# FESD3B3D3

**FUXINSEMI** · ESD And Surge Protection (TVS/ESD) · SOD-323

FESD3B3D3 from FUXINSEMI, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised bidirectional ESD/TVS diode; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised bidirectional ESD/TVS diode; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | FUXINSEMI |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak pulse power dissipation | PPP |  |  | 450 | W | 8/20µs waveform | 2 |
| ESD per IEC 61000-4-2 (Air) | VESD | -30 |  | 30 | kV | IEC 61000-4-2 air | 2 |
| ESD per IEC 61000-4-2 (Contact) | VESD | -30 |  | 30 | kV | IEC 61000-4-2 contact | 2 |
| Lead soldering temperature | TL |  |  | 260 | ℃ | 10 sec. | 2 |
| Operating junction temperature range | TJ | -55 |  | 125 | ℃ |  | 2 |
| Storage temperature range | TSTG | -55 |  | 150 | ℃ |  | 2 |
| Reverse working voltage | VRWM |  |  | 3.3 | V |  | 2 |
| Reverse breakdown voltage | VBR | 4 |  | 6 | V | IT = 1mA | 2 |
| Reverse leakage current | IR |  |  | 1 | µA | VRWM =3.3V | 2 |
| Clamping voltage | VC |  |  | 12 | V | IPP=30A, tp =8/20µs | 2 |
| Junction capacitance | CJ |  | 50 | 100 | pF | VR = 0V, f = 1MHz | 2 |

## CAD (KiCad official)

- Symbol: `FESD3B3D3`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `fesd3b3d3-etched.step` / `fesd3b3d3-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `fesd3b3d3.step` / `fesd3b3d3.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [FUXINSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590226292009570304) (3 pp, sha256 `dd4e99c2b3641ef5`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/fesd3b3d3-datasheet.pdf)