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FP8102XR-G1

Public Made by Adom

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Advanced Analog Technology Battery Management, SOIC-8-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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FP8102XR-G1

Advanced Analog Technology · Battery Management · SOIC-8-EP

FP8102XR-G1 from Advanced Analog Technology, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 TEMP input Battery temperature detector: charging stops when the TEMP voltage rises above 80% of Vcc or falls below 45% of Vcc, and the pin should be shorted to GND if battery temperature monitoring is not used.
2 PROG input Charge current setting and monitor: a single resistor from PROG to ground sets the charge current (battery current is 1200 times the PROG pin current), with PROG pin current rated at 1.2 mA maximum.
3 GND power_in IC ground.
4 Vcc power_in Supply voltage: recommended 4.35 V to 5.5 V, absolute maximum -0.3 V to 6 V.
5 BAT power_in Battery voltage connection to the single-cell Li-ion battery, which receives the charge current; BAT pin current is rated at 1.2 A maximum.
6 STDBY output Charge state indicator 2 (green): pulled low during charge termination and held in strong pull-low state in standby, with output low voltage of 0.6 V maximum at 5 mA.
7 CHRG output Charge state indicator 1 (red): pulled low (strong pull-down) during charging and recharge cycles, with output low voltage of 0.6 V maximum at 5 mA.
8 EN input Enable control: pulling EN to a low level puts the FP8102 into shutdown mode, reducing battery drain current to about 2 uA.
9 EP power_in Exposed pad: must be connected to ground.

Key specifications

Parameter Value
Manufacturer Advanced Analog Technology
Package SOIC-8-EP
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage Vcc -0.3 6 V 6
All Other Pins Voltage -0.3 6 V 6
Storage Temperature TS -65 150 ℃ 6
Operating Temperature -40 85 ℃ 6
Supply Voltage Vcc 4.35 5.5 V 7
Operating Temperature Ambient Temperature -40 85 °C 7
CV Output (Float) Voltage VFLOAT 4.158 4.2 4.242 V 0°C<TA<85°C 7
BAT Pin Current IBAT 540 600 660 mA RPROG=2K 7
BAT Pin Current IBAT 900 1000 1100 mA RPROG=1.2K 7
BAT Pin Current in Standby Mode IBAT 0 -2.5 -6 µA Standby-Mode, VBAT=4.2V 7
BAT Pin Current in Shutdown Mode (±1 value) IBAT -1 1 µA Shutdown-Mode 7
BAT Pin Current in Shutdown Mode (±2 value) IBAT -2 2 µA Shutdown-Mode 7
BAT Pin Current in Sleep Mode IBAT -1 -2 µA Sleep-Mode, Vcc=0V 7
Trickle Charge Current ITRIKL 30 60 85 mA VBAT< VTRIKL ,RPROG=2K 7
Trickle Charge Threshold Voltage VTRIKL 2.8 2.9 3 V RPROG=2K, VBAT Rising 7
Vcc Under Voltage Lockout Threshold VUV 3.5 3.7 3.9 V Vcc Rising 7
PROG Pin Voltage VPROG 0.9 1 1.1 V RPROG=1.2K, Current Mode 7
CHRGB Pin Output Low Voltage VCHRG 0.3 0.6 V ICHRG=5mA 7
STDBYB Pin Output Low Voltage VSTDBY 0.3 0.6 V ISTDBY=5mA 7
Recharge Comparator Filter Time TRECHRG 0.8 1.8 4 mS VBAT High to Low 7
C/10 Termination Comparator Filter Time TTERM 0.8 1.8 4 mS IBAT Falling below ITERM 7
BAT Pin Current IBAT 1.2 A 6
PROG Pin Current IPROG 1.2 mA 6
Junction Temperature TJ 150 °C 6
Lead Temperature (Soldering) 260 ℃ Soldering, 10 Sec 6
Standby Current ISB 55 µA Charge Termination 7
Shutdown Supply Current IST 55 µA Vcc< VBAT , Vcc< VUVLO; RPROG not connect 7
Vcc Under Voltage Lockout Threshold Hysteresis VUVHYS 500 mV 7
Trickle Charge Hysteresis Voltage VTRKHYS 200 mV RPROG=2K 7
Vcc-VBAT Lockout Threshold (Vcc Rising) VASD 100 mV Vcc Rising 7
Vcc-VBAT Lockout Threshold (Vcc Falling) VASD 10 mV Vcc Falling 7
PMOSFET On Resistance RON 650 mΩ 7
C/10 Termination Current Threshold ITERM 60 mA RPROG=2K 7
C/10 Termination Current Threshold ITERM 100 mA RPROG=1.2K 7
Battery Recharge Threshold Voltage VRECHRG 150 mV VFLOAT-VRECHRG 7
Temperature Limiting TLIM 145 °C 7
TEMP Pin High Threshold Voltage VTEMP-H 80 %Vcc 7
TEMP Pin Low Threshold Voltage VTEMP-L 45 %Vcc 7
Soft-Start Time TSS 20 µs IBAT=0 to IBAT=1200V/RPROG 7
PROG Pin Pull-up Current IPROG 2 µA 7
Thermal Resistance Junction-to-Ambient, SOP-8L(EP) θJA 60 ℃ / W 6
Thermal Resistance Junction-to-Case θJC 10 ℃ / W 6

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper IC is from the die through the package leads(especially the ground lead) to the PC board copper. The 16

CAD (KiCad official)

  • Symbol: FP8102XR-G1
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOIC-8-EP (KiCad packages3D, STEP)
  • 3D model files: fp8102xr-g1-etched.step / fp8102xr-g1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fp8102xr-g1.step / fp8102xr-g1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Advanced Analog Technology datasheet (19 pp, sha256 0b6ba8d1e6ca3bb2, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF