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Made with kicad-footprint-generator 10.0 · KiCad file format 20260206
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FFSH3065A

onsemi · SiC Diodes · TO-247-2

FFSH3065A from onsemi, in a TO-247-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal of the SiC Schottky diode; the datasheet gives a peak repetitive reverse voltage of 650 V and a continuous forward current of 30 A at TC < 145°C for the device, but no pin-specific limit is stated.
2 Anode passive Anode terminal of the SiC Schottky diode; the datasheet gives a junction/storage temperature range of −55 to +175 °C for the device, but no pin-specific limit is stated.

Key specifications

Parameter Value
Manufacturer onsemi
Package TO-247-2
Category Silicon Carbide (SiC) Devices
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward Voltage VF 1.5 1.75 V IF = 30 A, TC = 25°C 2
Forward Voltage VF 1.6 2 V IF = 30 A, TC = 125°C 2
Forward Voltage VF 1.72 2.4 V IF = 30 A, TC = 175°C 2
Reverse Current IR 200 μA VR = 650 V, TC = 25°C 2
Reverse Current IR 400 μA VR = 650 V, TC = 125°C 2
Reverse Current IR 600 μA VR = 650 V, TC = 175°C 2
Peak Repetitive Reverse Voltage VRRM 650 V 2
Single Pulse Avalanche Energy EAS 180 mJ Note 1: TJ = 25°C, L = 0.5 mH, IAS = 27 A, V = 50 V 2
Continuous Rectified Forward Current IF 30 A TC < 145°C 2
Continuous Rectified Forward Current IF 36 A TC < 135°C 2
Non-Repetitive Peak Forward Surge Current IF, Max 1125 A TC = 25°C, 10 s 2
Non-Repetitive Peak Forward Surge Current IF, Max 1040 A TC = 150°C, 10 s 2
Non-Repetitive Forward Surge Current IF, SM 150 A Half-Sine Pulse, tp = 8.3 ms 2
Repetitive Forward Surge Current IF, RM 75 A Half-Sine Pulse, tp = 8.3 ms 2
Power Dissipation Ptot 259 W TC = 25°C 2
Power Dissipation Ptot 43 W TC = 150°C 2
Operating and Storage Temperature Range TJ, TSTG -55 175 °C 2
Thermal Resistance, Junction to Case RJC 0.58 °C/W Max. 2

CAD (KiCad official)

  • Symbol: FFSH3065A
  • Footprint: Package_TO_SOT_THT:TO-247-2_Vertical
  • 3D model: TO-247-2 (KiCad packages3D, STEP)
  • 3D model files: ffsh3065a-etched.step / ffsh3065a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ffsh3065a.step / ffsh3065a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 ea1206a962e01b01, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF