component
FDD86250-VB
Public Made by Adomby adom
VBsemi Elec MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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|---|---|
| docs | 9d ago |
| viewers | 9d ago |
| fdd86250-vb-etched.glb | 9d ago |
| fdd86250-vb-etched.step | 9d ago |
| fdd86250-vb-hero.glb | 9d ago |
| fdd86250-vb-hero.overlay.json | 9d ago |
| fdd86250-vb.glb | 9d ago |
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| README.md | 9d ago |
| verification.json | 9d ago |
FDD86250-VB
VBsemi Elec · MOSFETs · TO-252
FDD86250-VB from VBsemi Elec, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal; gate-source voltage is rated VGS ±20 V (absolute maximum), and the device is 100 % Rg tested. |
| 2 | D | passive | Drain terminal; drain-source voltage is rated VDS 100 V, with junction-to-case (drain) thermal resistance RthJC of 0.85 typical and 1.1 °C/W maximum. |
| 3 | S | passive | Source terminal; continuous source (diode conduction) current is rated IS 43 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gate-Body Leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ± 20 V | 2 | |
| Drain-Source Breakdown Voltage | VDS | 100 | V | VGS = 0 V, ID = 250 µA | 2 | ||
| Diode Forward Voltage | VSD | 0.9 | 1.5 | V | IF = 3 A, VGS = 0 V | 2 | |
| Source-Drain Reverse Recovery Time | trr | 180 | 250 | ns | IF = 3 A, dI/dt = 100 A/µs | 2 | |
| Rise Time | tr | 50 | 75 | ns | VDD = 100 V, RL = 5.2 Ω, ID ≅ 3 A, VGEN = 10 V, Rg = 2.5 Ω | 2 | |
| Turn-Off Delay Time | td(off) | 30 | 45 | ns | VDD = 100 V, RL = 5.2 Ω, ID ≅ 3 A, VGEN = 10 V, Rg = 2.5 Ω | 2 | |
| Fall Time | tf | 60 | 90 | ns | VDD = 100 V, RL = 5.2 Ω, ID ≅ 3 A, VGEN = 10 V, Rg = 2.5 Ω | 2 | |
| Drain-Source Voltage | VDS | 100 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Pulsed Drain Current | IDM | 40 | A | 1 | |||
| Continuous Source Current (Diode Conduction) | IS | 43 | A | 1 | |||
| Avalanche Current | IAS | 3 | A | 1 | |||
| Single Pulse Avalanche Energy | EAS | 18 | mJ | L = 0.1 mH | 1 | ||
| Maximum Power Dissipation | PD | 96 | W | TC = 25 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 175 | °C | 1 | ||
| Junction-to-Ambient (t ≤ 10 s) | RthJA | 15 | 18 | °C/W | t = 10 s | 1 | |
| Junction-to-Ambient (steady state) | RthJA | 40 | 50 | °C/W | Steady State | 1 | |
| Junction-to-Case (Drain) | RthJC | 0.85 | 1.1 | °C/W | 1 |
CAD (KiCad official)
- Symbol:
FDD86250-VB - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
fdd86250-vb-etched.step/fdd86250-vb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fdd86250-vb.step/fdd86250-vb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (7 pp, sha256
4bba016d2bda389e, retrieved 2026-10-29, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).