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GBI1430SMAR

Public Made by Adom

by adom

GOSEMICON DC-DC Converters, ESOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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GBI1430SMAR

GOSEMICON · DC-DC Converters · ESOP-8

GBI1430SMAR from GOSEMICON, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOT input Power supply for the high-side power MOSFET gate driver; a 0.1uF or greater ceramic capacitor must be connected between BOOT and SW, and the BOOT-to-SW rating is 6V recommended, 6.5V absolute maximum.
2 VIN power_in Power supply input for the device, operating from 4.0V to 40V, which must be locally bypassed.
3 EN input Enable logic input with precision thresholds of 1.21V rising and 1.05V falling; floating the pin enables the device, and it tolerates voltages up to VIN (40V max).
4 RT input Resistor timing pin that sets the switching frequency (200kHz to 2.5MHz) through a resistor to GND, and must not be left floating or shorted to GND.
5 FB input Feedback sense input that the regulator holds at the internal 0.8V reference (0.79V to 0.81V), with the output set by a resistor divider from VOUT to FB and FB to GND.
6 SS input Soft-start pin where a capacitor to GND sets the soft-start time, charged by a 4uA soft-start current.
7 GND power_in Ground reference for the device.
8 SW output Switching node of the buck converter, with absolute maximum rating of -3V to 42V to GND, requiring an external catch diode between SW and GND.
9 Thermal Pad power_in Exposed thermal pad that must be grounded in the PCB layout and connected to GND for thermal dissipation.

Key specifications

Parameter Value
Manufacturer GOSEMICON
Package ESOP-8
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage VIN, EN to GND -0.3 42 V 3
Input Voltage FB to GND -0.3 6.5 V 3
Input Voltage SS to GND -0.3 6.5 V 3
Input Voltage RT to GND -0.3 6.5 V 3
Output Voltage SW to GND -3 42 V 3
Output Voltage BOOT to SW 6.5 V 3
Junction temperature TJ -40 150 °C 3
Storage temperature TSTG -65 150 °C 3
ESD Human Body Model (HBM), all pins VESD -1500 1500 V Per ANSI-JEDEC-JS-001-2014, all pins 3
ESD Charged Device Model (CDM), all pins VESD -1000 1000 V Per ANSI-JEDEC-JS-002-2014, all pins 3
VIN Supply voltage range VIN 4 40 V 3
BOOT to SW 0 6 V 3
FB, PG 0 6 V 3
EN 0 40 V 3
Switching frequency range at RT mode fSW 200 2500 kHz 3
Operating junction temperature TJ -40 125 °C 3
Operating input voltage VIN 4 40 V 4
Input UVLO, VIN rising VIN_UVLO 3.6 3.8 V VIN rising 4
Shutdown current ISHDN 1 4 uA EN=0, No load, 4.0V≤VIN≤40V 4
Enable high threshold VEN_H 1.17 1.21 1.25 V 4
Feedback Voltage VFB 0.79 0.8 0.81 V 4
High side FET on-resistance RDSON_H 57 80 142 mΩ 4
Switching frequency fSW 460 500 540 KHz RT=200k 4
Maximum switching frequency 2.5 MHz 4
Maximum duty cycle DMAX 95 % fSW=500kHz 4
HSD peak current limit ILIM_HSD 4.5 5 5.5 A VIN=24V 4
Enable low threshold VEN_L 1.05 V 4
Input UVLO hysteresis 350 mV 4
Quiescent current IQ 100 uA EN=floating, No load, No switch, 4.0V≤VIN≤40V, BOOT-SW=5V 4
Minimum on-time tON_MIN 100 ns 4
Soft start current ISS 4 uA GBI1430 4
Thermal shutdown threshold 170 °C 5
Thermal shutdown hysteresis 30 °C 5
Output over voltage protection rising VOVP_H 109 % 5
Output over voltage protection falling VOVP_L 105 % 5
Output under voltage protection falling VUVP_L 90 % 5
Output under voltage protection rising VUVP_H 95 % 5
Junction to ambient thermal resistance (eSOP-8L) RθJA 42.5 °C/W 4
Junction to case (top) thermal resistance (eSOP-8L) RθJC_top 56.1 °C/W 4
Junction to case (bottom) thermal resistance (eSOP-8L) RθJC_bot 3.8 °C/W 4
Junction to board characterization parameter (eSOP-8L) ψJB 25.4 °C/W 4

CAD (KiCad official)

  • Symbol: GBI1430SMAR
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
  • 3D model: ESOP-8 (KiCad packages3D, STEP)
  • 3D model files: gbi1430smar-etched.step / gbi1430smar-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gbi1430smar.step / gbi1430smar.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GOSEMICON datasheet (20 pp, sha256 b17c71a306d2a873, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF