# FDD8870

**UMW** · MOSFETs · TO-252

FDD8870 from UMW, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | GATE: gate-to-source voltage is rated at VGS = ±20 V in the absolute maximum ratings. |
| 2 | D | passive | DRAIN: drain-to-source voltage is rated at VDSS = 30 V in the absolute maximum ratings. |
| 3 | S | passive | SOURCE: the datasheet states no pin-specific electrical limit for this terminal. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | UMW |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gate to Source Threshold Voltage | VGS(th) |  | 1.7 | 2.5 | V | VDS=VGS, ID=250µA | 3 |
| Drain to Source On Resistance | RDS(ON) |  | 3.2 | 3.9 | mΩ | ID=35A, VGS=10V | 3 |
| Drain to Source On Resistance | RDS(ON) |  | 3.6 | 4.4 | mΩ | ID=35A, VGS=4.5V | 3 |
| Gate to Source Leakage Current | IGSS | -100 |  | 100 | nA | VGS=±20V | 3 |
| Zero Gate Voltage Drain Current | IDSS |  |  | 1 | µA | VDS=24V, VGS=0V | 3 |
| Zero Gate Voltage Drain Current (TJ=150°C) | IDSS |  |  | 250 | µA | VDS=24V, VGS=0V, TJ=150°C | 3 |
| Drain to Source Breakdown Voltage | BVDSS | 30 |  |  | V | ID=250µA, VGS=0V | 3 |
| Source to Drain Diode Forward Voltage | VSD |  |  | 1.25 | V | ISD=35A | 4 |
| Source to Drain Diode Forward Voltage | VSD |  |  | 1 | V | ISD=15A | 4 |
| Drain to Source Voltage | VDSS |  |  | 30 | V |  | 1 |
| Gate to Source Voltage | VGS | -20 |  | 20 | V |  | 1 |
| Drain Current Continuous | ID |  |  | 160 | A | TC=25°C, VGS=10V (Note 1) | 1 |
| Drain Current Continuous | ID |  |  | 150 | A | TC=25°C, VGS=4.5V (Note 1) | 1 |
| Drain Current Continuous (Tamb) | ID |  |  | 21 | A | Tamb=25°C, VGS=10V, with RθJA=52°C/W | 1 |
| Single Pulse Avalanche Energy | EAS |  |  | 690 | mJ |  | 1 |
| Power Dissipation | PD |  |  | 160 | W |  | 1 |
| Derate above 25°C |  |  |  | 1.07 | °C/W | Derate above 25°C | 1 |
| Storage and Junction Temperature Range | TJ, TSTG | -55 |  | 175 | °C |  | 1 |
| Thermal Resistance, Junction-to-Case | RθJC |  |  | 0.94 | °C/W | TO-252, TO-251 | 2 |
| Thermal Resistance, Junction-to-Ambient | RθJA |  |  | 100 | °C/W | TO-252, TO-251 | 2 |
| Thermal Resistance, Junction-to-Ambient (1 in² copper pad) | RθJA |  |  | 52 | °C/W | TO-252, 1 in² copper pad area | 2 |

## CAD (KiCad official)

- Symbol: `FDD8870`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files: `fdd8870-etched.step` / `fdd8870-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `fdd8870.step` / `fdd8870.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [UMW datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8755877605792985088) (13 pp, sha256 `2264fa240cc67161`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/fdd8870-datasheet.pdf)