# FSMD050-30-R

**Fuzetec Tech** · Resettable Fuses · 1812

FSMD050-30-R from Fuzetec Tech, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One terminal of the non-polarized PTC resettable fuse (pure tin pad), rated IH 0.50 A hold, IT 1.00 A trip, 30 VDC max, 100 A max fault current. |
| 2 | 2 | passive | Second terminal of the non-polarized PTC resettable fuse (pure tin pad), interchangeable with the other terminal and in series with the protected line. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Fuzetec Tech |
| Package | 1812 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum voltage device can withstand without damage at its rated current (rated voltage) | VMAX |  |  | 30 | VDC |  | 1 |
| Maximum fault current device can withstand without damage at rated voltage | IMAX |  |  | 100 | A | at rated voltage (VMAX) | 1 |
| Maximum time to trip |  |  |  | 8 | Sec | at 100 A fault current | 1 |
| Minimum device resistance prior to tripping | RMIN | 0.15 |  |  | Ohms | 23℃ prior to tripping | 1 |
| Maximum device resistance measured 1 hour after tripping or reflow soldering | R1MAX |  |  | 1 | Ohms | 23℃, 1 hour after tripping or reflow soldering of 260℃ for 20 seconds | 1 |
| Hold current (maximum current at which device will not trip) | IH |  | 0.5 |  | A | 23℃ still air | 1 |
| Trip current (minimum current at which device will always trip) | IT |  | 1 |  | A | 23℃ still air | 1 |
| Typical power dissipated in tripped state | Pd |  | 0.8 |  | W | tripped state, 23℃ still air | 1 |
| Operating temperature range |  | -40 |  | 85 | ℃ |  | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | Terminal pad material: Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3 | 4 |

## CAD (KiCad official)

- Symbol: `FSMD050-30-R`
- Footprint: `Fuse:Fuse_1812_4532Metric`
- 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal _1806_ height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `fsmd050-30-r-etched.step` / `fsmd050-30-r-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `fsmd050-30-r.step` / `fsmd050-30-r.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Fuzetec Tech datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588907660704436224) (6 pp, sha256 `bc3533160a6fe5e6`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/fsmd050-30-r-datasheet.pdf)