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FM24C256E-TS-T-G

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FUDAN MICRO EEPROM, TSSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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FM24C256E-TS-T-G

FUDAN MICRO · EEPROM · TSSOP-8

FM24C256E-TS-T-G from FUDAN MICRO, in a TSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Device address input hardwired to select one of up to eight devices on a bus; if left floating it is pulled down internally to GND when board coupling is below 3pF, and FMSH recommends connecting it to GND when coupling is above 3pF.
2 A1 input Device address input hardwired to select one of up to eight devices on a bus; if left floating it is pulled down internally to GND when board coupling is below 3pF, and FMSH recommends connecting it to GND when coupling is above 3pF.
3 A2 input Device address input hardwired to select one of up to eight devices on a bus; if left floating it is pulled down internally to GND when board coupling is below 3pF, and FMSH recommends connecting it to GND when coupling is above 3pF.
4 GND power_in Ground reference for the device.
5 SDA bidirectional Bi-directional open-drain serial data line that may be wire-ORed with other open-drain or open-collector devices and is normally pulled high by an external device.
6 SCL input Serial clock input: data is clocked into the device on the positive edge of SCL and clocked out on the negative edge.
7 WP input Write protect input: connecting it to GND allows normal write operations, while connecting it to VCC inhibits all writes to the memory; if left floating it is pulled down internally when board coupling is below 3pF, and FMSH recommends connecting it to GND when coupling is above 3pF.
8 VCC power_in Power supply, 1.7V to 5.5V.

Key specifications

Parameter Value
Manufacturer FUDAN MICRO
Package TSSOP-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Temperature (Plastic Package) -55 130 °C 3
Storage Temperature (Plastic Package) -65 150 °C 3
Voltage on Any Pin with Respect to Ground -0.5 7 V 3
Maximum Operating Voltage 6.25 V 3
DC Output Current 5 mA 3
ESD HBM VESD(HBM) 4000 V 3
Input Capacitance CIN 6 pF VIN = 0V, f = 1MHz 6
Output Capacitance COUT 8 pF VOUT = 0V, f = 1MHz 6
Write cycle endurance Ncycle 1e+06 Write cycle TA ≤ 25 °C, VCC(min) < VCC < VCC(max) 6
Data retention 40 Year TA = 55 °C 6
Operating temperature range (recommended) TA -40 85 °C 6
Supply Voltage VCC 1.7 5.5 V 6
Supply Current (read) ICC1 0.4 1 mA VCC = 5.0V, Read at 400KHz 6
Supply Current (write) ICC2 2 3 mA VCC = 5.0V, Write at 400KHz 6
Standby Current ISB1 1 µA VCC = 1.7V, VIN = VCC/ VSS 6
Standby Current ISB2 6 µA VCC = 5.5V, VIN = VCC/ VSS 6
Input Leakage Current ILI 0.1 3 µA VIN = VCC/VSS 6
Output Leakage Current ILO 0.05 3 µA VOUT = VCC/ VSS 6
Input Low Level VIL -0.6 V 6
Output Low Level 2 VOL2 0.4 V VCC = 3.0V, IOL = 2.1 mA 7
Output Low Level 1 VOL1 0.2 V VCC =1.7V, IOL = 0.15 mA 7
Clock Frequency, SCL fBSCLB 400 kHz TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF 7
Clock Pulse Width Low tBLOWB 1.3 µs TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF 7
Clock Pulse Width High tBHIGHB 0.6 µs TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF 7
Noise Suppression Time tBIB 80 ns TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF 7
Clock Low to Data Out Valid tBAAB 0.1 0.9 µs TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF 7
Time the bus must be free before a new transmission can start tBBUF 1.3 µs TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF 7
Start Hold Time tBHD.STAB 0.6 µs TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF 7
Start Setup Time tBSU.STAB 0.6 µs TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF 7
Data In Hold Time tHD.DATB 0 µs TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF 7
Data In Setup Time tBSU.DATB 100 ns TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF 7
Inputs Rise Time tBRB 300 ns TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF 7
Inputs Fall Time tBFB 300 ns TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF 7
Stop Setup Time tBSU.STOB 0.6 µs TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF 7
Data Out Hold Time tBDHB 100 ns TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF 7
Write Cycle Time tBWRB 5 ms TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF 7
Clock Frequency, SCL fBSCLB 1 MHz TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF 7
Clock Pulse Width Low tBLOWB 500 ns TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF 7
Clock Pulse Width High tBHIGHB 320 ns TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF 7
Clock Low to Data Out Valid tBAAB 100 450 ns TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF 7
Time the bus must be free before a new transmission can start tBBUF 500 ns TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF 7
Start Hold Time tBHD.STAB 250 ns TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF 7
Start Setup Time tBSU.STAB 250 ns TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF 7
Data In Hold Time tHD.DATB 0 ns TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF 7
Data In Setup Time tBSU.DATB 50 ns TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF 7
Inputs Rise Time tBRB 120 ns TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF 7
Inputs Fall Time tBFB 120 ns TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF 7
Stop Setup Time tBSU.STOB 250 ns TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF 8
Data Out Hold Time tBDHB 100 ns TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF 8
Write Cycle Time tBWRB 5 ms TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF 8

CAD (KiCad official)

  • Symbol: FM24C256E-TS-T-G
  • Footprint: Package_SO:TSSOP-8_3x3mm_P0.65mm
  • 3D model: TSSOP-8 (KiCad packages3D, STEP)
  • 3D model files: fm24c256e-ts-t-g-etched.step / fm24c256e-ts-t-g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fm24c256e-ts-t-g.step / fm24c256e-ts-t-g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: FUDAN MICRO datasheet (29 pp, sha256 459267367ca024e3, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF