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FSMD010-0805-R
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Fuzetec Tech Resettable Fuses, 0805. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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FSMD010-0805-R
Fuzetec Tech · Resettable Fuses · 0805
FSMD010-0805-R from Fuzetec Tech, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | First terminal pad (pure tin) of the non-polarized PTC resettable fuse, rated IH 0.10 A hold, IT 0.30 A trip, VMAX 15 VDC at IMAX 100 A. |
| 2 | 2 | passive | Second terminal pad (pure tin) of the non-polarized PTC resettable fuse, rated IH 0.10 A hold, IT 0.30 A trip, VMAX 15 VDC at IMAX 100 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Fuzetec Tech |
| Package | 0805 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Trip current | IT | 0.3 | A | 23℃ still air | 1 | ||
| Hold current | IH | 0.1 | A | 23℃ still air | 1 | ||
| Minimum device resistance prior to tripping | RMIN | 0.7 | Ohm | 23℃, prior to tripping | 1 | ||
| Maximum device resistance 1 hour after tripping or reflow | R1MAX | 6 | Ohm | 23℃, 1 hour after tripping or reflow soldering of 260℃ for 20 seconds | 1 | ||
| Rated voltage (maximum withstand voltage) | VMAX | 15 | VDC | at rated current IMAX | 1 | ||
| Maximum fault current | IMAX | 100 | A | at rated voltage VMAX | 1 | ||
| Max time to trip (time) | 1.5 | Sec | at fault current 0.50 A | 1 | |||
| Typical power dissipated in tripped state | Pd | 0.5 | W | tripped state, 23℃ still air | 1 | ||
| Operating temperature range | -40 | 85 | ℃ | 1 | |||
| Storage environment temperature | 30 | ℃ | storage, <30℃ / 60%RH | 4 | |||
| Max recommended paste thickness | 0.25 | mm | nominal, recommended max | 4 | |||
| Average ramp-up rate (Tsmax to Tp) | 3 | ℃/second | Pb-free assembly | 4 | |||
| Ramp-down rate | 6 | ℃/second | Pb-free assembly | 4 | |||
| Time 25℃ to peak temperature | 8 | minutes | Pb-free assembly | 4 | |||
| Peak/classification temperature | Tp | 260 | ℃ | Pb-free reflow profile | 4 | ||
| Preheat temperature (Tsmin to Tsmax) | 150 | 200 | ℃ | Pb-free reflow preheat | 4 | ||
| Preheat time (tsmin to tsmax) | 60 | 180 | seconds | Pb-free reflow preheat | 4 | ||
| Time maintained above TL (217℃) | tL | 60 | 150 | seconds | Pb-free reflow, TL = 217℃ | 4 | |
| Time within 5℃ of actual peak | tp | 20 | 40 | seconds | Pb-free reflow, within 5℃ of actual peak | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminal pad material: Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3 | 3 |
CAD (KiCad official)
- Symbol:
FSMD010-0805-R - Footprint:
Fuse:Fuse_0805_2012Metric - 3D model: 0805 (KiCad packages3D, STEP)
- 3D model files:
fsmd010-0805-r-etched.step/fsmd010-0805-r-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fsmd010-0805-r.step/fsmd010-0805-r.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Fuzetec Tech datasheet (4 pp, sha256
30941948f2093aa9, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# FSMD010-0805-R
**Fuzetec Tech** · Resettable Fuses · 0805
FSMD010-0805-R from Fuzetec Tech, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | First terminal pad (pure tin) of the non-polarized PTC resettable fuse, rated IH 0.10 A hold, IT 0.30 A trip, VMAX 15 VDC at IMAX 100 A. |
| 2 | 2 | passive | Second terminal pad (pure tin) of the non-polarized PTC resettable fuse, rated IH 0.10 A hold, IT 0.30 A trip, VMAX 15 VDC at IMAX 100 A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Fuzetec Tech |
| Package | 0805 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Trip current | IT | 0.3 | | | A | 23℃ still air | 1 |
| Hold current | IH | | | 0.1 | A | 23℃ still air | 1 |
| Minimum device resistance prior to tripping | RMIN | 0.7 | | | Ohm | 23℃, prior to tripping | 1 |
| Maximum device resistance 1 hour after tripping or reflow | R1MAX | | | 6 | Ohm | 23℃, 1 hour after tripping or reflow soldering of 260℃ for 20 seconds | 1 |
| Rated voltage (maximum withstand voltage) | VMAX | | | 15 | VDC | at rated current IMAX | 1 |
| Maximum fault current | IMAX | | | 100 | A | at rated voltage VMAX | 1 |
| Max time to trip (time) | | | | 1.5 | Sec | at fault current 0.50 A | 1 |
| Typical power dissipated in tripped state | Pd | | 0.5 | | W | tripped state, 23℃ still air | 1 |
| Operating temperature range | | -40 | | 85 | ℃ | | 1 |
| Storage environment temperature | | | | 30 | ℃ | storage, <30℃ / 60%RH | 4 |
| Max recommended paste thickness | | | | 0.25 | mm | nominal, recommended max | 4 |
| Average ramp-up rate (Tsmax to Tp) | | | | 3 | ℃/second | Pb-free assembly | 4 |
| Ramp-down rate | | | | 6 | ℃/second | Pb-free assembly | 4 |
| Time 25℃ to peak temperature | | | | 8 | minutes | Pb-free assembly | 4 |
| Peak/classification temperature | Tp | | | 260 | ℃ | Pb-free reflow profile | 4 |
| Preheat temperature (Tsmin to Tsmax) | | 150 | | 200 | ℃ | Pb-free reflow preheat | 4 |
| Preheat time (tsmin to tsmax) | | 60 | | 180 | seconds | Pb-free reflow preheat | 4 |
| Time maintained above TL (217℃) | tL | 60 | | 150 | seconds | Pb-free reflow, TL = 217℃ | 4 |
| Time within 5℃ of actual peak | tp | 20 | | 40 | seconds | Pb-free reflow, within 5℃ of actual peak | 4 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | Terminal pad material: Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3 | 3 |
## CAD (KiCad official)
- Symbol: `FSMD010-0805-R`
- Footprint: `Fuse:Fuse_0805_2012Metric`
- 3D model: 0805 (KiCad packages3D, STEP)
- 3D model files: `fsmd010-0805-r-etched.step` / `fsmd010-0805-r-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `fsmd010-0805-r.step` / `fsmd010-0805-r.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Fuzetec Tech datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8602721725482217472) (4 pp, sha256 `30941948f2093aa9`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/fsmd010-0805-r-datasheet.pdf)