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FM24C32D-SO-T-G

FUDAN MICRO · EEPROM · SOIC-8

FM24C32D-SO-T-G from FUDAN MICRO, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Device address input, hardwired or left floating; if left floating it is pulled down internally to GND when board coupling to VCC is below 3 pF, and FMSH recommends connecting it to GND when coupling exceeds 3 pF.
2 A1 input Device address input, hardwired or left floating; if left floating it is pulled down internally to GND when board coupling to VCC is below 3 pF, and FMSH recommends connecting it to GND when coupling exceeds 3 pF.
3 A2 input Device address input, hardwired or left floating; if left floating it is pulled down internally to GND when board coupling to VCC is below 3 pF, and FMSH recommends connecting it to GND when coupling exceeds 3 pF.
4 GND power_in Ground reference for the device.
5 SDA bidirectional Bi-directional open-drain serial data pin for the 2-wire bus, which may be wire-ORed with other open-drain or open-collector devices.
6 SCL input Serial clock input; data is clocked into the device on the positive edge and clocked out on the negative edge of SCL.
7 WP input Write protect input: connecting it to GND allows normal write operations, while connecting it to VCC inhibits all write operations to the memory; if left floating it is pulled down internally when board coupling to VCC is below 3 pF, and FMSH recommends GND connection when coupling exceeds 3 pF.
8 VCC power_in Power supply, specified from 1.7 V to 5.5 V.

Key specifications

Parameter Value
Manufacturer FUDAN MICRO
Package SOIC-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Temperature (Plastic Package) -55 125 °C 3
Storage Temperature (Plastic Package) -65 150 °C 3
Voltage on Any Pin with Respect to Ground -1 7 V 3
Maximum Operating Voltage 6.25 V 3
DC Output Current 5 mA 3
Supply Voltage VCC 1.7 5.5 V 6
Operating Ambient Temperature TA -40 85 °C Recommended operating range 6
Supply Current, Read ICC1 0.4 1 mA VCC = 5.0V, Read at 400KHz 6
Supply Current, Write ICC2 2 3 mA VCC = 5.0V, Write at 400KHz 6
Standby Current ISB1 1 µA VCC = 1.7V, VIN = VCC/ VSS 6
Standby Current ISB2 6 µA VCC = 5.5V, VIN = VCC/ VSS 6
Input Leakage Current ILI 0.1 3 µA VIN = VCC/VSS 6
Output Leakage Current ILO 0.05 3 µA VOUT = VCC/ VSS 6
Input Low Level VIL -0.6 V 6
Output Low Level 2 VOL2 0.4 V VCC = 3.0V, IOL = 2.1 mA 6
Output Low Level 1 VOL1 0.2 V VCC = 1.7V, IOL = 0.15 mA 6
Input Capacitance CIN 6 pF VIN = 0V, f = 1MHz 6
Output Capacitance COUT 8 pF VOUT = 0V, f = 1MHz 6
Clock Frequency, SCL fBSCLB 400 kHz 400 kHz table; VCC = 1.7V to 5.5V, CL = 100 pF 7
Clock Pulse Width Low tBLOWB 1.3 µs 400 kHz table; VCC = 1.7V to 5.5V, CL = 100 pF 7
Clock Pulse Width High tBHIGHB 0.6 µs 400 kHz table; VCC = 1.7V to 5.5V, CL = 100 pF 7
Noise Suppression Time tBIB 80 ns 400 kHz table; VCC = 1.7V to 5.5V, CL = 100 pF 7
Clock Low to Data Out Valid tBAAB 0.1 0.9 µs 400 kHz table; VCC = 1.7V to 5.5V, CL = 100 pF 7
Bus Free Time before New Transmission tBBUF 1.3 µs 400 kHz table; VCC = 1.7V to 5.5V, CL = 100 pF 7
Start Hold Time tBHD.STAB 0.6 µs 400 kHz table; VCC = 1.7V to 5.5V, CL = 100 pF 7
Start Setup Time tBSU.STAB 0.6 µs 400 kHz table; VCC = 1.7V to 5.5V, CL = 100 pF 7
Data In Hold Time tHD.DATB 0 µs 400 kHz table; VCC = 1.7V to 5.5V, CL = 100 pF 7
Data In Setup Time tBSU.DATB 100 ns 400 kHz table; VCC = 1.7V to 5.5V, CL = 100 pF 7
Inputs Rise Time tBRB 300 ns 400 kHz table; VCC = 1.7V to 5.5V, CL = 100 pF 7
Inputs Fall Time tBFB 300 ns 400 kHz table; VCC = 1.7V to 5.5V, CL = 100 pF 7
Stop Setup Time tBSU.STOB 0.6 µs 400 kHz table; VCC = 1.7V to 5.5V, CL = 100 pF 7
Data Out Hold Time tBDHB 100 ns 400 kHz table; VCC = 1.7V to 5.5V, CL = 100 pF 7
Write Cycle Time tBWRB 5 ms 400 kHz table; VCC = 1.7V to 5.5V, CL = 100 pF 7
Endurance 1e+06 write cycles 3.3V, 25°C, Page Mode 7
Clock Frequency, SCL fBSCLB 1 MHz 1 MHz table; VCC = 2.5V to 5.5V, CL = 100 pF 7
Clock Pulse Width Low tBLOWB 500 ns 1 MHz table; VCC = 2.5V to 5.5V, CL = 100 pF 7
Clock Pulse Width High tBHIGHB 320 ns 1 MHz table; VCC = 2.5V to 5.5V, CL = 100 pF 7
Clock Low to Data Out Valid tBAAB 450 ns 1 MHz table; VCC = 2.5V to 5.5V, CL = 100 pF 7
Bus Free Time before New Transmission tBBUF 500 ns 1 MHz table; VCC = 2.5V to 5.5V, CL = 100 pF 7
Start Hold Time tBHD.STAB 250 ns 1 MHz table; VCC = 2.5V to 5.5V, CL = 100 pF 7
Start Setup Time tBSU.STAB 250 ns 1 MHz table; VCC = 2.5V to 5.5V, CL = 100 pF 7
Data In Hold Time tHD.DATB 0 ns 1 MHz table; VCC = 2.5V to 5.5V, CL = 100 pF 7
Data In Setup Time tBSU.DATB 50 ns 1 MHz table; VCC = 2.5V to 5.5V, CL = 100 pF 7
Inputs Rise Time tBRB 120 ns 1 MHz table; VCC = 2.5V to 5.5V, CL = 100 pF 7
Inputs Fall Time tBFB 120 ns 1 MHz table; VCC = 2.5V to 5.5V, CL = 100 pF 7
Stop Setup Time tBSU.STOB 250 ns 1 MHz table; VCC = 2.5V to 5.5V, CL = 100 pF 7

CAD (KiCad official)

  • Symbol: FM24C32D-SO-T-G
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: fm24c32d-so-t-g-etched.step / fm24c32d-so-t-g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fm24c32d-so-t-g.step / fm24c32d-so-t-g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: FUDAN MICRO datasheet (28 pp, sha256 76cc902c4e8b5b12, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF