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Contents

README

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FQD50N06-HXY

HXY MOSFET · MOSFETs · TO-252-2L

FQD50N06-HXY from HXY MOSFET, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal of the N-channel MOSFET; the datasheet rates VGS at ±20 V maximum.
2 D passive Drain terminal; rated VDS 60 V and continuous ID 50 A at TC=25℃ (VGS @ 10V), and it is the tab connected to the drain.
3 S passive Source terminal; the datasheet gives a continuous source current IS of 35 A and a pulsed source current ISM of 80 A for the body diode.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package TO-252-2L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 60 V VGS=0V, ID=250uA 2
Static Drain-Source On-Resistance RDS(ON) 11 15 mΩ VGS=10V, ID=20A 2
Static Drain-Source On-Resistance RDS(ON) 15 20 mΩ VGS=4.5V, ID=10A 2
Gate Threshold Voltage VGS(th) 1.2 2.5 V VGS=VDS, ID=250uA 2
Drain-Source Leakage Current IDSS 1 uA VDS=48V, VGS=0V, TJ=25℃ 2
Drain-Source Leakage Current IDSS 5 uA VDS=48V, VGS=0V, TJ=55℃ 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Continuous Source Current IS 35 A VG=VD=0V, Force Current 2
Pulsed Source Current ISM 80 A 2
Diode Forward Voltage VSD 1 V VGS=0V, IS=A, TJ=25℃ 2
Drain-Source Voltage VDS 60 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID@TC=25℃ 50 A VGS @ 10V 1
Continuous Drain Current ID@TC=100℃ 25 A VGS @ 10V 1
Continuous Drain Current ID@TA=25℃ 7.4 A VGS @ 10V 1
Continuous Drain Current ID@TA=70℃ 6 A VGS @ 10V 1
Pulsed Drain Current IDM 90 A 1
Single Pulse Avalanche Energy EAS 39.2 mJ 1
Avalanche Current IAS 28 A 1
Total Power Dissipation PD@TC=25℃ 45 W 1
Total Power Dissipation PD@TA=25℃ 2 W 1
Storage Temperature Range TSTG -55 150 ℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Thermal Resistance Junction-Ambient RθJA 62 ℃/W 1
Thermal Resistance Junction-Case RθJC 2.8 ℃/W 2

CAD (KiCad official)

  • Symbol: FQD50N06-HXY
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2L (KiCad packages3D, STEP)
  • 3D model files: fqd50n06-hxy-etched.step / fqd50n06-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fqd50n06-hxy.step / fqd50n06-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (6 pp, sha256 c8ee349b75b424f7, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF