component
FDD8796
Public Made by Adomby adom
UMW MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 16d ago |
| viewers | 16d ago |
| fdd8796-etched.glb | 16d ago |
| fdd8796-etched.step | 16d ago |
| fdd8796-hero.glb | 16d ago |
| fdd8796-hero.overlay.json | 16d ago |
| fdd8796.glb | 16d ago |
| fdd8796.kicad_mod | 16d ago |
| fdd8796.kicad_sym | 16d ago |
| fdd8796.lbr | 16d ago |
| fdd8796.step | 16d ago |
| package.json | 16d ago |
| page.json | 16d ago |
| README.md | 16d ago |
FDD8796
UMW · MOSFETs · TO-252
FDD8796 from UMW, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | GATE terminal of the 25 V N-channel MOSFET, where the absolute maximum gate-to-source voltage is ±20 V. |
| 2 | D | passive | DRAIN terminal, rated for a drain-to-source voltage of 25 V and a continuous drain current of 35 A (die limited) per the absolute maximum ratings. |
| 3 | S | passive | SOURCE terminal, the reference for the gate-to-source voltage and the source of the body diode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | UMW |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | 25 | V | ID=250µA, VGS=0V | 3 | ||
| Zero Gate Voltage Drain Current (TJ=25°C) | IDSS | 1 | µA | VDS=20V, VGS=0V | 3 | ||
| Zero Gate Voltage Drain Current (TJ=150°C) | IDSS | 250 | µA | TJ=150°C, VDS=20V, VGS=0V | 3 | ||
| Gate to Source Leakage Current | IGSS | -100 | 100 | nA | VGS=±20V | 3 | |
| Gate to Source Threshold Voltage | VGS(th) | 1.2 | 1.8 | 2.5 | V | VDS=VGS, ID=250µA | 3 |
| Input Capacitance | Ciss | 1960 | 2610 | pF | VDS=13V, VGS=0V, f=1MHz | 3 | |
| Output Capacitance | Coss | 455 | 605 | pF | VDS=13V, VGS=0V, f=1MHz | 3 | |
| Reverse Transfer Capacitance | Crss | 315 | 475 | pF | VDS=13V, VGS=0V, f=1MHz | 3 | |
| Turn-On Delay Time | tD(on) | 10 | 20 | ns | VDD=13V, ID=35A, VGS=10V, RGEN=20Ω | 3 | |
| Rise Time | tr | 24 | 39 | ns | VDD=13V, ID=35A, VGS=10V, RGEN=20Ω | 3 | |
| Turn-Off Delay Time | tD(off) | 99 | 158 | ns | VDD=13V, ID=35A, VGS=10V, RGEN=20Ω | 3 | |
| Fall Time | tf | 57 | 91 | ns | VDD=13V, ID=35A, VGS=10V, RGEN=20Ω | 3 | |
| Total Gate Charge (VGS=0 to 10V) | Qg | 37 | 52 | nC | VGS=0V to 10V, VDD=13V, ID=35A | 3 | |
| Total Gate Charge (VGS=0 to 5V) | Qg | 19 | 27 | nC | VGS=0V to 5V, VDD=13V, ID=35A | 3 | |
| Drain to Source On Resistance (VGS=10V) | RDS(ON) | 4.5 | 5.7 | mΩ | VGS=10V, ID=35A | 3 | |
| Drain to Source On Resistance (VGS=4.5V) | RDS(ON) | 6 | 8 | mΩ | VGS=4.5V, ID=35A | 3 | |
| Source to Drain Diode Forward Voltage (IS=35A) | VSD | 0.9 | 1.25 | V | VGS=0V, IS=35A | 3 | |
| Source to Drain Diode Forward Voltage (IS=15A) | VSD | 0.8 | 1 | V | VGS=0V, IS=15A | 3 | |
| Reverse Recovery Time | trr | 30 | 45 | ns | IF=35A, di/dt=100A/μs | 4 | |
| Reverse Recovery Charge | Qrr | 23 | 35 | nC | IF=35A, di/dt=100A/μs | 4 | |
| Drain to Source Voltage | VDS | 25 | V | 1 | |||
| Gate to Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Drain Current Continuous (Package Limited) | ID | 35 | A | 1 | |||
| Drain Current Continuous (Die Limited) | ID | 98 | A | 1 | |||
| Drain Current Pulsed | IDM | 305 | A | Note 1: pulse time<300µs, duty cycle=2% | 1 | ||
| Single Pulse Avalanche Energy | EAS | 91 | mJ | TJ=25°C start, L=0.3mH, IAS=24.7A, VDD=23V, VGS=10V (Note 2) | 1 | ||
| Power Dissipation | PD | 88 | W | 1 | |||
| Storage Junction Temperature Range | TJ, TSTG | -55 | 175 | °C | 1 | ||
| Thermal Resistance, Junction-to-Case (TO-252, TO-251) | RθJC | 1.7 | °C/W | 2 | |||
| Thermal Resistance, Junction-to-Ambient (TO-252, TO-251) | RθJA | 100 | °C/W | 2 | |||
| Thermal Resistance, Junction-to-Ambient (TO-252, 1in² copper pad area) | RθJA | 52 | °C/W | 1in² copper pad area | 2 |
CAD (KiCad official)
- Symbol:
FDD8796 - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
fdd8796-etched.step/fdd8796-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fdd8796.step/fdd8796.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: UMW datasheet (10 pp, sha256
0949e3bea93bc043, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).