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FDD3706-HXY

HXY MOSFET · MOSFETs · TO-252-2L

FDD3706-HXY from HXY MOSFET, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal; the datasheet rates gate-source voltage at +12V and gate threshold voltage VGS(th) at 0.5V to 0.9V.
2 D passive Drain terminal; the datasheet rates drain-source voltage VDS at 20V and continuous drain current ID at 40A at TC=25°C.
3 S passive Source terminal; the datasheet gives forward on voltage VSD at 1.2V maximum for IS=20A with VGS=0V.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package TO-252-2L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 20 V VGS=0V, ID=250uA 2
Static Drain-Source On-Resistance RDS(ON) 7.5 9 mΩ VGS=4.5V, ID=20A 2
Gate Threshold Voltage VGS(th) 0.5 0.9 V VDS=VGS, ID=250uA 2
Drain-Source Leakage Current IDSS 10 uA VDS=16V, VGS=0V 2
Gate-Source Leakage IGSS 100 nA VGS=+12V, VDS=0V 2
Total Gate Charge Qg 16 25.6 nC ID=20A, VDS=10V, VGS=4.5V 2
Input Capacitance Ciss 1400 2240 pF VGS=0V, VDS=10V, f=1.0MHz 2
Gate Resistance Rg 1 2 Ω f=1.0MHz 2
Forward On Voltage VSD 1.2 V IS=20A, VGS=0V 2
Drain-Source Voltage VDS 20 V 1
Gate-Source Voltage VGS 12 V 1
Drain Current, VGS @ 4.5V ID@TC=25℃ 40 A TC=25℃, VGS @ 4.5V 1
Drain Current, VGS @ 4.5V ID@TC=100℃ 25 A TC=100℃, VGS @ 4.5V 1
Pulsed Drain Current IDM 80 A 1
Total Power Dissipation PD@TC=25℃ 15.6 W TC=25℃ 1
Total Power Dissipation PD@TA=25℃ 5 W TA=25℃ 1
Single Pulse Avalanche Energy EAS 150 mJ 1
Storage Temperature Range TSTG -55 150 ℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Maximum Thermal Resistance, Junction-case Rthj-c 8 ℃/W 1
Maximum Thermal Resistance, Junction-ambient Rthj-a 25 ℃/W Surface mounted on 1 in2 FR4 copper pad, t<10sec (note 3) 1

CAD (KiCad official)

  • Symbol: FDD3706-HXY
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2L (KiCad packages3D, STEP)
  • 3D model files: fdd3706-hxy-etched.step / fdd3706-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fdd3706-hxy.step / fdd3706-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (7 pp, sha256 85a407a8b9daac65, retrieved 2026-10-28, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF