component
FMF25FPKR004-BH
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PSA Prosperity Dielectrics Current Sense Resistors / Shunt Resistors, 2512. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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FMF25FPKR004-BH
PSA Prosperity Dielectrics · Current Sense Resistors / Shunt Resistors · 2512
FMF25FPKR004-BH from PSA Prosperity Dielectrics, in a 2512. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised resistor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised resistor; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | PSA Prosperity Dielectrics |
| Package | 2512 |
| Category | Resistors |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Max. working current (voltage 245 mV), Low EMF 3W 4mΩ | 54.8 | A | Table B, Low EMF (BH), 3 W, 4 mΩ, printed with 245 mV | 5 | |||
| Max. working voltage (with 54.8 A working current) | 245 | mV | Table B, Low EMF (BH), 3 W, 4 mΩ; note E = P·R or max working voltage, whichever is lower | 5 | |||
| Max. overload current, Low EMF 3W 4mΩ | 122.5 | A | Table B, Low EMF (BH), 3 W, 4 mΩ, printed with 548 mV | 5 | |||
| Max. overload voltage (with 122.5 A overload current) | 548 | mV | Table B, Low EMF (BH), 3 W, 4 mΩ | 5 | |||
| Rating at 70℃ | 3 | W | Table B, Low EMF (BH), rating at 70℃ | 5 | |||
| Temperature coefficient of resistance (TCR), Low EMF | -70 | 70 | ppm/℃ | Table B, Low EMF (BH), 4 mΩ; TCR hot (+25 to +155℃); +25 to -55℃ please contact factory | 5 | ||
| Resistance tolerance (F suffix) | -1 | 1 | % | Part-number code F = ±1% | 6 | ||
| Operating temperature range | -55 | 170 | ℃ | Operating temperature range | 3 | ||
| Storage temperature | 5 | 40 | ℃ | Storage; humidity 20 to 70% relative humidity | 11 | ||
| Surface temperature at full rated power | 105 | ℃ | Full rated power applied; solder pad and trace size >300 mm² | 4 | |||
| Insulation resistance (termination to coating) | 1000 | MΩ | IEC 60115-1 4.6; test voltage 100±15 V | 9 | |||
| High temperature exposure ΔR | -1 | 1 | % | F (±1%); 1000 h @170℃ unpowered; measured after 24±2 h | 7 | ||
| Temperature cycling ΔR (% term) | -0.5 | 0.5 | % | F; 1000 cycles -55 to +125℃; ΔR ≤ ±(0.5%+1mΩ) | 7 | ||
| Temperature cycling ΔR (mΩ term) | -1 | 1 | mΩ | F; additive term of ΔR ≤ ±(0.5%+1mΩ) | 7 | ||
| Moisture resistance ΔR (% term) | -0.5 | 0.5 | % | F; 65℃/80-100%RH, 10 cycles; ΔR ≤ ±(0.5%+0.5mΩ) | 7 | ||
| Moisture resistance ΔR (mΩ term) | -0.5 | 0.5 | mΩ | F; additive term of ΔR ≤ ±(0.5%+0.5mΩ) | 7 | ||
| Biased humidity ΔR (% term) | -1 | 1 | % | F; 1000 h 85℃/85%RH, 10% of operating power; ΔR ≤ ±(1%+0.5mΩ) | 7 | ||
| Biased humidity ΔR (mΩ term) | -0.5 | 0.5 | mΩ | F; additive term of ΔR ≤ ±(1%+0.5mΩ) | 7 | ||
| Operational life ΔR (% term) | -1 | 1 | % | F; 1000 h @ TA=125℃ at specified rated power; ΔR ≤ ±(1%+0.5mΩ) | 7 | ||
| Operational life ΔR (mΩ term) | -0.5 | 0.5 | mΩ | F; additive term of ΔR ≤ ±(1%+0.5mΩ) | 7 | ||
| Resistance to solder heat ΔR (% term) | -0.5 | 0.5 | % | F; solder dip 270±5℃ for 10±1 s; ΔR ≤ ±(0.5%+0.5mΩ) | 8 | ||
| Resistance to solder heat ΔR (mΩ term) | -0.5 | 0.5 | mΩ | F; additive term of ΔR ≤ ±(0.5%+0.5mΩ) | 8 | ||
| Thermal shock ΔR (% term) | -0.5 | 0.5 | % | F; -55 to 155℃, 300 cycles; ΔR ≤ ±(0.5%+0.5mΩ) | 8 | ||
| Thermal shock ΔR (mΩ term) | -0.5 | 0.5 | mΩ | F; additive term of ΔR ≤ ±(0.5%+0.5mΩ) | 8 | ||
| ESD ΔR (% term) | -1 | 1 | % | AEC-Q200-002; contact min 1 kV; ΔR ≤ ±(1%+0.5mΩ), no F/G/J split printed | 8 | ||
| ESD ΔR (mΩ term) | -0.5 | 0.5 | mΩ | AEC-Q200-002; additive term of ΔR ≤ ±(1%+0.5mΩ) | 8 | ||
| Short time overload ΔR (% term) | -1 | 1 | % | F; 5 × rated power for 5 s; ΔR ≤ ±(1%+0.5mΩ) | 9 | ||
| Short time overload ΔR (mΩ term) | -0.5 | 0.5 | mΩ | F; additive term of ΔR ≤ ±(1%+0.5mΩ) | 9 | ||
| Load life humidity ΔR (% term) | -1 | 1 | % | F; 40±2℃, 90-95% RH, DC rated voltage 1.5 h ON / 30 min OFF, 1000 h; ΔR ≤ ±(1%+0.5mΩ) | 9 | ||
| Load life humidity ΔR (mΩ term) | -0.5 | 0.5 | mΩ | F; additive term of ΔR ≤ ±(1%+0.5mΩ) | 9 | ||
| Load life ΔR (% term) | -1 | 1 | % | F; rated voltage 1.5 h then 0.5 h pause at 70±2℃, 1000 h; ΔR ≤ ±(1%+0.5mΩ) | 9 | ||
| Load life ΔR (mΩ term) | -0.5 | 0.5 | mΩ | F; additive term of ΔR ≤ ±(1%+0.5mΩ) | 9 | ||
| Board flex ΔR (% term) | -0.5 | 0.5 | % | F; bending 2 mm; ΔR ≤ ±(0.5%+1mΩ) | 8 | ||
| Board flex ΔR (mΩ term) | -1 | 1 | mΩ | F; additive term of ΔR ≤ ±(0.5%+1mΩ) | 8 | ||
| Resistance (nominal, decoded from value code R004) | R | 4 | mΩ | Part-number value code R004 (2512 R001~R003 code table; marking convention R005 = 5 mΩ) | 6 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | Item Protective Molding Resistive Element Internal Terminal External Terminal Material Resin Alloy Metal Copper Solder | 3 |
CAD (KiCad official)
- Symbol:
FMF25FPKR004-BH - Footprint:
Resistor_SMD:R_2512_6332Metric - 3D model: 2512 (KiCad packages3D, STEP)
- 3D model files:
fmf25fpkr004-bh-etched.step/fmf25fpkr004-bh-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fmf25fpkr004-bh.step/fmf25fpkr004-bh.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: PSA Prosperity Dielectrics datasheet (11 pp, sha256
dfbda11e8df429c2, retrieved 2026-11-07, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# FMF25FPKR004-BH
**PSA Prosperity Dielectrics** · Current Sense Resistors / Shunt Resistors · 2512
FMF25FPKR004-BH from PSA Prosperity Dielectrics, in a 2512. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised resistor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised resistor; either orientation. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | PSA Prosperity Dielectrics |
| Package | 2512 |
| Category | Resistors |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Max. working current (voltage 245 mV), Low EMF 3W 4mΩ | | | | 54.8 | A | Table B, Low EMF (BH), 3 W, 4 mΩ, printed with 245 mV | 5 |
| Max. working voltage (with 54.8 A working current) | | | | 245 | mV | Table B, Low EMF (BH), 3 W, 4 mΩ; note E = P·R or max working voltage, whichever is lower | 5 |
| Max. overload current, Low EMF 3W 4mΩ | | | | 122.5 | A | Table B, Low EMF (BH), 3 W, 4 mΩ, printed with 548 mV | 5 |
| Max. overload voltage (with 122.5 A overload current) | | | | 548 | mV | Table B, Low EMF (BH), 3 W, 4 mΩ | 5 |
| Rating at 70℃ | | | | 3 | W | Table B, Low EMF (BH), rating at 70℃ | 5 |
| Temperature coefficient of resistance (TCR), Low EMF | | -70 | | 70 | ppm/℃ | Table B, Low EMF (BH), 4 mΩ; TCR hot (+25 to +155℃); +25 to -55℃ please contact factory | 5 |
| Resistance tolerance (F suffix) | | -1 | | 1 | % | Part-number code F = ±1% | 6 |
| Operating temperature range | | -55 | | 170 | ℃ | Operating temperature range | 3 |
| Storage temperature | | 5 | | 40 | ℃ | Storage; humidity 20 to 70% relative humidity | 11 |
| Surface temperature at full rated power | | | | 105 | ℃ | Full rated power applied; solder pad and trace size >300 mm² | 4 |
| Insulation resistance (termination to coating) | | 1000 | | | MΩ | IEC 60115-1 4.6; test voltage 100±15 V | 9 |
| High temperature exposure ΔR | | -1 | | 1 | % | F (±1%); 1000 h @170℃ unpowered; measured after 24±2 h | 7 |
| Temperature cycling ΔR (% term) | | -0.5 | | 0.5 | % | F; 1000 cycles -55 to +125℃; ΔR ≤ ±(0.5%+1mΩ) | 7 |
| Temperature cycling ΔR (mΩ term) | | -1 | | 1 | mΩ | F; additive term of ΔR ≤ ±(0.5%+1mΩ) | 7 |
| Moisture resistance ΔR (% term) | | -0.5 | | 0.5 | % | F; 65℃/80-100%RH, 10 cycles; ΔR ≤ ±(0.5%+0.5mΩ) | 7 |
| Moisture resistance ΔR (mΩ term) | | -0.5 | | 0.5 | mΩ | F; additive term of ΔR ≤ ±(0.5%+0.5mΩ) | 7 |
| Biased humidity ΔR (% term) | | -1 | | 1 | % | F; 1000 h 85℃/85%RH, 10% of operating power; ΔR ≤ ±(1%+0.5mΩ) | 7 |
| Biased humidity ΔR (mΩ term) | | -0.5 | | 0.5 | mΩ | F; additive term of ΔR ≤ ±(1%+0.5mΩ) | 7 |
| Operational life ΔR (% term) | | -1 | | 1 | % | F; 1000 h @ TA=125℃ at specified rated power; ΔR ≤ ±(1%+0.5mΩ) | 7 |
| Operational life ΔR (mΩ term) | | -0.5 | | 0.5 | mΩ | F; additive term of ΔR ≤ ±(1%+0.5mΩ) | 7 |
| Resistance to solder heat ΔR (% term) | | -0.5 | | 0.5 | % | F; solder dip 270±5℃ for 10±1 s; ΔR ≤ ±(0.5%+0.5mΩ) | 8 |
| Resistance to solder heat ΔR (mΩ term) | | -0.5 | | 0.5 | mΩ | F; additive term of ΔR ≤ ±(0.5%+0.5mΩ) | 8 |
| Thermal shock ΔR (% term) | | -0.5 | | 0.5 | % | F; -55 to 155℃, 300 cycles; ΔR ≤ ±(0.5%+0.5mΩ) | 8 |
| Thermal shock ΔR (mΩ term) | | -0.5 | | 0.5 | mΩ | F; additive term of ΔR ≤ ±(0.5%+0.5mΩ) | 8 |
| ESD ΔR (% term) | | -1 | | 1 | % | AEC-Q200-002; contact min 1 kV; ΔR ≤ ±(1%+0.5mΩ), no F/G/J split printed | 8 |
| ESD ΔR (mΩ term) | | -0.5 | | 0.5 | mΩ | AEC-Q200-002; additive term of ΔR ≤ ±(1%+0.5mΩ) | 8 |
| Short time overload ΔR (% term) | | -1 | | 1 | % | F; 5 × rated power for 5 s; ΔR ≤ ±(1%+0.5mΩ) | 9 |
| Short time overload ΔR (mΩ term) | | -0.5 | | 0.5 | mΩ | F; additive term of ΔR ≤ ±(1%+0.5mΩ) | 9 |
| Load life humidity ΔR (% term) | | -1 | | 1 | % | F; 40±2℃, 90-95% RH, DC rated voltage 1.5 h ON / 30 min OFF, 1000 h; ΔR ≤ ±(1%+0.5mΩ) | 9 |
| Load life humidity ΔR (mΩ term) | | -0.5 | | 0.5 | mΩ | F; additive term of ΔR ≤ ±(1%+0.5mΩ) | 9 |
| Load life ΔR (% term) | | -1 | | 1 | % | F; rated voltage 1.5 h then 0.5 h pause at 70±2℃, 1000 h; ΔR ≤ ±(1%+0.5mΩ) | 9 |
| Load life ΔR (mΩ term) | | -0.5 | | 0.5 | mΩ | F; additive term of ΔR ≤ ±(1%+0.5mΩ) | 9 |
| Board flex ΔR (% term) | | -0.5 | | 0.5 | % | F; bending 2 mm; ΔR ≤ ±(0.5%+1mΩ) | 8 |
| Board flex ΔR (mΩ term) | | -1 | | 1 | mΩ | F; additive term of ΔR ≤ ±(0.5%+1mΩ) | 8 |
| Resistance (nominal, decoded from value code R004) | R | | 4 | | mΩ | Part-number value code R004 (2512 R001~R003 code table; marking convention R005 = 5 mΩ) | 6 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | | Item Protective Molding Resistive Element Internal Terminal External Terminal Material Resin Alloy Metal Copper Solder | 3 |
## CAD (KiCad official)
- Symbol: `FMF25FPKR004-BH`
- Footprint: `Resistor_SMD:R_2512_6332Metric`
- 3D model: 2512 (KiCad packages3D, STEP)
- 3D model files: `fmf25fpkr004-bh-etched.step` / `fmf25fpkr004-bh-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `fmf25fpkr004-bh.step` / `fmf25fpkr004-bh.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [PSA Prosperity Dielectrics datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8602992778020200448) (11 pp, sha256 `dfbda11e8df429c2`, retrieved 2026-11-07, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/fmf25fpkr004-bh-datasheet.pdf)