component
FDD8782-HXY
Public Made by Adomby adom
HXY MOSFET MOSFETs, TO-252-2L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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| fdd8782-hxy.glb | 7d ago |
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FDD8782-HXY
HXY MOSFET · MOSFETs · TO-252-2L
FDD8782-HXY from HXY MOSFET, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage rated ±20 V, with RDS(ON) specified at VGS=10V and 4.5V and threshold of 1.2 to 2.5 V. |
| 2 | D | passive | Drain; drain-source voltage rated 30 V with continuous drain current of 60 A at TC=25℃ and pulsed 110 A. |
| 3 | S | passive | Source; continuous body-diode source current of 55 A and diode forward voltage up to 1.2 V at IS=1A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | TO-252-2L |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | 30 | V | VGS=0V, ID=250uA | 2 | ||
| Static Drain-Source On-Resistance | RDS(ON) | 7 | 9 | mΩ | VGS=10V, ID=30A | 2 | |
| Static Drain-Source On-Resistance | RDS(ON) | 11 | 14 | mΩ | VGS=4.5V, ID=15A | 2 | |
| Gate Threshold Voltage | VGS(th) | 1.2 | 1.5 | 2.5 | V | VGS=VDS, ID=250uA | 2 |
| Drain-Source Leakage Current | IDSS | 1 | uA | VDS=24V, VGS=0V, TJ=25℃ | 2 | ||
| Drain-Source Leakage Current | IDSS | 5 | uA | VDS=24V, VGS=0V, TJ=55℃ | 2 | ||
| Gate-Source Leakage Current | IGSS | -100 | 100 | nA | VGS=±20V, VDS=0V | 2 | |
| Gate Resistance | Rg | 2.2 | 3.5 | Ω | VDS=0V, VGS=0V, f=1MHz | 2 | |
| Total Gate Charge (4.5V) | Qg | 12.6 | 17.6 | nC | VDS=15V, VGS=4.5V, ID=15A | 2 | |
| Gate-Source Charge | Qgs | 4.2 | 5.9 | nC | VDS=15V, VGS=4.5V, ID=15A | 2 | |
| Gate-Drain Charge | Qgd | 5.1 | 7.1 | nC | VDS=15V, VGS=4.5V, ID=15A | 2 | |
| Turn-On Delay Time | Td(on) | 4.6 | 9.2 | ns | VDD=15V, VGS=10V, RG=3.3, ID=15A | 2 | |
| Rise Time | Tr | 12.2 | 22 | ns | VDD=15V, VGS=10V, RG=3.3, ID=15A | 2 | |
| Turn-Off Delay Time | Td(off) | 26.6 | 53 | ns | VDD=15V, VGS=10V, RG=3.3, ID=15A | 2 | |
| Fall Time | Tf | 8 | 16 | ns | VDD=15V, VGS=10V, RG=3.3, ID=15A | 2 | |
| Input Capacitance | Ciss | 1317 | 1843 | pF | VDS=15V, VGS=0V, f=1MHz | 2 | |
| Output Capacitance | Coss | 163 | 228 | pF | VDS=15V, VGS=0V, f=1MHz | 2 | |
| Reverse Transfer Capacitance | Crss | 131 | 183 | pF | VDS=15V, VGS=0V, f=1MHz | 2 | |
| Continuous Source Current | IS | 55 | A | VG=VD=0V, Force Current | 2 | ||
| Pulsed Source Current | ISM | 110 | A | VG=VD=0V, Force Current | 2 | ||
| Diode Forward Voltage | VSD | 1.2 | V | VGS=0V, IS=1A, TJ=25℃ | 2 | ||
| Drain-Source Voltage | VDS | 30 | V | TC=25℃ | 1 | ||
| Gate-Source Voltage | VGS | -20 | 20 | V | TC=25℃ | 1 | |
| Continuous Drain Current | ID@TC=25℃ | 60 | A | VGS @ 10V | 1 | ||
| Continuous Drain Current | ID@TC=100℃ | 40 | A | VGS @ 10V | 1 | ||
| Continuous Drain Current | ID@TA=25℃ | 13.6 | A | VGS @ 10V | 1 | ||
| Continuous Drain Current | ID@TA=70℃ | 11.4 | A | VGS @ 10V | 1 | ||
| Pulsed Drain Current | IDM | 110 | A | 1 | |||
| Single Pulse Avalanche Energy | EAS | 57.8 | mJ | VDD=25V, VGS=10V, L=0.1mH, IAS=34A | 1 | ||
| Avalanche Current | IAS | 34 | A | 1 | |||
| Total Power Dissipation | PD@TC=25℃ | 41 | W | 1 | |||
| Total Power Dissipation | PD@TA=25℃ | 2.42 | W | 1 | |||
| Storage Temperature Range | TSTG | -55 | 175 | ℃ | 1 | ||
| Operating Junction Temperature Range | TJ | -55 | 175 | ℃ | 1 | ||
| Thermal Resistance Junction-ambient | RθJA | 62 | ℃/W | Steady State | 1 | ||
| Thermal Resistance Junction-Case | RθJC | 3.6 | ℃/W | 1 | |||
| BVDSS Temperature Coefficient | △BVDSS/△TJ | 0.027 | V/℃ | Reference to 25℃, ID=1mA | 2 | ||
| VGS(th) Temperature Coefficient | △VGS(th) | -5.8 | mV/℃ | 2 | |||
| Forward Transconductance | gfs | 38 | S | VDS=5V, ID=30A | 2 | ||
| Reverse Recovery Time | trr | 9.2 | nS | IF=30A, dI/dt=100A/µs, TJ=25℃ | 2 | ||
| Reverse Recovery Charge | Qrr | 2 | nC | IF=30A, dI/dt=100A/µs, TJ=25℃ | 2 |
CAD (KiCad official)
- Symbol:
FDD8782-HXY - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252-2L (KiCad packages3D, STEP)
- 3D model files:
fdd8782-hxy-etched.step/fdd8782-hxy-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fdd8782-hxy.step/fdd8782-hxy.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HXY MOSFET datasheet (6 pp, sha256
c08fa45655624809, retrieved 2026-10-31, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).