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Contents

README

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GAQW212GE

SUPSiC · Solid State Relays (MOS Output) · DIP-8

GAQW212GE from SUPSiC, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 LED Anode (IF1) input Input LED anode for channel 1; recommended LED forward current is 5 mA to 30 mA (typical 7.0 mA) for proper operation and reset.
2 LED Cathode (IF1) passive Input LED cathode for channel 1, returned to the drive circuit; LED forward current must stay between 5 mA and 30 mA.
3 LED Anode (IF2) input Input LED anode for channel 2; recommended LED forward current is 5 mA to 30 mA (typical 7.0 mA) for proper operation and reset.
4 LED Cathode (IF2) passive Input LED cathode for channel 2; LED forward current must stay between 5 mA and 30 mA.
5 Drain (MOSFET, load 2) passive MOSFET drain of load channel 2 (VL2, AC or DC); the load voltage is rated 60 V (AC peak or DC) with load current up to 500 mA.
6 Drain (MOSFET, load 2) passive MOSFET drain of load channel 2 (VL2, AC or DC), paired with pin 5; rated 60 V (AC peak or DC) and 500 mA load current.
7 Drain (MOSFET, load 1) passive MOSFET drain of load channel 1 (VL1, AC or DC), paired with pin 8; rated 60 V (AC peak or DC) and 500 mA load current.
8 Drain (MOSFET, load 1) passive MOSFET drain of load channel 1 (VL1, AC or DC); the load voltage is rated 60 V (AC peak or DC) with load current up to 500 mA.

Key specifications

Parameter Value
Manufacturer SUPSiC
Package DIP-8
Category Optoisolators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward current (recommended LED input current) IF 5 7 30 mA 6
Load voltage VL 60 V 1
Load current IL 0.5 A 1
I/O isolation voltage V/IO 5000 Vrms 1

CAD (KiCad official)

  • Symbol: GAQW212GE
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: gaqw212ge-etched.step / gaqw212ge-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gaqw212ge.step / gaqw212ge.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SUPSiC datasheet (7 pp, sha256 c697f0f5f4010195, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF