main
Ray Publish 0.1.0 6146494

FH20X153K302EGG

PSA Prosperity Dielectrics · Safety Capacitors · 2220

FH20X153K302EGG from PSA Prosperity Dielectrics, in a 2220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised capacitor; either orientation.
2 2 passive Terminal 2 of an unpolarised capacitor; either orientation.

Key specifications

Parameter Value
Manufacturer PSA Prosperity Dielectrics
Package 2220
Category Capacitors
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Capacitance tolerance (code K) -10 10 % Tolerance code K; 1.0±0.2Vrms, 1.0KHz±10%, 25°C 3
Capacitance change over temperature (X7R) -15 15 % X7R; -55 to 125°C, ref. 25°C, no electrical load 6
Dissipation factor (D.F.) D.F. 2.5 % Class II X7R; 1.0±0.2Vrms, 1KHz±10% 4
Insulation resistance IR 10 GΩ X7R; whichever is smaller than RxC≥500Ω-F 4
Insulation resistance RxC product RxC 500 Ω-F X7R; whichever is smaller than 10GΩ 4
Rated voltage 250 Vac FH (X2 class) 2220 X7R, per page 1 description and section 6 4
Capacitance change after damp heat -15 15 % X7R; 40±2°C, 90-95% RH, 500 hrs, 250Vac applied 7
Dissipation factor after damp heat D.F. 5 % X7R; 40±2°C, 90-95% RH, 500 hrs 7
Insulation resistance after damp heat IR 1 GΩ Whichever is smaller than RxC≥25Ω-F 7
Insulation resistance RxC after damp heat RxC 25 Ω-F Whichever is smaller than 1GΩ 7
Capacitance change after resistance to soldering heat -7.5 7.5 % X7R; solder 260±5°C, dipping 10±1 s 6
Insulation resistance after soldering heat IR 1 GΩ After resistance to soldering heat test 6
Capacitance change after temperature cycle -7.5 7.5 % X7R; 5 cycles between min and max operating temperature 7
Dissipation factor after temperature cycle D.F. 150 % of initial requirement X7R 7
Capacitance change after high temperature load -20 20 % X7R; 125±3°C, 1000 hrs, X capacitor 1.25UR (312.5Vac) 7
Dissipation factor after high temperature load D.F. 5 % X7R; 125±3°C, 1000 hrs 7
Insulation resistance after high temperature load IR 1 GΩ After high temperature load test 7
Capacitance change after resistance to flexure of substrate -12.5 12.5 % X7R; board bent 1mm at 1mm/s 8
Operating temperature -55 125 °C 4
Storage temperature 5 40 °C Recommended storage indoors, no harmful gases 10
Storage relative humidity RH 20 70 % Recommended storage indoors 10
Preheat rate 3 °C/s Before soldering; should not exceed 10
Nominal capacitance C 15000 pF Code 153 (15 nF), X7R 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin without lead or cadmium. The terminations are composed of plated nickel and pure tin to feature the superior leaching resistance 3

CAD (KiCad official)

  • Symbol: FH20X153K302EGG
  • Footprint: Capacitor_SMD:C_2220_5750Metric
  • 3D model: 2220 (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: PSA Prosperity Dielectrics datasheet (11 pp, sha256 232ffe2be7361056, retrieved 2026-11-06, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF