 3 |
| SW to GND |  | -3 |  | 42 | V |  | 3 |
| BOOT to SW |  |  |  | 6.5 | V |  | 3 |
| Junction temperature | TJ | -40 |  | 150 | °C |  | 3 |
| Storage temperature | TSTG | -65 |  | 150 | °C |  | 3 |
| Junction to ambient thermal resistance | RθJA |  | 42.5 |  | °C/W |  | 4 |
| Junction to case (top) thermal resistance | RθJC_top |  | 56.1 |  | °C/W |  | 4 |
| Junction to case (bottom) thermal resistance | RθJC_bot |  | 3.8 |  | °C/W |  | 4 |
| Junction to board characterization parameter | ψJB |  | 25.4 |  | °C/W |  | 4 |
| Junction to top characterization parameter | ψJT |  | 5.8 |  | °C/W |  | 4 |

## CAD (KiCad official)

- Symbol: `GBI1450SMAR`
- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm`
- 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files: `gbi1450smar-etched.step` / `gbi1450smar-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `gbi1450smar.step` / `gbi1450smar.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [GOSEMICON datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8756313080924258304) (23 pp, sha256 `e2a30384aeaa767d`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/gbi1450smar-datasheet.pdf)