component
FCX558TA
Public Made by Adomby adom
Diodes Incorporated Bipolar Transistors - BJT, SOT-89. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownFCX558TA
Diodes Incorporated · Bipolar Transistors - BJT · SOT-89
FCX558TA from Diodes Incorporated, in a SOT-89. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | B | input | Base of the PNP transistor; VEBO max is -7 V and VBE(on) is at most -0.9 V at IC = -50 mA. |
| 2 | C | passive | Collector, also the exposed collector pad/tab; VCEO is -400 V, continuous IC is -200 mA and peak ICM is -500 mA. |
| 3 | E | passive | Emitter of the PNP transistor; carries the collector and base currents, with VEBO limited to -7 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SOT-89 |
| Category | Transistors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Collector-Base Breakdown Voltage | BVCBO | -400 | -540 | V | IC = -100µA | 4 | |
| Collector-Emitter Breakdown Voltage | BVCEO | -400 | -510 | V | IC = -1mA | 4 | |
| Collector-Emitter Breakdown Voltage | BVCES | -400 | -540 | V | IC = -100µA | 4 | |
| Emitter-Base Breakdown Voltage | BVEBO | -7 | -8.2 | V | IE = -100µA | 4 | |
| Collector Cutoff Current | ICBO | -100 | nA | VCB = -320V | 4 | ||
| Emitter Cutoff Current | ICES | -100 | nA | VCE = -320V | 4 | ||
| Emitter Cutoff Current | IEBO | -20 | nA | VEB = -6V | 4 | ||
| DC Current Transfer Static Ratio | hFE | 100 | IC = -1mA, VCE = -10V | 4 | |||
| DC Current Transfer Static Ratio | hFE | 100 | 300 | IC = -50mA, VCE = -10V | 4 | ||
| DC Current Transfer Static Ratio | hFE | 15 | IC = -100mA, VCE = -10V | 4 | |||
| Collector-Emitter Saturation Voltage | VCE(sat) | -0.2 | V | IC = -20mA, IB = -2mA | 4 | ||
| Collector-Emitter Saturation Voltage | VCE(sat) | -0.5 | V | IC = -50mA, IB = -6mA | 4 | ||
| Base-Emitter Saturation Voltage | VBE(sat) | -0.9 | V | IC = -50mA, IB = -5mA | 4 | ||
| Base-Emitter Turn-on Voltage | VBE(on) | -0.9 | V | IC = -50mA, VCE = -10V | 4 | ||
| Transitional Frequency | fT | 50 | MHz | IE = -10mA, VCE = -20V, f = 20MHz | 4 | ||
| Output Capacitance | Cobo | 5 | pF | VCB = -20V, f = 1MHz | 4 | ||
| Turn-on Time | ton | 95 | nS | IC = -50mA, VC = -100V, IB1 = -5mA, IB2 = -10mA | 4 | ||
| Turn-off Time | toff | 1600 | nS | IC = -50mA, VC = -100V, IB1 = -5mA, IB2 = -10mA | 4 | ||
| Collector-Base Voltage | VCBO | -400 | V | TA = +25°C | 2 | ||
| Collector-Emitter Voltage | VCEO | -400 | V | TA = +25°C | 2 | ||
| Emitter-Base Voltage | VEBO | -7 | V | TA = +25°C | 2 | ||
| Continuous Collector Current | IC | -200 | mA | TA = +25°C | 2 | ||
| Peak Pulse Current | ICM | -500 | mA | TA = +25°C | 2 | ||
| Operating and Storage Temperature Range | TJ, TSTG | -65 | 150 | °C | 2 | ||
| Power Dissipation | PD | 0.7 | W | Note 5, minimum recommended pad layout | 2 | ||
| Power Dissipation | PD | 1 | W | Note 6, 15mm x 15mm 1oz copper | 2 | ||
| Power Dissipation | PD | 1.5 | W | Note 7, 25mm x 25mm 1oz copper | 2 | ||
| Power Dissipation | PD | 2 | W | Note 8, 50mm x 50mm 1oz copper | 2 | ||
| Thermal Resistance, Junction to Ambient Air | RθJA | 178 | °C/W | Note 5, minimum recommended pad layout | 2 | ||
| Thermal Resistance, Junction to Ambient Air | RθJA | 125 | °C/W | Note 6, 15mm x 15mm 1oz copper | 2 | ||
| Thermal Resistance, Junction to Ambient Air | RθJA | 83 | °C/W | Note 7, 25mm x 25mm 1oz copper | 2 | ||
| Thermal Resistance, Junction to Ambient Air | RθJA | 60 | °C/W | Note 8, 50mm x 50mm 1oz copper | 2 | ||
| Thermal Resistance, Junction to Lead | RθJL | 22 | °C/W | Note 9 | 2 | ||
| ESD Human Body Model | ESD HBM | 4000 | V | JEDEC Class 3A | 2 | ||
| ESD Machine Model | ESD MM | 400 | V | JEDEC Class C | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 | 1 |
CAD (KiCad official)
- Symbol:
FCX558TA - Footprint:
Package_TO_SOT_SMD:SOT-89-3 - 3D model: SOT-89 (KiCad packages3D, STEP)
- 3D model files:
fcx558ta-etched.step/fcx558ta-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fcx558ta.step/fcx558ta.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (7 pp, sha256
ef5f9ca7f46adf1a, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).