component
FUSB302BUCX
Public Made by Adomby adom
onsemi USB Converters, WLCSP-9(1.2x1.3). Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownFUSB302BUCX
onsemi · USB Converters · WLCSP-9(1.2x1.3)
FUSB302BUCX from onsemi, in a WLCSP-9(1.2x1.3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| A1 | CC2 | bidirectional | Type-C Configuration Channel pin for attach/detach detection, orientation determination, and BMC Power Delivery communication. |
| A2 | VBUS | power_in | VBUS input pin for attach and detach detection when operating as upstream-facing port; expects OVP-protected supply. |
| A3 | VDD | power_in | Power supply input; operating range 2.7 V to 5.5 V. |
| B1 | VCONN | power_in | Regulated power supply input to be switched to the appropriate CC pin for powering USB 3.1 full-featured cables and accessories. |
| B2 | INT_N | output | Active-LOW open-drain interrupt output used to prompt the processor to read I2C register bits. |
| B3 | SCL | input | I2C serial clock input signal to be connected to the processor's I2C master, supporting Fast Mode Plus up to 1 MHz. |
| C1 | CC1 | bidirectional | Type-C Configuration Channel pin for attach/detach detection, orientation determination, and BMC Power Delivery communication. |
| C2 | GND | power_in | Ground reference. |
| C3 | SDA | bidirectional | I2C serial data signal with open-drain output capability to be connected to the processor's I2C master; requires pull-up voltage between 1.71 V and VDD. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | WLCSP-9(1.2x1.3) |
| Category | Interface |
| Pins | 9 |
CAD (KiCad official)
- Symbol:
FUSB302BUCX - Footprint:
Package_CSP:WLCSP-9_1.21x1.22mm_Layout3x3_P0.4mm - 3D model: WLCSP-9(1.2x1.3) (KiCad packages3D, STEP)
- 3D model files:
fusb302bucx-etched.step/fusb302bucx-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fusb302bucx.step/fusb302bucx.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (33 pp, sha256
607504044edc608f, retrieved 2026-09-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-4-6(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).