# FSMD200-1206R

**Fuzetec Tech** · Resettable Fuses · 1206

FSMD200-1206R from Fuzetec Tech, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Fuzetec Tech |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Hold current (maximum current that will not trip at 23℃) | IH |  |  | 2 | A | 23℃ still air | 1 |
| Trip current (minimum current that will always trip at 23℃) | IT | 3.5 |  |  | A | 23℃ still air | 1 |
| Maximum voltage (withstand without damage at rated current) | VMAX |  |  | 6 | VDC | at rated current IMAX | 1 |
| Maximum fault current (withstand without damage at rated voltage) | IMAX |  |  | 100 | A | at rated voltage VMAX | 1 |
| Maximum time to trip |  |  |  | 1.5 | Sec | fault current 8.00 A | 1 |
| Minimum device resistance prior to tripping | RMIN | 0.018 |  |  | Ohms | 23℃ prior to tripping | 1 |
| Maximum device resistance after tripping or reflow | R1MAX |  |  | 0.08 | Ohms | 23℃, measured 1 hour after tripping or reflow soldering at 260℃ for 20 seconds | 1 |
| Operating temperature range |  | -40 |  | 85 | ℃ |  | 1 |
| Typical power dissipated in tripped state | Pd |  | 0.8 |  | W | tripped state, 23℃ still air | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | Terminal pad material: Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3 | 4 |

## CAD (KiCad official)

- Symbol: `FSMD200-1206R`
- Footprint: `Fuse:Fuse_1206_3216Metric`
- 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files: `fsmd200-1206r-etched.step` / `fsmd200-1206r-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `fsmd200-1206r.step` / `fsmd200-1206r.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Fuzetec Tech datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589837448911364096) (5 pp, sha256 `dc1b6b9faf83f016`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/fsmd200-1206r-datasheet.pdf)