component
FH8221G2
Public Made by Adomby adom
XIN FEI HONG Battery Management ICs, DFN-6L(2x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownFH8221G2
XIN FEI HONG · Battery Management ICs · DFN-6L(2x3)
FH8221G2 from XIN FEI HONG, in a DFN-6L(2x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Power ground, connected to the negative terminal of the battery (pins 1 and 2 are both GND). |
| 2 | GND | power_in | Power ground, connected to the negative terminal of the battery (pins 1 and 2 are both GND). |
| 3 | VDD | power_in | Power supply input, connected to the positive terminal of the battery; supply range 1.5V to 10V, absolute maximum -0.3V to +10V. |
| 4 | VM | input | Charge/discharge current detection input; allowed input voltage VDD-20V to VDD+0.3V. |
| 5 | P- | bidirectional | Connection to the negative terminal of the charger or load (pins 5 and 6 are both P-). |
| 6 | P- | bidirectional | Connection to the negative terminal of the charger or load (pins 5 and 6 are both P-). |
| 7 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | XIN FEI HONG |
| Package | DFN-6L(2x3) |
| Category | Power Supply Chip |
| Pins | 7 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC | 1.5 | 10 | V | 4 | ||
| Short-circuit protection threshold | VSHORT | 0.7 | 1 | 1.3 | V | Voltage of VM | 4 |
| Short-circuit protection delay | tSHORT | 20 | 50 | 100 | μs | 4 | |
| Discharge overcurrent recovery delay | tEDIR | 1.2 | 1.8 | 2.4 | ms | 4 | |
| Charge overcurrent recovery delay | tECIR | 1.2 | 1.8 | 2.4 | ms | 4 | |
| Pull-up resistance VM to VCC | RVMD | 100 | 300 | 900 | kΩ | VCC =1.8V, VM=0V | 4 |
| Pull-down resistance VM to GND | RVMS | 15 | 30 | 45 | kΩ | 4 | |
| Supply current | ICC | 2 | 6 | μA | VCC =3.9V | 4 | |
| Low-power mode current | IPDWN | 0.7 | 1 | μA | VCC =2.0V | 4 | |
| MOSFET drain-source breakdown voltage | BVDS | 19.5 | V | VGS=0, ID=250μA | 4 | ||
| MOSFET on-resistance | RSS(ON) | 18 | 21 | mΩ | VGS=3.7V, IO=1A | 4 | |
| MOSFET on-resistance | RSS(ON) | 22 | 25 | mΩ | VGS=2.7V, IO=1A | 4 | |
| Drain-source leakage current | IDSS | 1 | μA | VDS=19V, VGS=0V, Tj=25oC | 4 | ||
| Supply voltage VDD | VDD | -0.3 | 10 | V | 3 | ||
| Operating temperature | TA | -40 | 85 | ℃ | 3 | ||
| Drain-source voltage | 20 | V | 3 | ||||
| Continuous drain current | 5 | A | TA=25℃ | 3 | |||
| Pulsed drain current | 25 | A | 3 | ||||
| Storage temperature | -55 | 125 | ℃ | 3 | |||
| Power dissipation | PD | 1.5 | W | TA=25℃, DFN2x3-6L | 3 | ||
| Soldering temperature | 260 | ℃ | 10 s | 3 | |||
| ESD (human body model) | 2 | kV | 3 | ||||
| Thermal resistance junction to ambient | θJA | 80 | ℃/W | DFN2x3-6L | 3 | ||
| Breakdown voltage temperature coefficient | ΔBVDS/ΔTj | 0.1 | V/oC | Reference to 25oC, ID=1mA | 4 | ||
| 0V charge allow voltage | V0V_CHG | 1.2 | V | Charger Voltage | 4 | ||
| 0V charge inhibit threshold | V0V_INH | 1.2 | V | Battery Voltage, VM=-2.0V | 4 | ||
| Continuous current | IGP | 3.5 | A | Tj=25oC | 4 |
CAD (KiCad official)
- Symbol:
FH8221G2 - Footprint:
Package_DFN_QFN:DFN-6-1EP_3x2mm_P0.5mm_EP1.65x1.35mm - 3D model: DFN-6L(2x3), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal QFN height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
fh8221g2-etched.step/fh8221g2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fh8221g2.step/fh8221g2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: XIN FEI HONG datasheet (10 pp, sha256
c72cf35c7318a4a9, retrieved 2026-10-22, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).