# FS2312

**FUXINSEMI** · MOSFETs · SOT-23(TO-236)

FS2312 from FUXINSEMI, in a SOT-23(TO-236). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limited to ±10 V, with threshold VGS(th) 0.45 V min to 1.0 V max at ID=250µA. |
| 2 | S | passive | Source; continuous drain current 6.8 A and pulsed 27 A, body diode forward current IS 6.8 A. |
| 3 | D | passive | Drain; drain-source voltage rated 20 V, continuous drain current 6.8 A, RDS(on) max 18 mΩ at VGS=4.5 V. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | FUXINSEMI |
| Package | SOT-23(TO-236) |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source breakdown voltage | V(BR)DSS | 20 |  |  | V | VGS = 0V, ID =250µA | 2 |
| Gate threshold voltage | VGS(th) | 0.45 |  | 1 | V | VDS =VGS, ID =250µA | 2 |
| Zero gate voltage drain current | IDSS |  |  | 1 | µA | VDS =20V,VGS = 0V | 2 |
| Gate-body leakage current | IGSS | -100 |  | 100 | nA | VGS =±10V, VDS = 0V | 2 |
| Drain-source on-resistance | RDS(on) |  |  | 18 | mΩ | VGS =4.5V, ID =6.8A | 2 |
| Drain-source on-resistance | RDS(on) |  |  | 22 | mΩ | VGS =2.5V, ID =3.0A | 2 |
| Drain-source on-resistance | RDS(on) |  |  | 39 | mΩ | VGS =1.8V, ID =2.5A | 2 |
| Diode Forward Current | IS |  |  | 6.8 | A |  | 2 |
| Diode Forward voltage (printed symbol VDS) | VDS |  |  | 1.2 | V | VGS =0V, IS=6.8A | 2 |
| Drain-Source Voltage | VDS |  |  | 20 | V |  | 2 |
| Gate-Source Voltage | VGS | -10 |  | 10 | V |  | 2 |
| Continuous Drain Current | ID |  |  | 6.8 | A |  | 2 |
| Pulsed Drain Current | IDM |  |  | 27 | A |  | 2 |
| Power Dissipation | PD |  |  | 1.2 | W |  | 2 |
| Junction Temperature | TJ |  |  | 150 | ℃ |  | 2 |
| Storage Temperature | TSTG | -55 |  | 150 | ℃ |  | 2 |

## CAD (KiCad official)

- Symbol: `FS2312`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23(TO-236) (KiCad packages3D, STEP)
- 3D model files: `fs2312-etched.step` / `fs2312-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `fs2312.step` / `fs2312.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [FUXINSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588918668134920192) (4 pp, sha256 `4d87bd975df379b0`, retrieved 2026-10-13, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/fs2312-datasheet.pdf)