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Contents

README

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GAQW212G1E

SUPSiC · Solid State Relays (MOS Output) · DIP-8

GAQW212G1E from SUPSiC, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 LED Anode input Input LED anode (IF1); the recommended LED forward current is 5 mA to 30 mA, and the datasheet recommends a series resistor to set it.
2 LED Cathode input Input LED cathode (IF2); the recommended LED forward current is 5 mA to 30 mA, and the datasheet recommends a series resistor to set it.
3 LED Anode input Second input LED anode; the recommended LED forward current is 5 mA to 30 mA, and the datasheet recommends a series resistor to set it.
4 LED Cathode input Second input LED cathode; the recommended LED forward current is 5 mA to 30 mA, and the datasheet recommends a series resistor to set it.
5 Drain (MOS FET) passive MOSFET drain load terminal (VL2, AC or DC) rated for a load voltage of 60 V (AC peak or DC) and a load current of 1100 mA.
6 Drain (MOS FET) passive MOSFET drain load terminal (VL2, AC or DC) rated for a load voltage of 60 V (AC peak or DC) and a load current of 1100 mA.
7 Drain (MOS FET) passive MOSFET drain load terminal (VL1, AC or DC) rated for a load voltage of 60 V (AC peak or DC) and a load current of 1100 mA.
8 Drain (MOS FET) passive MOSFET drain load terminal (VL1, AC or DC) rated for a load voltage of 60 V (AC peak or DC) and a load current of 1100 mA.

Key specifications

Parameter Value
Manufacturer SUPSiC
Package DIP-8
Category Optoisolators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward current (recommended operating) IF 5 7 30 mA 6
Load voltage (output rating, GAQW212G1E) VL 60 V 1
Load current (output rating, GAQW212G1E) IL 1100 mA 1
I/O isolation voltage V/IO 5000 Vrms 1

CAD (KiCad official)

  • Symbol: GAQW212G1E
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: gaqw212g1e-etched.step / gaqw212g1e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gaqw212g1e.step / gaqw212g1e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SUPSiC datasheet (7 pp, sha256 1865f2cd2c0b1e01, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF