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Contents

README

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FM33LG023A

FUDAN MICRO · Microcontroller Units (MCUs/MPUs/SOCs) · QFN-32(5x5)

FM33LG023A from FUDAN MICRO, in a QFN-32(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PD8 bidirectional GPIO that also serves as UART3_TX and SWIO (SWD data).
2 NRST input Reset pin with 5 kΩ typical pull-up, VIL max 0.3VDD, VIH min 0.7VDD.
3 PA13 bidirectional GPIO with UART0_RX, LPUART0_RX and ADC_IN4 functions.
4 PA14 bidirectional GPIO with UART0_TX, LPUART0_TX and ADC_IN11 functions.
5 PA6 bidirectional GPIO with COM6/SEG30 LCD drive, OPA1_INN2 and CAN_RX functions.
6 PA7 bidirectional GPIO with COM7/SEG31 LCD drive, OPA1_INP2 and CAN_TX functions.
7 PA8 bidirectional GPIO with SEG0 LCD, LPT32_CH1, SPI1_SSN and COMP2_INP1 functions.
8 PA9 bidirectional GPIO with SEG1 LCD, LPT32_CH2, SPI1_SCK and COMP2_INP2 functions; the QFN32 figure shows PA11 (SEG32/SCL/LPUART2_RX) sharing this pin.
9 PB0 bidirectional GPIO with SEG34 LCD, UART3_RX, SPI1_MISO and OPA1_OUT3 functions; the QFN32 figure shows PA12 (SEG33/SDA/LPUART2_TX) sharing this pin.
10 PB1 bidirectional Pin with SEG35 LCD, UART3_TX, SPI1_MOSI and OPA1_OUT4 functions.
11 PB4 bidirectional GPIO with SEG3 LCD, ATIM_CH1, LPUART2_RX and COMP3_INN1 functions.
12 PB5 bidirectional GPIO with SEG4 LCD, ATIM_CH2, LPUART2_TX and COMP3_INN2 functions.
13 PB7 bidirectional GPIO with SEG6 LCD, ATIM_CH4, SPI2_SCK and ANATST (factory test) functions; PB8 (SEG7/SPI0_SSN/ATIM_CH3N/COMP1_INP1) shares this pin in the QFN32 figure.
14 PB10 bidirectional GPIO with SEG9 LCD, OPA1_INN1, SPI0_MISO and GPT0_CH1 functions.
15 PB11 bidirectional GPIO with SEG10 LCD, OPA1_INP1, SPI MOSI and GPT0_CH2 functions.
16 PB12 bidirectional GPIO with WKUP3 wake-up, FOUT1 clock output, ATIM_ETR and OPA1_OUT1 functions; PE1 (SEG37/SPI0_SCK) shares this pin in the QFN32 figure.
17 PC2 bidirectional GPIO with XTHIN high-frequency crystal input, UART1_RX and LPUART1_RX; PD12 (VDISP1/SDA/SPI2_MOSI) shares this pin in the QFN32 figure.
18 PC3 bidirectional GPIO with XTHOUT high-frequency crystal output, UART1_TX and LPUART1_TX functions.
19 PC5 bidirectional GPIO with SEG14 LCD, DAC_OUT, COMP2_OUT and UART5_TX functions (ESD HBM rating ±2000 V on DAC_OUT).
20 PC7 bidirectional GPIO with SEG16 LCD, SPI2_SSN and ADC_IN6 functions.
21 PC8 bidirectional GPIO with SEG17 LCD, SPI2_SCK and ADC_IN13 functions.
22 PC9 bidirectional GPIO with SEG18 LCD, SPI2_MISO and ADC_IN14 functions.
23 PC10 bidirectional GPIO with WKUP5 wake-up, SEG19 LCD, SPI2_MOSI and ADC_IN15 functions.
24 XT32KO output 32768 Hz crystal oscillator output pin.
25 XT32KI input 32768 Hz crystal oscillator input pin.
26 VDD15 power_out LDO output, connect a 100 nF capacitor to ground.
27 VSS power_in Ground (also VSSA).
28 VDD power_in Power supply (also VDDA), operating range 1.65 V to 5.5 V.
29 VREFP passive Reference voltage pin.
30 PD11 bidirectional GPIO with WKUP6 wake-up, FOUT0 clock output, ATIM_BRK1 and ADC_IN0 functions; PD0 (SEG22/UART5_RX/GPT2_CH1/ADC_IN7) shares this pin in the QFN32 figure.
31 PD1 bidirectional GPIO with SEG23 LCD, UART5_TX, GPT2_CH2 and ADC_IN1 functions; PD6 (WKUP7/ANATST/ATIM_BRK2/ADC_IN10) shares this pin per the QFN32 figure.
32 PD7 bidirectional GPIO that also serves as UART3_RX and SWCLK (SWD clock).
33 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer FUDAN MICRO
Package QFN-32(5x5)
Category Single Chip Microcomputer/Microcontroller
Pins 33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (VDD, VDDA) VDD-VSS -0.3 6.5 V 61
Pin voltage VPIN 6.5 V min printed as VSS-0.3 61
ADC reference voltage VREFP-VREFN -0.3 6.5 V 61
Voltage difference between all ground pins /ΔVSS/ 50 mV 61
Operating temperature TA -40 105 ℃ AEC-Q100 grade2 61
Storage temperature TSTG -55 150 ℃ 61
ESD HBM, PC5 (DAC_OUT) HBM -2000 2000 V TA=25℃, JEDEC JS-001 61
ESD HBM, all other pins HBM -4000 4000 V TA=25℃, JEDEC JS-001 61
ESD CDM CDM -1000 1000 V TA=25℃, JEDEC JS-002 61
IO latchup LU -210 210 mA -(0.5VDD) < VI < (1.5VDD), TA=25℃, JESD78E 61
Max current into VDD (source) ΣIVDD 120 mA 61
Max current out of VSS (sink) ΣIVSS 100 mA 61
Total IO sink current ΣIIO 100 mA all IO sink 61
Total IO source current ΣIIO 120 mA all IO source 61
AHB clock frequency fHCLK 0 64 MHz TA=-40~105C 62
APB clock frequency fPCLK 0 64 MHz TA=-40~105C 62
Operating voltage range VDD 1.65 5.5 V TA=-40~105C 62
Backup supply voltage, no power switching VBAT 1.5 5.5 V power switching not used, shorted to VDD 62
Backup supply voltage, with power switching VBAT 1.5 4.2 V power switching used, VBAT supplied separately 62
Junction temperature TJ -40 125 °C 62
Run mode current 8MHz IDDRUN 1.36 1.65 mA fAHB=8MHz (RCHF), PLL off, Flash 0 wait, TA=25℃ 62
Run mode current 8MHz IDDRUN 1.4 1.7 mA fAHB=8MHz (RCHF), PLL off, Flash 0 wait, TA=105℃ 62
Run mode current 16MHz IDDRUN 2.19 2.4 mA fAHB=16MHz (RCHF), PLL off, Flash 0 wait, TA=25℃ 62
Run mode current 16MHz IDDRUN 2.2 2.5 mA fAHB=16MHz (RCHF), PLL off, Flash 0 wait, TA=105℃ 62
Run mode current 24MHz IDDRUN 3.15 3.5 mA fAHB=24MHz (RCHF), PLL off, Flash 0 wait, TA=25℃ 62
Run mode current 24MHz IDDRUN 3.12 3.6 mA fAHB=24MHz (RCHF), PLL off, Flash 0 wait, TA=105℃ 62
Run mode current 64MHz IDDRUN 5.66 6 mA fAHB=64MHz, PLL on, Flash 1 wait, TA=25℃ 62
Run mode current 64MHz IDDRUN 5.73 6.2 mA fAHB=64MHz, PLL on, Flash 1 wait, TA=105℃ 62
Run mode current 614KHz IDDRUN 137 150 uA fAHB=614KHz (RCLF), PLL off, Flash 0 wait, TA=25℃ 62
Run mode current 614KHz IDDRUN 179 200 uA fAHB=614KHz (RCLF), PLL off, Flash 0 wait, TA=105℃ 62

CAD (KiCad official)

  • Symbol: FM33LG023A
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: QFN-32(5x5) (KiCad packages3D, STEP)
  • 3D model files: fm33lg023a-etched.step / fm33lg023a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fm33lg023a.step / fm33lg023a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: FUDAN MICRO datasheet (100 pp, sha256 bfd0cc3c1ded70af, retrieved 2026-10-22, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF