component
FMF25FPKR008-LH
Public Made by Adomby adom
PSA Prosperity Dielectrics Current Sense Resistors / Shunt Resistors, 2512. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
main
Ray
Publish 0.1.0
90ed9e0
FMF25FPKR008-LH
PSA Prosperity Dielectrics · Current Sense Resistors / Shunt Resistors · 2512
FMF25FPKR008-LH from PSA Prosperity Dielectrics, in a 2512. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised resistor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised resistor; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | PSA Prosperity Dielectrics |
| Package | 2512 |
| Category | Resistors |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Resistance (nominal, R008 = 8 mΩ) | 8 | mΩ | MPN suffix R008 | 5 | |||
| Resistance tolerance (F = ±1%) | -1 | 1 | % | Tolerance code F, from part-numbering table | 5 | ||
| Temperature coefficient of resistance (standard LH, 8 mΩ in 5-100 mΩ range) | -70 | 70 | ppm/°C | FMF25 2512, 2 W row, ±70 ppm/°C for 5-100 mΩ; TCR per IEC 60115-1 4.8, 25 to -55 °C and 25 to +155 °C | 4 | ||
| Max working voltage | 447 | mV | FMF25 2512, 2 W rating; E = P×R or max working voltage, whichever is lower | 4 | |||
| Max overload voltage | 1000 | mV | FMF25 2512, 2 W rating | 4 | |||
| Operating temperature range | -55 | 170 | °C | 4 | |||
| Storage temperature | 5 | 40 | °C | Storage | 9 | ||
| Storage relative humidity | 20 | 70 | % RH | Storage | 9 | ||
| Insulation resistance | 1000 | MΩ | Between termination and coating; test voltage 100±15 V; IEC 60115-1 4.6 | 8 | |||
| Board surface temperature at rated power | 105 | °C | Solder pad and trace >300 mm²; rated power applied | 5 | |||
| High temperature exposure ΔR (F, percent part) | -1 | 1 | % | 1000 h at 125 °C, unpowered; measured after 24±2 h | 6 | ||
| High temperature exposure ΔR (F, absolute part) | -0.5 | 0.5 | mΩ | 1000 h at 125 °C, unpowered; measured after 24±2 h | 6 | ||
| Temperature cycling ΔR (F, percent part) | -0.5 | 0.5 | % | 1000 cycles, -55 to +125 °C | 6 | ||
| Temperature cycling ΔR (F, absolute part) | -1 | 1 | mΩ | 1000 cycles, -55 to +125 °C | 6 | ||
| Moisture resistance ΔR (F, percent part) | -0.5 | 0.5 | % | 65 °C/80-100% RH, 10 cycles (24 h/cycle) | 6 | ||
| Moisture resistance ΔR (F, absolute part) | -0.5 | 0.5 | mΩ | 65 °C/80-100% RH, 10 cycles (24 h/cycle) | 6 | ||
| Biased humidity ΔR (F, percent part) | -1 | 1 | % | 1000 h at 85 °C/85% RH, 10% of operating power | 7 | ||
| Biased humidity ΔR (F, absolute part) | -0.5 | 0.5 | mΩ | 1000 h at 85 °C/85% RH, 10% of operating power | 7 | ||
| Operational life ΔR (F, percent part) | -1 | 1 | % | 1000 h at 125 °C, specified rated power | 7 | ||
| Operational life ΔR (F, absolute part) | -0.5 | 0.5 | mΩ | 1000 h at 125 °C, specified rated power | 7 | ||
| Resistance to solder heat ΔR (F, percent part) | -0.5 | 0.5 | % | Solder dip 270±5 °C, 10±1 s | 7 | ||
| Resistance to solder heat ΔR (F, absolute part) | -0.5 | 0.5 | mΩ | Solder dip 270±5 °C, 10±1 s | 7 | ||
| Thermal shock ΔR (F, percent part) | -0.5 | 0.5 | % | -55 to 155 °C, 300 cycles, 15 min dwell | 7 | ||
| Thermal shock ΔR (F, absolute part) | -0.5 | 0.5 | mΩ | -55 to 155 °C, 300 cycles, 15 min dwell | 7 | ||
| Board flex ΔR (F, percent part) | -0.5 | 0.5 | % | Bending 2 mm for 2512 size | 8 | ||
| Board flex ΔR (F, absolute part) | -1 | 1 | mΩ | Bending 2 mm for 2512 size | 8 | ||
| Short time overload ΔR (F, percent part) | -1 | 1 | % | 5 × rated power for 5 s; IEC 60115-1 4.13 | 8 | ||
| Short time overload ΔR (F, absolute part) | -0.5 | 0.5 | mΩ | 5 × rated power for 5 s; IEC 60115-1 4.13 | 8 | ||
| Load life in humidity ΔR (F, percent part) | -1 | 1 | % | 40±2 °C, 90-95% RH, DC rated voltage, 1.5 h ON/30 min OFF, 1000 h; IEC 60115-1 4.24 | 8 | ||
| Load life in humidity ΔR (F, absolute part) | -0.5 | 0.5 | mΩ | 40±2 °C, 90-95% RH, DC rated voltage, 1.5 h ON/30 min OFF, 1000 h; IEC 60115-1 4.24 | 8 | ||
| Load life ΔR (F, percent part) | -1 | 1 | % | Rated voltage 1.5 h then 0.5 h pause at 70±2 °C, 1000 h; IEC 60115-1 4.25 | 8 | ||
| Load life ΔR (F, absolute part) | -0.5 | 0.5 | mΩ | Rated voltage 1.5 h then 0.5 h pause at 70±2 °C, 1000 h; IEC 60115-1 4.25 | 8 | ||
| ESD ΔR (percent part) | -1 | 1 | % | AEC-Q200-002, contact discharge min. 1 kV | 7 | ||
| ESD ΔR (absolute part) | -0.5 | 0.5 | mΩ | AEC-Q200-002, contact discharge min. 1 kV | 7 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | Item Protective Molding Resistive Element Internal Terminal External Terminal Material Resin Alloy Metal Copper Solder | 3 |
CAD (KiCad official)
- Symbol:
FMF25FPKR008-LH - Footprint:
Resistor_SMD:R_2512_6332Metric - 3D model: 2512 (KiCad packages3D, STEP)
- 3D model files:
fmf25fpkr008-lh-etched.step/fmf25fpkr008-lh-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fmf25fpkr008-lh.step/fmf25fpkr008-lh.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: PSA Prosperity Dielectrics datasheet (10 pp, sha256
1d15e82c90ee2489, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# FMF25FPKR008-LH
**PSA Prosperity Dielectrics** · Current Sense Resistors / Shunt Resistors · 2512
FMF25FPKR008-LH from PSA Prosperity Dielectrics, in a 2512. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised resistor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised resistor; either orientation. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | PSA Prosperity Dielectrics |
| Package | 2512 |
| Category | Resistors |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Resistance (nominal, R008 = 8 mΩ) | | | 8 | | mΩ | MPN suffix R008 | 5 |
| Resistance tolerance (F = ±1%) | | -1 | | 1 | % | Tolerance code F, from part-numbering table | 5 |
| Temperature coefficient of resistance (standard LH, 8 mΩ in 5-100 mΩ range) | | -70 | | 70 | ppm/°C | FMF25 2512, 2 W row, ±70 ppm/°C for 5-100 mΩ; TCR per IEC 60115-1 4.8, 25 to -55 °C and 25 to +155 °C | 4 |
| Max working voltage | | | | 447 | mV | FMF25 2512, 2 W rating; E = P×R or max working voltage, whichever is lower | 4 |
| Max overload voltage | | | | 1000 | mV | FMF25 2512, 2 W rating | 4 |
| Operating temperature range | | -55 | | 170 | °C | | 4 |
| Storage temperature | | 5 | | 40 | °C | Storage | 9 |
| Storage relative humidity | | 20 | | 70 | % RH | Storage | 9 |
| Insulation resistance | | 1000 | | | MΩ | Between termination and coating; test voltage 100±15 V; IEC 60115-1 4.6 | 8 |
| Board surface temperature at rated power | | | | 105 | °C | Solder pad and trace >300 mm²; rated power applied | 5 |
| High temperature exposure ΔR (F, percent part) | | -1 | | 1 | % | 1000 h at 125 °C, unpowered; measured after 24±2 h | 6 |
| High temperature exposure ΔR (F, absolute part) | | -0.5 | | 0.5 | mΩ | 1000 h at 125 °C, unpowered; measured after 24±2 h | 6 |
| Temperature cycling ΔR (F, percent part) | | -0.5 | | 0.5 | % | 1000 cycles, -55 to +125 °C | 6 |
| Temperature cycling ΔR (F, absolute part) | | -1 | | 1 | mΩ | 1000 cycles, -55 to +125 °C | 6 |
| Moisture resistance ΔR (F, percent part) | | -0.5 | | 0.5 | % | 65 °C/80-100% RH, 10 cycles (24 h/cycle) | 6 |
| Moisture resistance ΔR (F, absolute part) | | -0.5 | | 0.5 | mΩ | 65 °C/80-100% RH, 10 cycles (24 h/cycle) | 6 |
| Biased humidity ΔR (F, percent part) | | -1 | | 1 | % | 1000 h at 85 °C/85% RH, 10% of operating power | 7 |
| Biased humidity ΔR (F, absolute part) | | -0.5 | | 0.5 | mΩ | 1000 h at 85 °C/85% RH, 10% of operating power | 7 |
| Operational life ΔR (F, percent part) | | -1 | | 1 | % | 1000 h at 125 °C, specified rated power | 7 |
| Operational life ΔR (F, absolute part) | | -0.5 | | 0.5 | mΩ | 1000 h at 125 °C, specified rated power | 7 |
| Resistance to solder heat ΔR (F, percent part) | | -0.5 | | 0.5 | % | Solder dip 270±5 °C, 10±1 s | 7 |
| Resistance to solder heat ΔR (F, absolute part) | | -0.5 | | 0.5 | mΩ | Solder dip 270±5 °C, 10±1 s | 7 |
| Thermal shock ΔR (F, percent part) | | -0.5 | | 0.5 | % | -55 to 155 °C, 300 cycles, 15 min dwell | 7 |
| Thermal shock ΔR (F, absolute part) | | -0.5 | | 0.5 | mΩ | -55 to 155 °C, 300 cycles, 15 min dwell | 7 |
| Board flex ΔR (F, percent part) | | -0.5 | | 0.5 | % | Bending 2 mm for 2512 size | 8 |
| Board flex ΔR (F, absolute part) | | -1 | | 1 | mΩ | Bending 2 mm for 2512 size | 8 |
| Short time overload ΔR (F, percent part) | | -1 | | 1 | % | 5 × rated power for 5 s; IEC 60115-1 4.13 | 8 |
| Short time overload ΔR (F, absolute part) | | -0.5 | | 0.5 | mΩ | 5 × rated power for 5 s; IEC 60115-1 4.13 | 8 |
| Load life in humidity ΔR (F, percent part) | | -1 | | 1 | % | 40±2 °C, 90-95% RH, DC rated voltage, 1.5 h ON/30 min OFF, 1000 h; IEC 60115-1 4.24 | 8 |
| Load life in humidity ΔR (F, absolute part) | | -0.5 | | 0.5 | mΩ | 40±2 °C, 90-95% RH, DC rated voltage, 1.5 h ON/30 min OFF, 1000 h; IEC 60115-1 4.24 | 8 |
| Load life ΔR (F, percent part) | | -1 | | 1 | % | Rated voltage 1.5 h then 0.5 h pause at 70±2 °C, 1000 h; IEC 60115-1 4.25 | 8 |
| Load life ΔR (F, absolute part) | | -0.5 | | 0.5 | mΩ | Rated voltage 1.5 h then 0.5 h pause at 70±2 °C, 1000 h; IEC 60115-1 4.25 | 8 |
| ESD ΔR (percent part) | | -1 | | 1 | % | AEC-Q200-002, contact discharge min. 1 kV | 7 |
| ESD ΔR (absolute part) | | -0.5 | | 0.5 | mΩ | AEC-Q200-002, contact discharge min. 1 kV | 7 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | | Item Protective Molding Resistive Element Internal Terminal External Terminal Material Resin Alloy Metal Copper Solder | 3 |
## CAD (KiCad official)
- Symbol: `FMF25FPKR008-LH`
- Footprint: `Resistor_SMD:R_2512_6332Metric`
- 3D model: 2512 (KiCad packages3D, STEP)
- 3D model files: `fmf25fpkr008-lh-etched.step` / `fmf25fpkr008-lh-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `fmf25fpkr008-lh.step` / `fmf25fpkr008-lh.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [PSA Prosperity Dielectrics datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603177178410733568) (10 pp, sha256 `1d15e82c90ee2489`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/fmf25fpkr008-lh-datasheet.pdf)