component
FIN1027AMX
Public Made by Adomby adom
onsemi LVDS ICs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownFIN1027AMX
onsemi · LVDS ICs · SOIC-8
FIN1027AMX from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Power supply, recommended 3.0V to 3.6V. |
| 2 | DIN1 | input | LVTTL data input for driver 1; recommended input range 0 to VCC, with VIH 2.0V min and VIL 0.8V max. |
| 3 | DIN2 | input | LVTTL data input for driver 2; recommended input range 0 to VCC, with VIH 2.0V min and VIL 0.8V max. |
| 4 | GND | power_in | Ground. |
| 5 | DOUT2- | output | Inverting LVDS driver output for channel 2, with typical differential output swing of 350mV. |
| 6 | DOUT2+ | output | Non-inverting LVDS driver output for channel 2, with typical differential output swing of 350mV. |
| 7 | DOUT1- | output | Inverting LVDS driver output for channel 1 (FIN1027A SOIC pin assignment), with typical differential output swing of 350mV. |
| 8 | DOUT1+ | output | Non-inverting LVDS driver output for channel 1 (FIN1027A SOIC pin assignment), with typical differential output swing of 350mV. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOIC-8 |
| Category | Interface ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VCC | -0.5 | 4.6 | V | 4 | ||
| DC Input Voltage | DIN | -0.5 | 6 | V | 4 | ||
| DC Output Voltage | DOUT | -0.5 | 4.7 | V | 4 | ||
| Storage Temperature Range | TSTG | -65 | 150 | °C | 4 | ||
| Maximum Junction Temperature | TJ | 150 | °C | 4 | |||
| Lead Temperature, Soldering, 10 Seconds | TL | 260 | °C | 4 | |||
| ESD Human Body Model | ESD | 6500 | V | Human Body Model, JESD22-A114 (≥6500) | 4 | ||
| ESD Machine Model | ESD | 400 | V | Machine Model, JESD22-A115 (≥400) | 4 | ||
| Supply Voltage | VCC | 3 | 3.6 | V | 4 | ||
| Input Voltage | VIN | 0 | V | 0 to VCC | 4 | ||
| Operating Temperature | TA | -40 | 85 | °C | 4 | ||
| Output Differential Voltage | VOD | 250 | 350 | 450 | mV | RL = 100Ω, Figure 4 | 5 |
| VOD Magnitude Change from Differential LOW-to-HIGH | ΔVOD | 25 | mV | RL = 100Ω, Figure 4 | 5 | ||
| Offset Voltage | VOS | 1.125 | 1.25 | 1.375 | V | RL = 100Ω, Figure 4 | 5 |
| Offset Magnitude Change from Differential LOW-to-HIGH | ΔVOS | 25 | mV | RL = 100Ω, Figure 4 | 5 | ||
| Power-Off Output Current | IOFF | -20 | 20 | µA | VCC = 0V, VOUT = 0V or 3.6V | 5 | |
| Short-Circuit Output Current | IOS | -8 | mA | VOUT = 0V | 5 | ||
| Short-Circuit Output Current | IOS | -8 | 8 | mA | VOD = 0V | 5 | |
| Input HIGH Voltage | VIH | 2 | V | max VCC | 5 | ||
| Input LOW Voltage | VIL | 0.8 | V | min GND | 5 | ||
| Input Current | IIN | -20 | 20 | µA | VIN = 0V or VCC | 5 | |
| Power-Off Input Current | II(OFF) | -20 | 20 | µA | VCC = 0V, VIN = 0V or 3.6V | 5 | |
| Input Clamp Voltage | VIK | -1.5 | V | IIK = -18mA | 5 | ||
| Power Supply Current | ICC | 12.5 | mA | No Load, VIN = 0V or VCC | 5 | ||
| Power Supply Current | ICC | 17 | mA | RL = 100Ω, VIN = 0V or VCC | 5 | ||
| Input Capacitance | CIN | 4 | pF | 5 | |||
| Output Capacitance | COUT | 6 | pF | 5 | |||
| Differential Propagation Delay, LOW-to-HIGH | tPLHD | 0.5 | 1.5 | ns | RL = 100Ω, CL = 10pF, Figure 5, Figure 6 | 5 | |
| Differential Propagation Delay, HIGH-to-LOW | tPHLD | 0.5 | 1.5 | ns | RL = 100Ω, CL = 10pF, Figure 5, Figure 6 | 5 | |
| Differential Output Rise Time (20% to 80%) | tTLHD | 0.4 | 1 | ns | RL = 100Ω, CL = 10pF, Figure 5, Figure 6 | 5 | |
| Differential Output Fall Time (80% to 20%) | tTHLD | 0.4 | 1 | ns | RL = 100Ω, CL = 10pF, Figure 5, Figure 6 | 5 | |
| Pulse Skew /tPLH - tPHL/ | tSK(P) | 0.5 | ns | RL = 100Ω, CL = 10pF, Figure 5, Figure 6 | 5 | ||
| Channel-to-Channel Skew | tSK(LH), tSK(HL) | 0.3 | ns | RL = 100Ω, CL = 10pF, Figure 5, Figure 6 | 5 | ||
| Part-to-Part Skew | tSK(PP) | 1 | ns | RL = 100Ω, CL = 10pF, Figure 5, Figure 6 | 5 |
CAD (KiCad official)
- Symbol:
FIN1027AMX - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
fin1027amx-etched.step/fin1027amx-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fin1027amx.step/fin1027amx.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (13 pp, sha256
fe975690826cd52e, retrieved 2026-10-23, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).