component
FGA40N65SMD
Public Made by Adomby adom
onsemi IGBT Transistors / Modules, TO-3P. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
FGA40N65SMD
onsemi · IGBT Transistors / Modules · TO-3P
FGA40N65SMD from onsemi, in a TO-3P. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-emitter voltage is rated ±20 V continuous and ±30 V transient, with a typical threshold VGE(th) of 4.5 V at IC = 250 µA. |
| 2 | C | passive | Collector (also the mounting tab); collector-emitter voltage is rated 650 V and collector current is 80 A at TC = 25°C and 40 A at TC = 100°C. |
| 3 | E | passive | Emitter; the anti-parallel diode carries 40 A forward current at TC = 25°C and 20 A at TC = 100°C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | TO-3P |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Collector-emitter voltage | VCES | 650 | V | 2 | |||
| Gate-emitter voltage | VGES | -20 | 20 | V | 2 | ||
| Transient gate-emitter voltage | VGES | -30 | 30 | V | transient | 2 | |
| Collector current | IC | 80 | A | TC = 25°C | 2 | ||
| Collector current | IC | 40 | A | TC = 100°C | 2 | ||
| Pulsed collector current | ICM | 120 | A | Repetitive rating: pulse width limited by max junction temperature | 2 | ||
| Diode forward current | IF | 40 | A | TC = 25°C | 2 | ||
| Diode forward current | IF | 20 | A | TC = 100°C | 2 | ||
| Diode maximum forward pulsed current | IFM | 120 | A | Repetitive rating: pulse width limited by max junction temperature | 2 | ||
| Maximum power dissipation | PD | 349 | W | TC = 25°C | 2 | ||
| Maximum power dissipation | PD | 174 | W | TC = 100°C | 2 | ||
| Operating junction temperature | TJ | -55 | 175 | °C | 2 | ||
| Storage temperature range | Tstg | -55 | 175 | °C | 2 | ||
| Maximum lead temperature for soldering | TL | 300 | °C | 1/8 inch from case, 5 seconds | 2 | ||
| Thermal resistance, junction to case (IGBT) | RθJC(IGBT) | 0.43 | °C/W | 3 | |||
| Thermal resistance, junction to case (diode) | RθJC(Diode) | 1.5 | °C/W | 3 | |||
| Thermal resistance, junction to ambient | RθJA | 40 | °C/W | 3 | |||
| Collector-emitter breakdown voltage | BVCES | 650 | V | VGE = 0 V, IC = 250 μA | 3 | ||
| Collector cut-off current | ICES | 250 | μA | VCE = VCES, VGE = 0 V | 3 | ||
| G-E leakage current | IGES | -400 | 400 | nA | VGE = VGES, VCE = 0 V | 3 | |
| G-E threshold voltage | VGE(th) | 3.5 | 4.5 | 6 | V | IC = 250 μA, VCE = VGE | 3 |
| Collector-emitter saturation voltage | VCE(sat) | 1.9 | 2.5 | V | IC = 40 A, VGE = 15 V | 3 | |
| Gate charge, total | Qg | 119 | 180 | nC | VCE = 400 V, IC = 40 A, VGE = 15 V | 4 | |
| Gate-emitter charge | Qge | 13 | 20 | nC | VCE = 400 V, IC = 40 A, VGE = 15 V | 4 | |
| Gate-collector charge | Qgc | 58 | 90 | nC | VCE = 400 V, IC = 40 A, VGE = 15 V | 4 | |
| Turn-on delay time | td(on) | 12 | 16 | ns | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 25°C | 3 | |
| Rise time | tr | 20 | 28 | ns | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 25°C | 3 | |
| Turn-off delay time | td(off) | 92 | 120 | ns | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 25°C | 3 | |
| Fall time | tf | 13 | 17 | ns | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 25°C | 3 | |
| Turn-on switching loss | Eon | 0.82 | 1.23 | mJ | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 25°C | 3 | |
| Turn-off switching loss | Eoff | 0.26 | 0.34 | mJ | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 25°C | 3 | |
| Total switching loss | Ets | 1.08 | 1.57 | mJ | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 25°C | 3 | |
| Diode forward voltage | VFM | 2.1 | 2.6 | V | IF = 20 A, TC = 25°C | 4 | |
| Collector-emitter saturation voltage | VCE(sat) | 2.1 | V | IC = 40 A, VGE = 15 V, TC = 175°C | 3 | ||
| Temperature coefficient of breakdown voltage | ΔBVCES/ΔTJ | 0.6 | V/°C | VGE = 0 V, IC = 250 μA | 3 | ||
| Input capacitance | Cies | 1880 | pF | VCE = 30 V, VGE = 0 V, f = 1 MHz | 3 | ||
| Output capacitance | Coes | 180 | pF | VCE = 30 V, VGE = 0 V, f = 1 MHz | 3 | ||
| Reverse transfer capacitance | Cres | 50 | pF | VCE = 30 V, VGE = 0 V, f = 1 MHz | 3 | ||
| Turn-on delay time | td(on) | 15 | ns | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 175°C | 3 | ||
| Rise time | tr | 22 | ns | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 175°C | 3 | ||
| Turn-off delay time | td(off) | 116 | ns | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 175°C | 3 | ||
| Fall time | tf | 16 | ns | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 175°C | 3 | ||
| Turn-on switching loss | Eon | 1.08 | mJ | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 175°C | 3 | ||
| Turn-off switching loss | Eoff | 0.6 | mJ | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 175°C | 3 | ||
| Total switching loss | Ets | 1.68 | mJ | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 175°C | 3 | ||
| Diode forward voltage | VFM | 1.7 | V | IF = 20 A, TC = 175°C | 4 | ||
| Diode reverse recovery energy | Erec | 96 | µJ | IF = 20 A, diF/dt = 200 A/μs, TC = 175°C | 4 | ||
| Diode reverse recovery time | trr | 42 | ns | TC = 25°C | 4 | ||
| Diode reverse recovery time | trr | 200 | ns | TC = 175°C | 4 | ||
| Diode reverse recovery peak current | Irr | 3.6 | A | TC = 25°C | 4 | ||
| Diode reverse recovery peak current | Irr | 8 | A | TC = 175°C | 4 | ||
| Diode reverse recovery charge | Qrr | 76 | nC | TC = 25°C | 4 | ||
| Diode reverse recovery charge | Qrr | 800 | nC | TC = 175°C | 4 |
CAD (KiCad official)
- Symbol:
FGA40N65SMD - Footprint:
Package_TO_SOT_THT:TO-3P-3_Vertical - 3D model: TO-3P (KiCad packages3D, STEP)
- 3D model files:
fga40n65smd-etched.step/fga40n65smd-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fga40n65smd.step/fga40n65smd.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (11 pp, sha256
3d7037c8f7649b1b, retrieved 2026-11-06, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# FGA40N65SMD
**onsemi** · IGBT Transistors / Modules · TO-3P
FGA40N65SMD from onsemi, in a TO-3P. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-emitter voltage is rated ±20 V continuous and ±30 V transient, with a typical threshold VGE(th) of 4.5 V at IC = 250 µA. |
| 2 | C | passive | Collector (also the mounting tab); collector-emitter voltage is rated 650 V and collector current is 80 A at TC = 25°C and 40 A at TC = 100°C. |
| 3 | E | passive | Emitter; the anti-parallel diode carries 40 A forward current at TC = 25°C and 20 A at TC = 100°C. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | TO-3P |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Collector-emitter voltage | VCES | | | 650 | V | | 2 |
| Gate-emitter voltage | VGES | -20 | | 20 | V | | 2 |
| Transient gate-emitter voltage | VGES | -30 | | 30 | V | transient | 2 |
| Collector current | IC | | | 80 | A | TC = 25°C | 2 |
| Collector current | IC | | | 40 | A | TC = 100°C | 2 |
| Pulsed collector current | ICM | | | 120 | A | Repetitive rating: pulse width limited by max junction temperature | 2 |
| Diode forward current | IF | | | 40 | A | TC = 25°C | 2 |
| Diode forward current | IF | | | 20 | A | TC = 100°C | 2 |
| Diode maximum forward pulsed current | IFM | | | 120 | A | Repetitive rating: pulse width limited by max junction temperature | 2 |
| Maximum power dissipation | PD | | | 349 | W | TC = 25°C | 2 |
| Maximum power dissipation | PD | | | 174 | W | TC = 100°C | 2 |
| Operating junction temperature | TJ | -55 | | 175 | °C | | 2 |
| Storage temperature range | Tstg | -55 | | 175 | °C | | 2 |
| Maximum lead temperature for soldering | TL | | | 300 | °C | 1/8 inch from case, 5 seconds | 2 |
| Thermal resistance, junction to case (IGBT) | RθJC(IGBT) | | | 0.43 | °C/W | | 3 |
| Thermal resistance, junction to case (diode) | RθJC(Diode) | | | 1.5 | °C/W | | 3 |
| Thermal resistance, junction to ambient | RθJA | | | 40 | °C/W | | 3 |
| Collector-emitter breakdown voltage | BVCES | 650 | | | V | VGE = 0 V, IC = 250 μA | 3 |
| Collector cut-off current | ICES | | | 250 | μA | VCE = VCES, VGE = 0 V | 3 |
| G-E leakage current | IGES | -400 | | 400 | nA | VGE = VGES, VCE = 0 V | 3 |
| G-E threshold voltage | VGE(th) | 3.5 | 4.5 | 6 | V | IC = 250 μA, VCE = VGE | 3 |
| Collector-emitter saturation voltage | VCE(sat) | | 1.9 | 2.5 | V | IC = 40 A, VGE = 15 V | 3 |
| Gate charge, total | Qg | | 119 | 180 | nC | VCE = 400 V, IC = 40 A, VGE = 15 V | 4 |
| Gate-emitter charge | Qge | | 13 | 20 | nC | VCE = 400 V, IC = 40 A, VGE = 15 V | 4 |
| Gate-collector charge | Qgc | | 58 | 90 | nC | VCE = 400 V, IC = 40 A, VGE = 15 V | 4 |
| Turn-on delay time | td(on) | | 12 | 16 | ns | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 25°C | 3 |
| Rise time | tr | | 20 | 28 | ns | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 25°C | 3 |
| Turn-off delay time | td(off) | | 92 | 120 | ns | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 25°C | 3 |
| Fall time | tf | | 13 | 17 | ns | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 25°C | 3 |
| Turn-on switching loss | Eon | | 0.82 | 1.23 | mJ | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 25°C | 3 |
| Turn-off switching loss | Eoff | | 0.26 | 0.34 | mJ | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 25°C | 3 |
| Total switching loss | Ets | | 1.08 | 1.57 | mJ | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 25°C | 3 |
| Diode forward voltage | VFM | | 2.1 | 2.6 | V | IF = 20 A, TC = 25°C | 4 |
| Collector-emitter saturation voltage | VCE(sat) | | 2.1 | | V | IC = 40 A, VGE = 15 V, TC = 175°C | 3 |
| Temperature coefficient of breakdown voltage | ΔBVCES/ΔTJ | | 0.6 | | V/°C | VGE = 0 V, IC = 250 μA | 3 |
| Input capacitance | Cies | | 1880 | | pF | VCE = 30 V, VGE = 0 V, f = 1 MHz | 3 |
| Output capacitance | Coes | | 180 | | pF | VCE = 30 V, VGE = 0 V, f = 1 MHz | 3 |
| Reverse transfer capacitance | Cres | | 50 | | pF | VCE = 30 V, VGE = 0 V, f = 1 MHz | 3 |
| Turn-on delay time | td(on) | | 15 | | ns | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 175°C | 3 |
| Rise time | tr | | 22 | | ns | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 175°C | 3 |
| Turn-off delay time | td(off) | | 116 | | ns | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 175°C | 3 |
| Fall time | tf | | 16 | | ns | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 175°C | 3 |
| Turn-on switching loss | Eon | | 1.08 | | mJ | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 175°C | 3 |
| Turn-off switching loss | Eoff | | 0.6 | | mJ | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 175°C | 3 |
| Total switching loss | Ets | | 1.68 | | mJ | VCC = 400 V, IC = 40 A, RG = 6 Ω, VGE = 15 V, inductive load, TC = 175°C | 3 |
| Diode forward voltage | VFM | | 1.7 | | V | IF = 20 A, TC = 175°C | 4 |
| Diode reverse recovery energy | Erec | | 96 | | µJ | IF = 20 A, diF/dt = 200 A/μs, TC = 175°C | 4 |
| Diode reverse recovery time | trr | | 42 | | ns | TC = 25°C | 4 |
| Diode reverse recovery time | trr | | 200 | | ns | TC = 175°C | 4 |
| Diode reverse recovery peak current | Irr | | 3.6 | | A | TC = 25°C | 4 |
| Diode reverse recovery peak current | Irr | | 8 | | A | TC = 175°C | 4 |
| Diode reverse recovery charge | Qrr | | 76 | | nC | TC = 25°C | 4 |
| Diode reverse recovery charge | Qrr | | 800 | | nC | TC = 175°C | 4 |
## CAD (KiCad official)
- Symbol: `FGA40N65SMD`
- Footprint: `Package_TO_SOT_THT:TO-3P-3_Vertical`
- 3D model: TO-3P (KiCad packages3D, STEP)
- 3D model files: `fga40n65smd-etched.step` / `fga40n65smd-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `fga40n65smd.step` / `fga40n65smd.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [onsemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588888194520006657) (11 pp, sha256 `3d7037c8f7649b1b`, retrieved 2026-11-06, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/fga40n65smd-datasheet.pdf)