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Contents

README

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FH8810

XIN FEI HONG · MOSFETs · SOT-23-6

FH8810 from XIN FEI HONG, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source of MOSFET 1 (pin-1 marker side), part of a dual N-channel 20V device.
2 D1/D2 passive Common drain of MOSFET 1 and MOSFET 2, internally tied together (D1 and D2 joined in the schematic).
3 S2 passive Source of MOSFET 2.
4 G2 input Gate of MOSFET 2, ESD protected (2000V HBM), absolute maximum VGS ±8V, logic-level drive down to 1.8V.
5 D1/D2 passive Common drain of MOSFET 1 and MOSFET 2, internally tied together (D1 and D2 joined in the schematic).
6 G1 input Gate of MOSFET 1, ESD protected (2000V HBM), absolute maximum VGS ±8V, logic-level drive down to 1.8V.

Key specifications

Parameter Value
Manufacturer XIN FEI HONG
Package SOT-23-6
Category Triode/MOS Tube/Transistor
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source On-State Resistance (VGS=4.5V, ID=4A) RDS(ON) 18 mΩ VGS=4.5V,ID=4A 2
Drain-Source On-State Resistance (VGS=2.5V, ID=3A) RDS(ON) 23 mΩ VGS=2.5V,ID=3A 2
Drain-Source On-State Resistance (VGS=1.8V, ID=3A) RDS(ON) 29 mΩ VGS=1.8V,ID=3A 2
Drain-Source Voltage VDS 20 V 1
Gate-Source Voltage VGS -8 8 V 1
Drain Current-Continuous ID 8 A 1
Drain Current-Pulsed IDM 30 A Note 1 1
Maximum Power Dissipation PD 1.25 W 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance, Junction-to-Ambient RθJA 83 ℃/W Note 2 1
Drain-Source Breakdown Voltage BVDSS 20 V VGS=0V ID=250μA 2
Gate-Body Leakage Current IGSS -10 10 μA VGS=±8V,VDS=0V 2
Gate Threshold Voltage VGS(th) 0.4 0.7 1 V VDS=VGS,ID=250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=20V,VGS=0V 2
Diode Forward Voltage VSD 1.2 V VGS=0V,IS=1A 2
Diode Forward Current IS 3 A Note 2 2

CAD (KiCad official)

  • Symbol: FH8810
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: fh8810-etched.step / fh8810-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fh8810.step / fh8810.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XIN FEI HONG datasheet (6 pp, sha256 f9f55e5027035633, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF