component
GAQY212E
Public Made by Adomby adom
SUPSiC Solid State Relays (MOS Output), DIP-4. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownGAQY212E
SUPSiC · Solid State Relays (MOS Output) · DIP-4
GAQY212E from SUPSiC, in a DIP-4. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | LED Anode | input | LED anode input; the recommended LED forward current is 5 mA to 30 mA, with 50 mA continuous and 1000 mA peak (100 Hz, 1% duty) as absolute maximum LED currents. |
| 2 | LED Cathode | input | LED cathode input; the LED reverse voltage rating is 5 V (absolute maximum). |
| 3 | Drain (MOS FET) | passive | MOSFET output terminal of the load circuit; load voltage is 60 V (AC peak or DC) and load current is 0.5 A continuous (1.5 A peak for 100 ms). |
| 4 | Drain (MOS FET) | passive | MOSFET output terminal of the load circuit; load voltage is 60 V (AC peak or DC) and load current is 0.5 A continuous (1.5 A peak for 100 ms). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | SUPSiC |
| Package | DIP-4 |
| Category | Optoisolators |
| Pins | 4 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Continuous LED Current | IF | 50 | mA | 2 | |||
| Peak LED Current | IFP | 1000 | mA | f=100Hz, duty=1% | 2 | ||
| LED Reverse Voltage | VR | 5 | V | 2 | |||
| Input Power Dissipation | PIn | 75 | mW | 2 | |||
| Load Voltage | VL | 60 | V | AC peak or DC | 2 | ||
| Load Current | IL | 0.5 | A | 2 | |||
| Peak Load Current | IPeak | 1.5 | A | 100ms (1 pulse) | 2 | ||
| Output Power Dissipation | Pout | 380 | mW | 2 | |||
| Total Power Dissipation | PT | 500 | mW | 2 | |||
| I/O Isolation Voltage | VI/O | 5000 | Vrms | RH=60%, 1min | 2 | ||
| Operating Temperature | Topr | -40 | 85 | ℃ | 2 | ||
| Storage Temperature | Tstg | -40 | 100 | ℃ | 2 | ||
| Pin Soldering Temperature | Tsol | 260 | ℃ | 10 sec max. | 2 | ||
| Forward current (recommended operating) | IF | 5 | 7 | 30 | mA | 6 | |
| I/O Capacitance | CI/O | 0.8 | 1.5 | pF | f=1MHz | 2 |
CAD (KiCad official)
- Symbol:
GAQY212E - Footprint:
Package_DIP:DIP-4_W7.62mm - 3D model: DIP-4 (KiCad packages3D, STEP)
- 3D model files:
gaqy212e-etched.step/gaqy212e-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);gaqy212e.step/gaqy212e.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: SUPSiC datasheet (7 pp, sha256
54a519c9201295d1, retrieved 2026-10-14, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).