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FH8902K

鑫飞宏 · IC · SOT-23-6

FH8902K from 鑫飞宏, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source of MOSFET 1 (N-channel, VDS 30 V, ID 5 A continuous).
2 D1/D2 passive Common drain of MOSFET 1 and MOSFET 2, internally connected to pin 5 (VDS 30 V, ID 5 A, IDM 20 A pulsed).
3 S2 passive Source of MOSFET 2 (N-channel, VDS 30 V, ID 5 A continuous).
4 G2 input Gate of MOSFET 2, VGS max ±20 V, threshold 1.0 to 1.9 V at 250 μA.
5 D1/D2 passive Common drain of MOSFET 1 and MOSFET 2, internally connected to pin 2 (VDS 30 V, ID 5 A, IDM 20 A pulsed).
6 G1 input Gate of MOSFET 1, VGS max ±20 V, threshold 1.0 to 1.9 V at 250 μA.

Key specifications

Parameter Value
Manufacturer 鑫飞宏
Package SOT-23-6
Category
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 30 V 1
Gate-Source Voltage VGS -20 20 V 1
Gate-Drain Voltage VGD -20 20 V 1
Drain Current-Continuous ID 5 A @ TJ=25℃ 1
Pulsed Drain Current IDM 20 A Pulsed (note b: pulse width ≤300μs, duty cycle ≤2%) 1
Drain-Source Diode Forward Current IS 2.5 A 1
Maximum Power Dissipation PD 1.25 W Note a: surface mounted on FR4 board, T<10 sec 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance, Junction-to-Ambient RθJA 98 ℃/W Note a: surface mounted on FR4 board, T<10 sec 1
Drain-Source Breakdown Voltage BVDSS 30 V VGS=0V ID=250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=30V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Gate Threshold Voltage VGS(th) 1 1.5 1.9 V VDS=VGS, ID=250μA 2
Drain-Source On-State Resistance RDS(ON) 16 24 mΩ VGS=10V, ID=4.5A 2
Drain-Source On-State Resistance RDS(ON) 20 28 mΩ VGS=4.5V, ID=3.5A 2
Diode Forward Voltage VSD 1.2 V VGS=0V,IS=2A 2

CAD (KiCad official)

  • Symbol: FH8902K
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: fh8902k-etched.step / fh8902k-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fh8902k.step / fh8902k.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: 鑫飞宏 datasheet (6 pp, sha256 495bfcbf5609af03, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF