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FDG6318PZ-VB
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VBsemi Elec MOSFETs, SC-70-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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FDG6318PZ-VB
VBsemi Elec · MOSFETs · SC-70-6
FDG6318PZ-VB from VBsemi Elec, in a SC-70-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of the first P-channel MOSFET; the device absolute maximum drain-source voltage is -20 V and gate-source voltage is ±12 V. |
| 2 | G1 | input | Gate of the first P-channel MOSFET; gate-source voltage is limited to ±12 V. |
| 3 | D2 | passive | Drain of the second P-channel MOSFET; drain-source voltage is limited to -20 V. |
| 4 | S2 | passive | Source of the second P-channel MOSFET; the device absolute maximum drain-source voltage is -20 V and gate-source voltage is ±12 V. |
| 5 | G2 | input | Gate of the second P-channel MOSFET; gate-source voltage is limited to ±12 V. |
| 6 | D1 | passive | Drain of the first P-channel MOSFET; drain-source voltage is limited to -20 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | SC-70-6 |
| Category | Transistors/Thyristors |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -20 | V | 1 | |||
| Gate-Source Voltage | VGS | -12 | 12 | V | 1 | ||
| Continuous Drain Current | ID | -1.5 | A | TC = 70 °C | 1 | ||
| Continuous Drain Current | ID | -1.6 | A | TA = 25 °C | 1 | ||
| Continuous Drain Current | ID | -1.1 | A | TA = 70 °C | 1 | ||
| Pulsed Drain Current | IDM | -2.5 | A | 1 | |||
| Continuous Source-Drain Diode Current | IS | -1.1 | A | TC = 25 °C | 1 | ||
| Continuous Source-Drain Diode Current | IS | -0.95 | A | TA = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 1.4 | W | TC = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 0.9 | W | TC = 70 °C | 1 | ||
| Maximum Power Dissipation | PD | 1.14 | W | TA = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 0.73 | W | TA = 70 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Maximum Junction-to-Ambient | RthJA | 93 | 110 | °C/W | t ≤ 5 s | 1 | |
| Maximum Junction-to-Ambient | RthJA | 150 | °C/W | steady state (from note d) | 1 | ||
| Maximum Junction-to-Foot | RthJF | 75 | 90 | °C/W | steady state | 1 | |
| Gate Threshold Voltage | VGS(th) | -1.5 | -0.5 | V | VDS = VGS, ID = -250 µA | 2 | |
| Gate-Source Leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ±12 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | 1 | µA | VDS = -20 V, VGS = 0 | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 10 | µA | VDS = -20 V, VGS = 0 V, TJ = 55 °C | 2 | ||
| On-State Drain Current | ID(on) | -8 | A | VDS ≤ -5 V, VGS = -4.5 V | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.155 | Ω | VGS = -4.5 V, ID = -2.5 A | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.235 | Ω | VGS = -2.5 V, ID = -1 A | 2 | ||
| Drain-Source Breakdown Voltage | VDS | -20 | V | VGS = 0 V, ID = -250 µA | 2 | ||
| Gate Resistance | Rg | 2 | 7 | 14 | Ω | f = 1 MHz | 2 |
| Total Gate Charge | Qg | 5.2 | 8 | nC | VDS = -15 V, VGS = -4.5 V, ID = -2.6 A | 2 | |
| Total Gate Charge | Qg | 2.7 | 4 | nC | VDS = -15 V, VGS = -4.5 V, ID = -2.6 A | 2 | |
| Turn-On Delay Time | td(on) | 39 | 59 | ns | VDD = -15 V, RL = 7.1 Ω, ID ≈ -2.1 A, VGEN = -4.5 V, Rg = 1 Ω | 2 | |
| Rise Time | tr | 25 | 38 | ns | VDD = -15 V, RL = 7.1 Ω, ID ≈ -2.1 A, VGEN = -4.5 V, Rg = 1 Ω | 2 | |
| Turn-Off Delay Time | td(off) | 13 | 20 | ns | VDD = -15 V, RL = 7.1 Ω, ID ≈ -2.1 A, VGEN = -4.5 V, Rg = 1 Ω | 2 | |
| Fall Time | tf | 9 | 18 | ns | VDD = -15 V, RL = 7.1 Ω, ID ≈ -2.1 A, VGEN = -4.5 V, Rg = 1 Ω | 2 | |
| Body Diode Voltage | VSD | 0.85 | 1.2 | V | IS = -2.1 A, VGS = 0 V | 2 | |
| Body Diode Reverse Recovery Time | trr | 13 | 20 | ns | IF = -2.1 A, dI/dt = 100 A/µs, TJ = 25 °C | 2 | |
| Body Diode Reverse Recovery Charge | Qrr | 6 | 12 | nC | IF = -2.1 A, dI/dt = 100 A/µs, TJ = 25 °C | 2 | |
| Continuous Source-Drain Diode Current | IS | 1.17 | A | TC = 25 °C | 2 | ||
| Pulse Diode Forward Current | ISM | 8 | A | 2 | |||
| VDS Temperature Coefficient | ΔVDS/ΔTJ | -17 | mV/°C | ID = -250 µA | 2 | ||
| VGS(th) Temperature Coefficient | ΔVGS(th)/ΔTJ | 3.5 | mV/°C | 2 | |||
| Forward Transconductance | gfs | 5 | S | VDS = -15 V, ID = -2.6 A | 2 | ||
| Input Capacitance | Ciss | 210 | pF | VDS = -15 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Output Capacitance | Coss | 45 | pF | VDS = -15 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 33 | pF | VDS = -15 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Gate-Source Charge | Qgs | 0.94 | nC | VDS = -15 V, VGS = -4.5 V, ID = -2.6 A | 2 | ||
| Gate-Drain Charge | Qgd | 1.3 | nC | VDS = -15 V, VGS = -4.5 V, ID = -2.6 A | 2 | ||
| Reverse Recovery Fall Time | ta | 9 | ns | 2 | |||
| Reverse Recovery Rise Time | tb | 4 | ns | 2 |
CAD (KiCad official)
- Symbol:
FDG6318PZ-VB - Footprint:
Package_TO_SOT_SMD:SOT-363_SC-70-6 - 3D model: SC-70-6 (KiCad packages3D, STEP)
- 3D model files:
fdg6318pz-vb-etched.step/fdg6318pz-vb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fdg6318pz-vb.step/fdg6318pz-vb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (7 pp, sha256
d011959461d9e9b4, retrieved 2026-10-20, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# FDG6318PZ-VB
**VBsemi Elec** · MOSFETs · SC-70-6
FDG6318PZ-VB from VBsemi Elec, in a SC-70-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of the first P-channel MOSFET; the device absolute maximum drain-source voltage is -20 V and gate-source voltage is ±12 V. |
| 2 | G1 | input | Gate of the first P-channel MOSFET; gate-source voltage is limited to ±12 V. |
| 3 | D2 | passive | Drain of the second P-channel MOSFET; drain-source voltage is limited to -20 V. |
| 4 | S2 | passive | Source of the second P-channel MOSFET; the device absolute maximum drain-source voltage is -20 V and gate-source voltage is ±12 V. |
| 5 | G2 | input | Gate of the second P-channel MOSFET; gate-source voltage is limited to ±12 V. |
| 6 | D1 | passive | Drain of the first P-channel MOSFET; drain-source voltage is limited to -20 V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | SC-70-6 |
| Category | Transistors/Thyristors |
| Pins | 6 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -20 | | | V | | 1 |
| Gate-Source Voltage | VGS | -12 | | 12 | V | | 1 |
| Continuous Drain Current | ID | -1.5 | | | A | TC = 70 °C | 1 |
| Continuous Drain Current | ID | -1.6 | | | A | TA = 25 °C | 1 |
| Continuous Drain Current | ID | -1.1 | | | A | TA = 70 °C | 1 |
| Pulsed Drain Current | IDM | -2.5 | | | A | | 1 |
| Continuous Source-Drain Diode Current | IS | -1.1 | | | A | TC = 25 °C | 1 |
| Continuous Source-Drain Diode Current | IS | -0.95 | | | A | TA = 25 °C | 1 |
| Maximum Power Dissipation | PD | | | 1.4 | W | TC = 25 °C | 1 |
| Maximum Power Dissipation | PD | | | 0.9 | W | TC = 70 °C | 1 |
| Maximum Power Dissipation | PD | | | 1.14 | W | TA = 25 °C | 1 |
| Maximum Power Dissipation | PD | | | 0.73 | W | TA = 70 °C | 1 |
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | | 150 | °C | | 1 |
| Maximum Junction-to-Ambient | RthJA | | 93 | 110 | °C/W | t ≤ 5 s | 1 |
| Maximum Junction-to-Ambient | RthJA | | | 150 | °C/W | steady state (from note d) | 1 |
| Maximum Junction-to-Foot | RthJF | | 75 | 90 | °C/W | steady state | 1 |
| Gate Threshold Voltage | VGS(th) | -1.5 | | -0.5 | V | VDS = VGS, ID = -250 µA | 2 |
| Gate-Source Leakage | IGSS | -100 | | 100 | nA | VDS = 0 V, VGS = ±12 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 1 | µA | VDS = -20 V, VGS = 0 | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 10 | µA | VDS = -20 V, VGS = 0 V, TJ = 55 °C | 2 |
| On-State Drain Current | ID(on) | -8 | | | A | VDS ≤ -5 V, VGS = -4.5 V | 2 |
| Drain-Source On-State Resistance | RDS(on) | | | 0.155 | Ω | VGS = -4.5 V, ID = -2.5 A | 2 |
| Drain-Source On-State Resistance | RDS(on) | | | 0.235 | Ω | VGS = -2.5 V, ID = -1 A | 2 |
| Drain-Source Breakdown Voltage | VDS | -20 | | | V | VGS = 0 V, ID = -250 µA | 2 |
| Gate Resistance | Rg | 2 | 7 | 14 | Ω | f = 1 MHz | 2 |
| Total Gate Charge | Qg | | 5.2 | 8 | nC | VDS = -15 V, VGS = -4.5 V, ID = -2.6 A | 2 |
| Total Gate Charge | Qg | | 2.7 | 4 | nC | VDS = -15 V, VGS = -4.5 V, ID = -2.6 A | 2 |
| Turn-On Delay Time | td(on) | | 39 | 59 | ns | VDD = -15 V, RL = 7.1 Ω, ID ≈ -2.1 A, VGEN = -4.5 V, Rg = 1 Ω | 2 |
| Rise Time | tr | | 25 | 38 | ns | VDD = -15 V, RL = 7.1 Ω, ID ≈ -2.1 A, VGEN = -4.5 V, Rg = 1 Ω | 2 |
| Turn-Off Delay Time | td(off) | | 13 | 20 | ns | VDD = -15 V, RL = 7.1 Ω, ID ≈ -2.1 A, VGEN = -4.5 V, Rg = 1 Ω | 2 |
| Fall Time | tf | | 9 | 18 | ns | VDD = -15 V, RL = 7.1 Ω, ID ≈ -2.1 A, VGEN = -4.5 V, Rg = 1 Ω | 2 |
| Body Diode Voltage | VSD | | 0.85 | 1.2 | V | IS = -2.1 A, VGS = 0 V | 2 |
| Body Diode Reverse Recovery Time | trr | | 13 | 20 | ns | IF = -2.1 A, dI/dt = 100 A/µs, TJ = 25 °C | 2 |
| Body Diode Reverse Recovery Charge | Qrr | | 6 | 12 | nC | IF = -2.1 A, dI/dt = 100 A/µs, TJ = 25 °C | 2 |
| Continuous Source-Drain Diode Current | IS | | | 1.17 | A | TC = 25 °C | 2 |
| Pulse Diode Forward Current | ISM | | | 8 | A | | 2 |
| VDS Temperature Coefficient | ΔVDS/ΔTJ | | -17 | | mV/°C | ID = -250 µA | 2 |
| VGS(th) Temperature Coefficient | ΔVGS(th)/ΔTJ | | 3.5 | | mV/°C | | 2 |
| Forward Transconductance | gfs | | 5 | | S | VDS = -15 V, ID = -2.6 A | 2 |
| Input Capacitance | Ciss | | 210 | | pF | VDS = -15 V, VGS = 0 V, f = 1 MHz | 2 |
| Output Capacitance | Coss | | 45 | | pF | VDS = -15 V, VGS = 0 V, f = 1 MHz | 2 |
| Reverse Transfer Capacitance | Crss | | 33 | | pF | VDS = -15 V, VGS = 0 V, f = 1 MHz | 2 |
| Gate-Source Charge | Qgs | | 0.94 | | nC | VDS = -15 V, VGS = -4.5 V, ID = -2.6 A | 2 |
| Gate-Drain Charge | Qgd | | 1.3 | | nC | VDS = -15 V, VGS = -4.5 V, ID = -2.6 A | 2 |
| Reverse Recovery Fall Time | ta | | 9 | | ns | | 2 |
| Reverse Recovery Rise Time | tb | | 4 | | ns | | 2 |
## CAD (KiCad official)
- Symbol: `FDG6318PZ-VB`
- Footprint: `Package_TO_SOT_SMD:SOT-363_SC-70-6`
- 3D model: SC-70-6 (KiCad packages3D, STEP)
- 3D model files: `fdg6318pz-vb-etched.step` / `fdg6318pz-vb-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `fdg6318pz-vb.step` / `fdg6318pz-vb.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [VBsemi Elec datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8602988728516562944) (7 pp, sha256 `d011959461d9e9b4`, retrieved 2026-10-20, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/fdg6318pz-vb-datasheet.pdf)