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GAQW212G2E

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SUPSiC Solid State Relays (MOS Output), DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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GAQW212G2E

SUPSiC · Solid State Relays (MOS Output) · DIP-8

GAQW212G2E from SUPSiC, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 LED Anode (IF1) input Input LED anode; LED forward current should be kept between 5 mA and 30 mA (recommended IF ≥5 mA and ≤30 mA) for proper operation and reset.
2 LED Cathode (IF1) input Input LED cathode; drive the LED within the recommended 5 mA to 30 mA forward current range.
3 LED Anode (IF2) input Second input LED anode; LED forward current should be kept between 5 mA and 30 mA (recommended IF ≥5 mA and ≤30 mA).
4 LED Cathode (IF2) input Second input LED cathode; drive the LED within the recommended 5 mA to 30 mA forward current range.
5 Drain (MOS FET) passive Output MOSFET drain terminal for the load, rated for 60 V (AC peak or DC) and 2.0 A load current.
6 Drain (MOS FET) passive Output MOSFET drain terminal for the load, rated for 60 V (AC peak or DC) and 2.0 A load current.
7 Drain (MOS FET) passive Output MOSFET drain terminal for the load, rated for 60 V (AC peak or DC) and 2.0 A load current.
8 Drain (MOS FET) passive Output MOSFET drain terminal for the load, rated for 60 V (AC peak or DC) and 2.0 A load current.

Key specifications

Parameter Value
Manufacturer SUPSiC
Package DIP-8
Category Optoisolators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward current (recommended operating) IF 5 7 30 mA 6
I/O isolation voltage 5000 Vrms 2

CAD (KiCad official)

  • Symbol: GAQW212G2E
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: gaqw212g2e-etched.step / gaqw212g2e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gaqw212g2e.step / gaqw212g2e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SUPSiC datasheet (7 pp, sha256 44593079e2eb458a, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF