component

FIN1104MTCX

Public Made by Adom

by adom

onsemi Signal Buffers, Repeaters, Splitters, TSSOP-24. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentinterface icsfin1104mtcxfactory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
fin1104mtcx / README.md
History Download
Ray Publish 0.1.0 8742c74 12d ago

FIN1104MTCX

onsemi · Signal Buffers, Repeaters, Splitters · TSSOP-24

FIN1104MTCX from onsemi, in a TSSOP-24. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground.
2 GND power_in Ground.
3 RIN1- input Inverting LVDS input of channel 1, with common mode range from 0V +
4 RIN1+ input Non-inverting LVDS input of channel 1, with common mode range from 0V +
5 RIN2+ input Non-inverting LVDS input of channel 2, with common mode range from 0V +
6 RIN2- input Inverting LVDS input of channel 2, with common mode range from 0V +
7 RIN3- input Inverting LVDS input of channel 3, with common mode range from 0V +
8 RIN3+ input Non-inverting LVDS input of channel 3, with common mode range from 0V +
9 RIN4+ input Non-inverting LVDS input of channel 4, with common mode range from 0V +
10 RIN4- input Inverting LVDS input of channel 4, with common mode range from 0V +
11 EN input Driver enable pin for all outputs; outputs are enabled when EN is HIGH (VIH 2.0V to VCC) and /EN is LOW.
12 GND power_in Ground.
13 VBB power_out Reference voltage output for AC coupling of the inputs, 1.2V typical at VCC = 3.3V with IBB = 0 to -275 µA.
14 VCC power_in Power supply, 3.0V to 3.6V recommended operating range.
15 DOUT4- output Inverting LVDS driver output of channel 4, typical 330 mV differential swing into 100 ohm.
16 DOUT4+ output Non-inverting LVDS driver output of channel 4, typical 330 mV differential swing into 100 ohm.
17 DOUT3+ output Non-inverting LVDS driver output of channel 3, typical 330 mV differential swing into 100 ohm.
18 DOUT3- output Inverting LVDS driver output of channel 3, typical 330 mV differential swing into 100 ohm.
19 DOUT2- output Inverting LVDS driver output of channel 2, typical 330 mV differential swing into 100 ohm.
20 DOUT2+ output Non-inverting LVDS driver output of channel 2, typical 330 mV differential swing into 100 ohm.
21 DOUT1+ output Non-inverting LVDS driver output of channel 1, typical 330 mV differential swing into 100 ohm.
22 DOUT1- output Inverting LVDS driver output of channel 1, typical 330 mV differential swing into 100 ohm.
23 /EN input Inverting driver enable pin for all outputs; outputs are enabled when /EN is LOW (VIL GND to 0.8V) and EN is HIGH.
24 VCC power_in Power supply, 3.0V to 3.6V recommended operating range.

Key specifications

Parameter Value
Manufacturer onsemi
Package TSSOP-24
Category Interface ICs
Pins 24

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (VCC) VCC -0.5 4.6 V 4
LVDS DC Input Voltage VIN -0.5 4.6 V 4
LVDS DC Output Voltage VOUT -0.5 4.6 V 4
Driver Short Circuit Current IOSD 10 mA Continuous 4
Storage Temperature Range TSTG -65 150 °C 4
Max Junction Temperature TJ 150 °C 4
Lead Temperature TL 260 °C Soldering, 10 seconds 4
ESD (Human Body Model) 7500 V Human Body Model 4
ESD (Machine Model) 400 V Machine Model 4
Supply Voltage (VCC) VCC 3 3.6 V 4
Magnitude of Differential Voltage /VID/ 100 mV Maximum printed as VCC 4
Operating Temperature TA -40 85 °C 4
Differential Input Threshold HIGH VTH 100 mV See Figure 1; VIC = +0.05V, +1.2V, or VCC − 0.05V 4
Differential Input Threshold LOW VTL -100 mV See Figure 1; VIC = +0.05V, +1.2V, or VCC − 0.05V 4
Input HIGH Voltage (EN or EN) VIH 2 V EN or EN 4
Input LOW Voltage (EN or EN) VIL 0.8 V EN or EN 4
Output Differential Voltage VOD 250 330 450 mV RL = 100 Ω, Driver Enabled, See Figure 2 4
Offset Voltage VOS 1.125 1.23 1.375 V See Figure 2 4
Input Current (EN, EN, DINx+, DINx−) IIN -20 20 µA VIN = 0V to VCC, Other Input = VCC or 0V (for Differential Inputs) 4
Power Off Input or Output Current IOFF -20 20 µA VCC = 0V, VIN or VOUT = 0V to 3.6V 4
Disabled Power Supply Current ICCZ 5.4 11 mA Drivers Disabled 4
Power Supply Current ICC 30.4 41 mA Drivers Enabled, Any Valid Input Condition 4
Disabled Output Leakage Current IOZ -20 20 µA Driver Disabled, DOUT+ = 0V to 3.6V or DOUT− = 0V to3.6V 4
Output Reference Voltage VBB 1.125 1.2 1.375 V VCC = 3.3V, IBB = 0 to −275 µA 4
Differential Output Propagation Delay LOW-to-HIGH tPLHD 0.75 1.1 1.75 ns RL = 100 Ω, CL = 5 pF, VID = 200 mV to 450 mV, VIC = /VID//2 to VCC − (/VID//2) 5
Differential Output Propagation Delay HIGH-to-LOW tPHLD 0.75 1.1 1.75 ns RL = 100 Ω, CL = 5 pF, VID = 200 mV to 450 mV, VIC = /VID//2 to VCC − (/VID//2) 5
Differential Output Rise Time (20% to 80%) tTLHD 0.29 0.4 0.58 ns RL = 100 Ω, CL = 5 pF, VID = 200 mV to 450 mV, VIC = /VID//2 to VCC − (/VID//2) 5
Differential Output Fall Time (80% to 20%) tTHLD 0.29 0.4 0.58 ns RL = 100 Ω, CL = 5 pF, VID = 200 mV to 450 mV, VIC = /VID//2 to VCC − (/VID//2) 5
Pulse Skew tSK(P) 0.02 0.2 ns Duty Cycle = 50% 5
Channel-to-Channel Skew tSK(LH) 0.02 0.15 ns See Figure 1 and Figure 3 (Note 4) 5
Part-to-Part Skew tSK(PP) 0.5 ns Note 5 5
Maximum Frequency fMAX 400 800 MHz Note 6, Note 7 5
Differential Output Enable Time from Z to HIGH tPZHD 2.2 5 ns RL = 100 Ω, CL = 5 pF, See Figure 2 and Figure 3 5
Differential Output Enable Time from Z to LOW tPZLD 2.5 5 ns RL = 100 Ω, CL = 5 pF, See Figure 2 and Figure 3 5
Differential Output Disable Time from HIGH to Z tPHZD 1.8 5 ns RL = 100 Ω, CL = 5 pF, See Figure 2 and Figure 3 5
Differential Output Disable Time from LOW to Z tPLZD 2.1 5 ns RL = 100 Ω, CL = 5 pF, See Figure 2 and Figure 3 5
LVDS Data Jitter, Deterministic tDJ 85 135 ps VID = 300 mV, PRBS = 223 - 1, VIC = 1.2V at 800 Mbps 5
LVDS Clock Jitter, Random (RMS) tRJ 2.1 3.5 ps VID = 300 mV, VIC = 1.2V at 400 MHz 5

CAD (KiCad official)

  • Symbol: FIN1104MTCX
  • Footprint: Package_SO:TSSOP-24_4.4x7.8mm_P0.65mm
  • 3D model: TSSOP-24 (KiCad packages3D, STEP)
  • 3D model files: fin1104mtcx-etched.step / fin1104mtcx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fin1104mtcx.step / fin1104mtcx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 6e1da5313e3644ff, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF