component
FH8609A2
Public Made by Adomby adom
鑫飞宏 Battery Management, SOT-23-5. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownFH8609A2
鑫飞宏 · Battery Management · SOT-23-5
FH8609A2 from 鑫飞宏, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin; connect the negative terminal of the battery to this pin. |
| 2 | GND | power_in | Ground pin; connect the negative terminal of the battery to this pin (shared with pin 1). |
| 3 | VDD | power_in | Power supply pin; VDD input pin voltage is limited to -0.3 V to 6 V per the absolute maximum ratings. |
| 4 | VM | passive | Negative terminal of the battery pack; the internal FET switch connects this terminal to GND, and VM input pin voltage is limited to -6 V to 10 V per the absolute maximum ratings. |
| 5 | VM | passive | Negative terminal of the battery pack; the internal FET switch connects this terminal to GND (shared with pin 4), and VM input pin voltage is limited to -6 V to 10 V per the absolute maximum ratings. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | 鑫飞宏 |
| Package | SOT-23-5 |
| Category | Power Management (PMIC) |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Overdischarge Current Detection | IIOV1 | 6 | 9 | 12 | A | 4 | |
| Overdischarge Current Recovery | IROV1 | 8.5 | 25 | 40 | µA | VDD=3.6V | 4 |
| Overcharge Current Detection | ICHOC | 4 | 6 | 8 | A | VDD=3.6V | 4 |
| Load Short-Circuiting Detection | ISHORT | 20 | 35 | 60 | A | 4 | |
| Current Consumption in Normal Operation | IOPE | 3.9 | 6 | µA | VM pin floating | 4 | |
| Current Consumption in Power Down | IPD | 2.2 | 4 | µA | VM pin floating | 4 | |
| Internal Resistance between VM and VDD | RVMD | 200 | 300 | 400 | kΩ | 4 | |
| Internal Resistance between VM and GND | RVMS | 15 | 25 | 35 | kΩ | VM pin floating | 4 |
| Equivalent FET on Resistance | RSS(ON) | 16.5 | 25 | mΩ | VDD=3.6V IVM=1.0A | 4 | |
| Overcharge Voltage Detection Delay Time | tCU | 80 | 130 | 180 | mS | 4 | |
| Overdischarge Voltage Detection Delay Time | tDL | 20 | 40 | 60 | mS | 4 | |
| Overdischarge Current1 Detection Delay Time | tIOV1 | 4 | 8 | 18 | mS | 4 | |
| Overcharge Current Detection Delay Time | tCHOC | 5 | 10 | 20 | mS | VDD=3.6V | 4 |
| Load Short-Circuiting Detection Delay Time | tSHORT | 50 | 300 | 600 | µS | 4 | |
| Overcharge Detection Voltage | VCU | 4.25 | 4.3 | 4.35 | V | 4 | |
| Overcharge Release Voltage | VCL | 4 | 4.1 | 4.2 | V | 4 | |
| Overdischarge Detection Voltage | VDL | 2.3 | 2.4 | 2.5 | V | 4 | |
| Overdischarge Release Voltage | VDR | 2.9 | 3 | 3.1 | V | 4 | |
| VDD input pin voltage | -0.3 | 6 | V | 3 | |||
| VM input pin voltage | -6 | 10 | V | 3 | |||
| Operating Ambient Temperature | -40 | 85 | °C | 3 | |||
| Maximum Junction Temperature | 150 | °C | 3 | ||||
| Storage Temperature | -55 | 150 | °C | 3 | |||
| Lead Temperature (Soldering, 10 sec) | 300 | °C | Soldering, 10 sec | 3 | |||
| Power Dissipation at T=25°C | 0.4 | W | T=25°C | 3 | |||
| HBM ESD | 2000 | V | HBM | 3 | |||
| External capacitor C1 (value range) | C1 | 0.1 | 0.1 | 2.2 | μF | Typical application external component range | 10 |
| External resistor R1 (value range) | R1 | 0.47 | 1 | 2 | KΩ | Typical application external component range | 10 |
| Over Temperature Protection | TSHD+ | 150 | ˚C | 4 | |||
| Over Temperature Recovery Degree | TSHD- | 110 | ˚C | 4 | |||
| Package Thermal Resistance (Junction to Ambient) | θJA | 250 | °C/W | Junction to ambient | 3 | ||
| Package Thermal Resistance (Junction to Case) | θJC | 130 | °C/W | Junction to case | 3 |
CAD (KiCad official)
- Symbol:
FH8609A2 - Footprint:
Package_TO_SOT_SMD:SOT-23-5 - 3D model: SOT-23-5 (KiCad packages3D, STEP)
- 3D model files:
fh8609a2-etched.step/fh8609a2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fh8609a2.step/fh8609a2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: 鑫飞宏 datasheet (14 pp, sha256
00c1db7c876c4434, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).