# FP6276BXR-G1

**Advanced Analog Technology** · DC-DC Converters · SOP-8-EP

FP6276BXR-G1 from Advanced Analog Technology, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | LX | power_out | Power switch output. Internal drain of the low-side NMOS and source of the high-side PMOS; connect to the boost inductor. Absolute max 6V. |
| 2 | LX | power_out | Power switch output. Second LX pin, tied internally to pin 1. Connect to the boost inductor switching node. |
| 3 | VIN | power_in | IC power supply input. Operating range 2.4V-4.5V (abs max 6V). Decouple locally to GND. |
| 4 | EN | input | Enable control, active high. VEN >= 0.96V enables the converter; VEN <= 0.6V shuts it down (shutdown current <1μA). Abs max 6V. |
| 5 | GND | power_in | IC signal ground. Reference for the internal analog circuitry. Must be tied to the exposed pad (PGND) at the device. |
| 6 | FB | input | Error amplifier inverting input. Connect to the mid-point of the VOUT feedback divider; regulated to VREF = 0.6V (±2%). Abs max 6V. |
| 7 | OC | input | Adjustable current-limit programming pin (floating available). A resistor to GND sets the internal switch current limit (default typ. 6A); leave floating to use the internal default. Abs max 6V. |
| 8 | VO | power_in | Output voltage sense pin. Connect to the boost output rail; used internally to power the high-side driver bulk-well switch via a VO/VIN MUX. Abs max 6V. |
| EP | PGND | power_in | Exposed thermal pad and IC power ground. Must be soldered to the PCB ground plane and connected to GND (pin 5) for proper operation and heat dissipation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Advanced Analog Technology |
| Package | SOP-8-EP |
| Category | PMIC |
| Pins | 9 |

## Ordering variants

Same part, different packaging or reel option.

- `FP6276BXR-G1`

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage | VIN | 2.4 |  | 4.5 | V |  | 5 |
| Feedback Voltage | VREF | 0.588 | 0.6 | 0.612 | V | VIN=4.5V | 5 |
| Supply Voltage | VIN | 2.4 |  | 4.5 | V |  | 5 |
| Operating Temperature Range | TA | -40 |  | 85 | °C | Ambient Temperature | 5 |
| Operating Temperature | TOP | -40 |  | 85 | °C |  | 4 |
| Supply Voltage | VIN | 0 |  | 6 | V |  | 4 |
| LX Voltage | VLX | 0 |  | 6 | V |  | 4 |
| EN,FB,OC,VO Voltage |  | 0 |  | 6 | V |  | 4 |
| Storage Temperature | TST | -65 |  | 150 | °C |  | 4 |
| Quiescent Current | ICC |  | 280 |  | µA | VFB =0.65V, No switching | 5 |
| Average Supply Current | ICC |  | 3.6 |  | mA | VFB=0.55V, Switching | 5 |
| Shutdown Current | ICC |  | 0.1 |  | µA | VEN=GND | 5 |
| Under Voltage Lockout | VUVLO |  | 2.1 |  | V |  | 5 |
| UVLO Hysteresis |  |  | 0.1 |  | V |  | 5 |
| Linear Charge Current | ICHARGE |  | 3 |  | A | VOUT<VIN | 5 |
| Operation Frequency | fOSC |  | 500 |  | kHz | VFB=0.55V | 5 |
| Maximum Duty Ratio |  |  | 90 |  | % |  | 5 |
| Enable Voltage | VEN |  | 0.96 |  | V |  | 5 |
| Shutdown Voltage | VEN |  | 0.6 |  | V |  | 5 |
| Soft-Start Time | tSS |  | 7 |  | ms | VIN=4.5V | 5 |
| High Side Switch RDS(ON) | RON-PMOS |  | 40 |  | mΩ |  | 5 |
| Low Side Switch RDS(ON) | RON-NMOS |  | 40 |  | mΩ |  | 5 |
| Internal Switch Current Limit | IOCP |  | 6 |  | A |  | 5 |
| Thermal Shutdown Threshold | TOTP |  | 150 |  | ℃ |  | 5 |
| Thermal Shutdown Hysteresis |  |  | 30 |  | ℃ |  | 5 |
| Thermal Resistance (Note1), SOP-8L(EP) | θJA |  | 60 |  | °C / W | Natural convection, TA=25°C, JEDEC 51-3 low effective thermal conductivity board | 4 |
| Junction Temperature | TJ |  | 150 |  | °C |  | 4 |
| Lead Temperature (soldering, 10 sec) |  |  | 260 |  | °C | soldering, 10 sec | 4 |

## CAD (KiCad official)

- Symbol: `FP6276BXR-G1`
- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm`
- 3D model: SOP-8-EP (KiCad packages3D, STEP)
- 3D model files: `fp6276bxr-g1-etched.step` / `fp6276bxr-g1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `fp6276bxr-g1.step` / `fp6276bxr-g1.glb` are the bare package body.

## 3D model downloads

Two STEP files. Same geometry, different body top:

| File | Size | Use it when |
|---|---|---|
| [`fp6276bxr-g1.step`](fp6276bxr-g1.step) | 193 KB | You want the bare part, or you mark your own boards. |
| [`fp6276bxr-g1-etched.step`](fp6276bxr-g1-etched.step) | 2.0 MB | You want the part with `FP6276BXR-G1` already on it. |

The marking in the etched file is real recessed geometry cut into the solid, not a
texture or a decal: 507 faces against 63 in the bare model. It
survives export, section views, and rendering in any CAD tool, and it drops straight
into KiCad or Fusion with no extra setup.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Advanced Analog Technology datasheet](docs/fp6276bxr-g1-datasheet.pdf) (12 pp, sha256 `f46290e35f85966e`, retrieved 2026-08-17, tier: lcsc)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/fp6276bxr-g1-datasheet.pdf)