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Contents

README

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FDD5810

UMW · MOSFETs · TO-252

FDD5810 from UMW, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input GATE terminal of the 60V N-channel MOSFET; the datasheet gives VGS limits of ±20 V (absolute maximum) and a VGS(th) of 1 to 3 V range with typical 1.6 V at 250 µA.
2 D passive DRAIN terminal of the MOSFET; the datasheet rates VDSS at 60 V and continuous drain current at 37 A (VGS = 10 V, TC = 25°C), with RθJA of 52 °C/W for 1 in² copper pad.
3 S passive SOURCE terminal of the MOSFET, the reference for gate-to-source voltage; the datasheet gives no separate pin-specific limit for this terminal.

Key specifications

Parameter Value
Manufacturer UMW
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain to Source Breakdown Voltage BVDSS 60 V ID=250µA, VGS=0V 3
Zero Gate Voltage Drain Current IDSS 1 µA VDS=48V, VGS=0V 3
Zero Gate Voltage Drain Current (TJ=125°C) IDSS 250 µA VDS=48V, VGS=0V, TJ=125°C 3
Gate to Source Leakage Current IGSS -100 100 nA VGS=±20V 3
Drain to Source On Resistance RDS(ON) 18 22 mΩ ID=32A, VGS=10V 3
Drain to Source On Resistance RDS(ON) 22 27 mΩ ID=29A, VGS=5V 3
Input Capacitance Ciss 1420 1890 pF VDS=25V, VGS=0V, f=1MHz 3
Output Capacitance Coss 150 200 pF VDS=25V, VGS=0V, f=1MHz 3
Reverse Transfer Capacitance Crss 65 100 pF VDS=25V, VGS=0V, f=1MHz 3
Drain to Source Voltage VDSS 60 V 1
Gate to Source Voltage VGS -20 20 V 1
Drain Current Continuous ID 37 A VGS=10V 1
Drain Current Continuous ID 33 A VGS=5V 1
Drain Current Continuous ID 7.4 A TA=25°C, VGS=10V, with RθJA=52°C/W 1
Single Pulse Avalanche Energy EAS 45 mJ Starting TJ=25°C, L=110μH, IAS=28A, VDD=54V, VGS=10V 1
Power Dissipation PD 72 W 1
Operating and Storage Temperature TJ, TSTG -55 150 °C 1
Maximum Thermal Resistance Junction to Case TO-252 RθJC 2.1 °C/W Junction to case, TO-252 2
Thermal Resistance Junction to Ambient TO-252 RθJA 52 °C/W TO-252, 1in² copper pad area 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing ABS Motor / Body Load Control ABS Systems 1

CAD (KiCad official)

  • Symbol: FDD5810
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: fdd5810-etched.step / fdd5810-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fdd5810.step / fdd5810.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: UMW datasheet (10 pp, sha256 1ecffc1bea2c76dc, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF