component
FH8913P
Public Made by Adomby adom
XIN FEI HONG MOSFETs, SO-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 27d ago |
| viewers | 27d ago |
| fh8913p-etched.glb | 27d ago |
| fh8913p-etched.step | 27d ago |
| fh8913p-hero.glb | 27d ago |
| fh8913p-hero.overlay.json | 27d ago |
| fh8913p.glb | 27d ago |
| fh8913p.kicad_mod | 27d ago |
| fh8913p.kicad_sym | 27d ago |
| fh8913p.lbr | 27d ago |
| fh8913p.step | 27d ago |
| package.json | 27d ago |
| page.json | 23d ago |
| README.md | 23d ago |
FH8913P
XIN FEI HONG · MOSFETs · SO-8
FH8913P from XIN FEI HONG, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S2 | passive | Source of P-channel MOSFET 2 (VDS rated -30V, continuous ID -11A). |
| 2 | G2 | input | Gate of P-channel MOSFET 2 (VGS maximum ±20V). |
| 3 | S1 | passive | Source of P-channel MOSFET 1 (VDS rated -30V, continuous ID -11A). |
| 4 | G1 | input | Gate of P-channel MOSFET 1 (VGS maximum ±20V). |
| 5 | D1 | passive | Drain of P-channel MOSFET 1 (pulsed drain current IDM -44A). |
| 6 | D1 | passive | Drain of P-channel MOSFET 1, tied to pin 5 (pulsed drain current IDM -44A). |
| 7 | D2 | passive | Drain of P-channel MOSFET 2 (pulsed drain current IDM -44A). |
| 8 | D2 | passive | Drain of P-channel MOSFET 2, tied to pin 7 (pulsed drain current IDM -44A). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | XIN FEI HONG |
| Package | SO-8 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -30 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous Drain Current | ID | -11 | A | TA=25℃, VGS @ -10V | 1 | ||
| Continuous Drain Current | ID | -9 | A | TA=70℃, VGS @ -10V | 1 | ||
| Pulsed Drain Current | IDM | -44 | A | 1 | |||
| Single Pulse Avalanche Energy | EAS | 78 | mJ | 1 | |||
| Avalanche Current | IAS | -30 | A | 1 | |||
| Total Power Dissipation | PD | 1.5 | W | TA=25℃ | 1 | ||
| Storage Temperature Range | TSTG | -55 | 150 | ℃ | 1 | ||
| Operating Junction Temperature Range | TJ | -55 | 150 | ℃ | 1 | ||
| Thermal Resistance Junction-Ambient | RθJA | 75 | ℃/W | 1 | |||
| Thermal Resistance Junction-Ambient | RθJA | 40 | ℃/W | t≦10s | 1 | ||
| Thermal Resistance Junction-Case | RθJC | 24 | ℃/W | 1 | |||
| Drain-Source Breakdown Voltage | BVDSS | -30 | V | VGS=0V, ID=-250uA | 2 | ||
| Static Drain-Source On-Resistance | RDS(ON) | 12 | 14 | mΩ | VGS=-10V, ID=-10A | 2 | |
| Static Drain-Source On-Resistance | RDS(ON) | 18 | 23 | mΩ | VGS=-4.5V, ID=-5A | 2 | |
| Gate Threshold Voltage | VGS(th) | -1 | -1.6 | -2.5 | V | VGS=VDS, ID=-250uA | 2 |
| Drain-Source Leakage Current | IDSS | -1 | uA | VDS=-30V, VGS=0V, TJ=25℃ | 2 | ||
| Drain-Source Leakage Current | IDSS | -5 | uA | VDS=-30V, VGS=0V, TJ=55℃ | 2 | ||
| Gate-Source Leakage Current | IGSS | -100 | 100 | nA | VGS=±20V, VDS=0V | 2 | |
| Continuous Source Current | IS | -11 | A | VG=VD=0V, Force Current | 2 | ||
| Pulsed Source Current | ISM | -44 | A | 2 | |||
| Diode Forward Voltage | VSD | -1 | V | VGS=0V, IS=-1A, TJ=25℃ | 2 | ||
| BVDSS Temperature Coefficient | ΔBVDSS/ΔTJ | -0.023 | V/℃ | Reference to 25℃, ID=-1mA | 2 | ||
| VGS(th) Temperature Coefficient | ΔVGS(th) | 4.6 | mV/℃ | 2 | |||
| Forward Transconductance | gfs | 24 | S | VDS=-5V, ID=-5A | 2 | ||
| Gate Resistance | Rg | 9 | VDS=0V, VGS=0V, f=1MHz | 2 | |||
| Total Gate Charge (-4.5V) | Qg | 22 | nC | VDS=-15V, VGS=-4.5V, ID=-5A | 2 | ||
| Gate-Source Charge | Qgs | 5.1 | nC | 2 | |||
| Gate-Drain Charge | Qgd | 7.3 | nC | 2 | |||
| Turn-On Delay Time | Td(on) | 33.8 | ns | VDD=-15V, VGS=-10V, RG=3.3, ID=-1A | 2 | ||
| Rise Time | Tr | 35.8 | ns | 2 | |||
| Turn-Off Delay Time | Td(off) | 72.8 | ns | 2 | |||
| Fall Time | Tf | 10.6 | ns | 2 | |||
| Input Capacitance | Ciss | 1480 | pF | VDS=-15V, VGS=0V, f=1MHz | 2 | ||
| Output Capacitance | Coss | 310 | pF | 2 | |||
| Reverse Transfer Capacitance | Crss | 237 | pF | 2 |
CAD (KiCad official)
- Symbol:
FH8913P - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files:
fh8913p-etched.step/fh8913p-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fh8913p.step/fh8913p.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: XIN FEI HONG datasheet (5 pp, sha256
04ab7b9e554d167e, retrieved 2026-10-10, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).