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FM1702SL

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FUDAN MICRO RFID ICs, SOIC-24-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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FM1702SL

FUDAN MICRO · RFID ICs · SOIC-24-300mil

FM1702SL from FUDAN MICRO, in a SOIC-24-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OSCIN input Crystal oscillator input at fosc = 13.56 MHz; an external clock is not recommended and must meet the frequency, 40-60% duty cycle and jitter limits in section 19.5.2.
2 IRQ output Interrupt request output that signals interrupt sources; it is push-pull or open-drain depending on IRQPushPull, and it is high-impedance during reset.
3 MFIN input Serial input that receives the digital serial signal conforming to the ISO14443A protocol, with Schmitt-trigger input thresholds.
4 TX1 output Transmitter output 1 that delivers the modulated 13.56 MHz carrier, driving the antenna directly through a matching network.
5 TVDD power_in Transmitter supply that provides the output energy for TX1 and TX2, with an operating range of 3.0 V to 5.5 V.
6 TX2 output Transmitter output 2 that delivers the modulated 13.56 MHz carrier, driving the antenna directly through a matching network.
7 TVSS power_in Transmitter ground.
8 C0 input Configuration pin that must be fixed to a low level.
9 C1 input Configuration pin that must be fixed to a high level.
10 C2 input Configuration pin that must be fixed to a high level.
11 DVSS power_in Digital ground.
12 MISO output Master-in slave-out data output of the SPI interface.
13 SCK input Serial clock input for the SPI interface; the FM1702SL is slave-only, so the master must supply SCK.
14 MOSI input Master-out slave-in data input of the SPI interface.
15 NSS input Interface strobe that selects the SPI interface mode; NSS must stay low for multi-byte transfers and go high between data streams.
16 C3 input Configuration pin that must be fixed to a low level.
17 DVDD power_in Digital supply, 3.0-3.6 V (CMOS) or 4.5-5.5 V (TTL), with DVDD less than or equal to AVDD and AVDD less than or equal to TVDD.
18 AVDD power_in Analog supply, 3.0-3.6 V, which must be at least DVDD and no higher than TVDD.
19 AUX output Analog test signal output whose signal is selected by the TestAnaOutSel register.
20 AVSS power_in Analog ground.
21 RX input Receiver input that receives the 13.56 MHz card response signal coupled from the external antenna.
22 VMID power_out Internal reference voltage output that requires an external 68 nF capacitor.
23 RSTPD input Reset and power-down input: a high level resets the internal circuits, stops the oscillator and isolates internal inputs from the external circuit, and a falling edge triggers the internal reset sequence.
24 OSCOUT output Crystal oscillator output.

Key specifications

Parameter Value
Manufacturer FUDAN MICRO
Package SOIC-24-300mil
Category RF And Wireless
Pins 24

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Storage temperature Tamb,abs -40 150 °C 103
DC supply voltage DVDD, AVDD, TVDD -0.5 6 V 103
Absolute voltage on all digital pins Vin,abs -0.5 V all digital pins to DVSS 103
Absolute voltage on RX pin VRX,abs -0.5 V RX pin to AVSS 103
Ambient temperature Tamb -25 25 85 °C 103
Digital circuit supply voltage (DVDD) DVDD 4.5 5 5.5 V DVSS = AVSS = TVSS = 0V 103
Supply voltage row without printed symbol (3.0 / 3.3 / 3.6) 3 3.3 3.6 V 103
Analog circuit supply voltage AVDD 3 3.3 3.6 V DVSS = AVSS = TVSS = 0V 103
Transmit circuit supply voltage TVDD 3 5 5.5 V DVSS = AVSS = TVSS = 0V 103
Digital circuit current, Idle command IDVDD 6 9 mA Idle 指令 104
Digital circuit current, Stand By mode IDVDD 3 5 mA Stand By 模式 104
Digital circuit current, Soft Power Down mode IDVDD 800 1000 µA Soft Power Down 模式 104
Digital circuit current, Hard Power Down mode IDVDD 1 10 µA Hard Power Down 模式 104
Analog circuit current, Idle command, receiver on IAVDD 25 40 mA Idle 指令, 接收器打开 104
Analog circuit current, Idle command, receiver off IAVDD 8 12 mA Idle 指令, 接收器关闭 104
Analog circuit current, Stand By mode IAVDD 6.5 9 mA Stand By 模式 104
Analog circuit current, Soft Power Down mode IAVDD 1 10 µA Soft Power Down 模式 104
Analog circuit current, Hard Power Down mode IAVDD 1 10 µA Hard Power Down 模式 104
Transmit circuit current, continuous carrier ITVDD 150 mA 发射连续载波 104
Transmit circuit current, TX RF enabled ITVDD 4.5 6 mA TX1 TX2 悬空, TX1RFEn, TX2RFEn= 1 104
Transmit circuit current, TX RF disabled ITVDD 65 130 µA TX1 TX2 悬空, TX1RFEn, TX2RFEn= 0 104

CAD (KiCad official)

  • Symbol: FM1702SL
  • Footprint: Package_SO:SOIC-24W_7.5x15.4mm_P1.27mm
  • 3D model: SOIC-24-300mil (KiCad packages3D, STEP)
  • 3D model files: fm1702sl-etched.step / fm1702sl-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fm1702sl.step / fm1702sl.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: FUDAN MICRO datasheet (110 pp, sha256 7d98db131605935d, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF