component
FM25Q08B-SO-T-G
Public Made by Adomby adom
FUDAN MICRO NOR FLASH, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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FM25Q08B-SO-T-G
FUDAN MICRO · NOR FLASH · SOP-8
FM25Q08B-SO-T-G from FUDAN MICRO, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS# | input | Chip Select Input; when high the device is deselected and DO/DQ outputs are high impedance, and after power-up CS# must go high-to-low before a new instruction is accepted. |
| 2 | DO(DQ1) | bidirectional | Data Output (Data Input Output 1); DQ1 is used for Dual SPI instructions. |
| 3 | WP#(DQ2) | bidirectional | Write Protect Input, active low, used with the status register block protect bits to prevent status register writes; it becomes DQ2 for Quad I/O when QE is set. |
| 4 | VSS | power_in | Ground. |
| 5 | DI(DQ0) | bidirectional | Data Input (Data Input Output 0); DQ0 is used for Dual SPI and Quad SPI/QPI instructions. |
| 6 | CLK | input | Serial Clock Input that provides the timing for serial input and output operations. |
| 7 | HOLD#(DQ3) | bidirectional | Hold Input, active low, pauses the device while CS# is low (DO high impedance, DI and CLK ignored); it becomes DQ3 for Quad I/O when QE is set. |
| 8 | VCC | power_in | Power Supply; the datasheet lists the operating range as 2.3V to 3.6V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | FUDAN MICRO |
| Package | SOP-8 |
| Category | Memory |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Temperature | -40 | 85 | °C | 64 | |||
| Storage Temperature | -65 | 150 | °C | 64 | |||
| Voltage on I/O Pin with Respect to Ground | -0.5 | V | 64 | ||||
| VCC | VCC | -0.5 | 4 | V | 64 | ||
| Input Capacitance | CIN | 6 | pF | VIN = 0V, f = 5 MHz | 64 | ||
| Output Capacitance | COUT | 8 | pF | VOUT = 0V, f = 5 MHz | 64 | ||
| Write Inhibit Threshold Voltage | VWI | 1 | 2 | V | 64 | ||
| Vcc Supply Voltage | Vcc | 2.3 | 3.6 | V | 65 | ||
| Input Leakage Current | ILI | -2 | 2 | µA | 65 | ||
| Output Leakage Current | ILO | -2 | 2 | µA | 65 | ||
| Standby Current | ICC1 | 5 | 10 | µA | CS# = VCC, VIN = Vss or VCC | 65 | |
| Deep Power-down Current | ICC2 | 1 | 5 | µA | CS# = VCC, VIN = Vss or VCC | 65 | |
| Operating Current (WRSR) | ICC4 | 8 | 12 | mA | CS#=VCC | 66 | |
| Operating Current (PP) | ICC5 | 10 | 20 | mA | CS#=VCC | 66 | |
| Operating Current (SE) | ICC6 | 10 | 20 | mA | CS#=VCC | 66 | |
| Operating Current (BE) | ICC7 | 10 | 20 | mA | CS#=VCC | 66 | |
| Input Low Voltage | VIL | -0.5 | V | 66 | |||
| Serial Clock Frequency for FAST_READ, PP, SE, BE, DP, RES, WREN, WRDI, WRSR | FR | 80 | MHz | 2.3~2.7V | 66 | ||
| Serial Clock Frequency for FAST_READ, PP, SE, BE, DP, RES, WREN, WRDI, WRSR | FR | 100 | MHz | 2.7~3.6V | 66 | ||
| Serial Clock Frequency for READ, RDSR, RDID | fR | 33 | MHz | 2.3~2.7V | 66 | ||
| Serial Clock Frequency for READ, RDSR, RDID | fR | 50 | MHz | 2.7~3.6V | 66 | ||
| Byte Program Time | tBP | 30 | 50 | µs | 67 | ||
| Page Program Time | tPP | 0.6 | 3 | ms | 67 | ||
| Write Status Register Cycle Time | tW | 10 | 15 | ms | 67 | ||
| Sector Erase Time | tSE | 60 | 300 | ms | 67 | ||
| Block Erase Time (32KB) | tBE | 250 | 1500 | ms | 67 | ||
| Block Erase Time (64KB) | tBE | 400 | 2000 | ms | 67 | ||
| Chip Erase Time | tCE | 6 | 30 | s | 67 |
CAD (KiCad official)
- Symbol:
FM25Q08B-SO-T-G - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
fm25q08b-so-t-g-etched.step/fm25q08b-so-t-g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fm25q08b-so-t-g.step/fm25q08b-so-t-g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: FUDAN MICRO datasheet (75 pp, sha256
13b9d1f3fdceb21b, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# FM25Q08B-SO-T-G
**FUDAN MICRO** · NOR FLASH · SOP-8
FM25Q08B-SO-T-G from FUDAN MICRO, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS# | input | Chip Select Input; when high the device is deselected and DO/DQ outputs are high impedance, and after power-up CS# must go high-to-low before a new instruction is accepted. |
| 2 | DO(DQ1) | bidirectional | Data Output (Data Input Output 1); DQ1 is used for Dual SPI instructions. |
| 3 | WP#(DQ2) | bidirectional | Write Protect Input, active low, used with the status register block protect bits to prevent status register writes; it becomes DQ2 for Quad I/O when QE is set. |
| 4 | VSS | power_in | Ground. |
| 5 | DI(DQ0) | bidirectional | Data Input (Data Input Output 0); DQ0 is used for Dual SPI and Quad SPI/QPI instructions. |
| 6 | CLK | input | Serial Clock Input that provides the timing for serial input and output operations. |
| 7 | HOLD#(DQ3) | bidirectional | Hold Input, active low, pauses the device while CS# is low (DO high impedance, DI and CLK ignored); it becomes DQ3 for Quad I/O when QE is set. |
| 8 | VCC | power_in | Power Supply; the datasheet lists the operating range as 2.3V to 3.6V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | FUDAN MICRO |
| Package | SOP-8 |
| Category | Memory |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Temperature | | -40 | | 85 | °C | | 64 |
| Storage Temperature | | -65 | | 150 | °C | | 64 |
| Voltage on I/O Pin with Respect to Ground | | -0.5 | | | V | | 64 |
| VCC | VCC | -0.5 | | 4 | V | | 64 |
| Input Capacitance | CIN | | | 6 | pF | VIN = 0V, f = 5 MHz | 64 |
| Output Capacitance | COUT | | | 8 | pF | VOUT = 0V, f = 5 MHz | 64 |
| Write Inhibit Threshold Voltage | VWI | 1 | | 2 | V | | 64 |
| Vcc Supply Voltage | Vcc | 2.3 | | 3.6 | V | | 65 |
| Input Leakage Current | ILI | -2 | | 2 | µA | | 65 |
| Output Leakage Current | ILO | -2 | | 2 | µA | | 65 |
| Standby Current | ICC1 | | 5 | 10 | µA | CS# = VCC, VIN = Vss or VCC | 65 |
| Deep Power-down Current | ICC2 | | 1 | 5 | µA | CS# = VCC, VIN = Vss or VCC | 65 |
| Operating Current (WRSR) | ICC4 | | 8 | 12 | mA | CS#=VCC | 66 |
| Operating Current (PP) | ICC5 | | 10 | 20 | mA | CS#=VCC | 66 |
| Operating Current (SE) | ICC6 | | 10 | 20 | mA | CS#=VCC | 66 |
| Operating Current (BE) | ICC7 | | 10 | 20 | mA | CS#=VCC | 66 |
| Input Low Voltage | VIL | -0.5 | | | V | | 66 |
| Serial Clock Frequency for FAST_READ, PP, SE, BE, DP, RES, WREN, WRDI, WRSR | FR | | | 80 | MHz | 2.3~2.7V | 66 |
| Serial Clock Frequency for FAST_READ, PP, SE, BE, DP, RES, WREN, WRDI, WRSR | FR | | | 100 | MHz | 2.7~3.6V | 66 |
| Serial Clock Frequency for READ, RDSR, RDID | fR | | | 33 | MHz | 2.3~2.7V | 66 |
| Serial Clock Frequency for READ, RDSR, RDID | fR | | | 50 | MHz | 2.7~3.6V | 66 |
| Byte Program Time | tBP | | 30 | 50 | µs | | 67 |
| Page Program Time | tPP | | 0.6 | 3 | ms | | 67 |
| Write Status Register Cycle Time | tW | | 10 | 15 | ms | | 67 |
| Sector Erase Time | tSE | | 60 | 300 | ms | | 67 |
| Block Erase Time (32KB) | tBE | | 250 | 1500 | ms | | 67 |
| Block Erase Time (64KB) | tBE | | 400 | 2000 | ms | | 67 |
| Chip Erase Time | tCE | | 6 | 30 | s | | 67 |
## CAD (KiCad official)
- Symbol: `FM25Q08B-SO-T-G`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `fm25q08b-so-t-g-etched.step` / `fm25q08b-so-t-g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `fm25q08b-so-t-g.step` / `fm25q08b-so-t-g.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [FUDAN MICRO datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588917491229184000) (75 pp, sha256 `13b9d1f3fdceb21b`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/fm25q08b-so-t-g-datasheet.pdf)