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F280040PMQR

Texas Instruments · Microcontrollers (MCU/MPU/SOC) · LQFP-64(10x10)

F280040PMQR from Texas Instruments, in a LQFP-64(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GPIO29 bidirectional General-purpose I/O 29 (default GPIO function); also muxed to SCI-A TX, ePWM7B, EQEP1B, LIN-A RX, SPI-B STE and ERRORSTS.
2 GPIO28 bidirectional General-purpose I/O 28 (default GPIO function); also muxed to SCI-A RX, ePWM7A, EQEP1A, LIN-A TX, SPI-B CLK and ERRORSTS.
3 XRSn bidirectional Device reset input and watchdog reset output, open-drain with internal pullup; place a 2.2 kΩ to 10 kΩ resistor between XRSn and VDDIO and at most 100 nF to VSS.
4 VDD power_in 1.2 V digital logic supply; TI recommends a minimum total of about 20 µF decoupling near the VDD pins.
5 VSS power_in Digital ground; must be connected to the board ground.
6 A6/PGA5_OF passive ADC-A analog input 6; also PGA-5 output filter (optional).
7 B2/C6/PGA3_OF passive ADC-B analog input 2 and ADC-C analog input 6; also PGA-3 output filter (optional).
8 B3/VDAC passive ADC-B analog input 3; VDAC is the optional external reference for the on-chip DAC, has an internal 100 pF capacitor to VSSA that cannot be disabled, and needs at least 1 µF if used as DAC reference.
9 A2/B6/PGA1_OF passive ADC-A analog input 2 and ADC-B analog input 6; also PGA-1 output filter (optional).
10 PGA1_GND/PGA3_GND/PGA5_GND power_in Kelvin ground reference for PGA-1, PGA-3 and PGA-5; ideally equal to VSSA.
11 C4/PGA5_IN passive ADC-C analog input 4; PGA-5 amplifier input.
12 C0/PGA1_IN passive ADC-C analog input 0; PGA-1 amplifier input.
13 C2/PGA3_IN passive ADC-C analog input 2; PGA-3 amplifier input.
14 A1/DACB_OUT passive ADC-A analog input 1; also buffered DAC-B output.
15 A0/B15/C15/DACA_OUT passive ADC-A analog input 0 (also ADC-B 15 and ADC-C 15); also buffered DAC-A output.
16 VREFHIA/VREFHIB/VREFHIC bidirectional ADC high reference; driven externally in external reference mode, driven by the device in internal reference mode; place at least 2.2 µF between VREFHIx and VREFLOx close to the device and do not load externally.
17 VREFLOA/VREFLOB/VREFLOC input ADC low reference voltage input for ADC-A, ADC-B and ADC-C.
18 C1/PGA2_IN passive ADC-C analog input 1; PGA-2 amplifier input.
19 C3/PGA4_IN passive ADC-C analog input 3; PGA-4 amplifier input.
20 PGA2_GND/PGA4_GND/PGA6_GND power_in Kelvin ground reference for PGA-2, PGA-4 and PGA-6; ideally equal to VSSA.
21 VSSA power_in Analog ground for the ADC, PGA, CMPSS and DAC circuits.
22 VDDA power_in 3.3 V analog supply; place at least 2.2 µF decoupling to VSSA.
23 A4/B8/PGA2_OF passive ADC-A analog input 4 and ADC-B analog input 8; also PGA-2 output filter (optional).
24 B4/C8/PGA4_OF passive ADC-B analog input 4 and ADC-C analog input 8; also PGA-4 output filter (optional).
25 A10/B1/C10/PGA7_OF passive ADC-A analog input 10, ADC-B analog input 1 and ADC-C analog input 10; also PGA-7 output filter (optional).
26 VSS power_in Digital ground; must be connected to the board ground.
27 VDD power_in 1.2 V digital logic supply; TI recommends a minimum total of about 20 µF decoupling near the VDD pins.
28 VDDIO power_in 3.3 V digital I/O supply; place at least 0.1 µF decoupling on each VDDIO pin.
29 FLT2 unconnected Flash test pin 2, reserved for TI; must be left unconnected (or tied to VSS through 4.7 kΩ or more).
30 FLT1 unconnected Flash test pin 1, reserved for TI; must be left unconnected (or tied to VSS through 4.7 kΩ or more).
31 GPIO11 bidirectional General-purpose I/O 11 (default GPIO function); also muxed to ePWM6B, SCI-B RX, OUTPUTXBAR7, EQEP1B, SPI-A STE and FSIRX-A D1.
32 GPIO33 bidirectional General-purpose I/O 33 (default GPIO function); also muxed to I2C-A SCL (open-drain), SPI-B STE, OUTPUTXBAR4, LIN-A RX, SD1 C3, FSIRX-A CLK and CAN-A RX.
33 GPIO16 bidirectional General-purpose I/O 16 (default GPIO function); also muxed to SPI-A SIMO, CAN-B TX, ePWM5A, SCI-A TX, SD1 D1 and XCLKOUT.
34 GPIO17 bidirectional General-purpose I/O 17 (default GPIO function); also muxed to SPI-A SOMI, CAN-B RX, ePWM5B, SCI-A RX, SD1 C1 and PMBus-A SDA.
35 GPIO24 bidirectional General-purpose I/O 24 (default GPIO function); also muxed to OUTPUTXBAR1, eQEP2A, ePWM8A, SPI-B SIMO, SD1 D1, PMBus-A SCL, SCI-A TX and ERRORSTS.
36 TCK input JTAG test clock input with internal pullup.
37 GPIO37/TDO output JTAG test data output (default function); tri-stated when no JTAG activity, so an internal or external pullup is required to avoid a floating GPIO input.
38 TMS bidirectional JTAG test mode select with internal pullup; datasheet recommends an external 2.2 kΩ pullup to VDDIO on the board.
39 GPIO35/TDI input JTAG test data input (default function); internal pullup is disabled by default, so enable it or add an external pullup to avoid a floating input.
40 GPIO32 bidirectional General-purpose I/O 32 (default GPIO function); also muxed to I2C-A SDA, SPI-B CLK, ePWM8B, LIN-A TX, SD1 D3, FSIRX-A D0 and CAN-A TX.
41 GPIO18_X2 bidirectional GPIO18 (usable only when the system is clocked from INTOSC and X1 has an external pulldown, recommended 1 kΩ) or crystal oscillator output X2; also muxed to SPI-A CLK, SCI-B TX, CAN-A RX, ePWM6A, I2C-A SCL and SD1 D2.
42 X1 passive Crystal oscillator input or single-ended 3.3 V clock input; GPIO19 is internally tied to X1 and must remain an input with pullup disabled.
43 VDDIO power_in 3.3 V digital I/O supply; place at least 0.1 µF decoupling on each VDDIO pin.
44 VDD power_in 1.2 V digital logic supply; TI recommends a minimum total of about 20 µF decoupling near the VDD pins.
45 VSS power_in Digital ground; must be connected to the board ground.
46 VREGENZ input Internal regulator enable with internal pulldown: tie to VSS to enable the internal VREG, or to VDDIO to supply VDD externally.
47 GPIO8 bidirectional General-purpose I/O 8 (default GPIO function); also muxed to ePWM5A, CAN-B TX, ADCSOCAO, eQEP1 STROBE, SCI-A TX, SPI-A SIMO, I2C-A SCL and FSITX-A D1.
48 GPIO4 bidirectional General-purpose I/O 4 (default GPIO function); also muxed to ePWM3A, OUTPUTXBAR3, CAN-A TX and FSIRX-A CLK.
49 GPIO3 bidirectional General-purpose I/O 3 (default GPIO function); also muxed to ePWM2B, OUTPUTXBAR2, PMBus-A SCL, SPI-A CLK, SCI-A RX and FSIRX-A D0.
50 GPIO2 bidirectional General-purpose I/O 2 (default GPIO function); also muxed to ePWM2A, OUTPUTXBAR1, PMBus-A SDA, SCI-A TX and FSIRX-A D1.
51 GPIO1 bidirectional General-purpose I/O 1 (default GPIO function); also muxed to ePWM1B and I2C-A SCL (open-drain).
52 GPIO0 bidirectional General-purpose I/O 0 (default GPIO function); also muxed to ePWM1A and I2C-A SDA (open-drain).
53 VDDIO_SW power_in 3.3 V supply for the internal DC/DC regulator; must be tied to VDDIO, and about 20 µF input capacitance is required when the DC/DC is used.
54 GPIO23_VSW bidirectional GPIO23 by default configured as the DC/DC switch output VSW when DCDCEN=1 (about 100 pF internal capacitance); usable as GPIO23 if the DC/DC is not used.
55 VSS_SW power_in Internal DC/DC regulator ground; must be tied to VSS.
56 GPIO22_VFBSW bidirectional GPIO22 by default configured as DC/DC feedback VFBSW when DCDCEN=1; if the internal DC/DC is used, connect this pin to the node where L(VSW) connects to the VDD rail, close to the device.
57 GPIO7 bidirectional General-purpose I/O 7 (default GPIO function); also muxed to ePWM4B, OUTPUTXBAR5, eQEP1B, CAN-B RX, SPI-B SIMO and FSITX-A CLK.
58 VSS power_in Digital ground; must be connected to the board ground.
59 VDD power_in 1.2 V digital logic supply; TI recommends a minimum total of about 20 µF decoupling near the VDD pins.
60 VDDIO power_in 3.3 V digital I/O supply; place at least 0.1 µF decoupling on each VDDIO pin.
61 GPIO5 bidirectional General-purpose I/O 5 (default GPIO function); also muxed to ePWM3B, OUTPUTXBAR3, CAN-A RX, SPI-A STE and FSITX-A D1.
62 GPIO9 bidirectional General-purpose I/O 9 (default GPIO function); also muxed to ePWM5B, SCI-B TX, OUTPUTXBAR6, eQEP1 INDEX, SCI-A RX, SPI-A CLK and FSITX-A D0.
63 GPIO10 bidirectional General-purpose I/O 10 (default GPIO function); also muxed to ePWM6A, CAN-B RX, ADCSOCBO, eQEP1A, SCI-B TX, SPI-A SOMI, I2C-A SDA and FSITX-A CLK.
64 GPIO6 bidirectional General-purpose I/O 6 (default GPIO function); also muxed to ePWM4A, OUTPUTXBAR4, SYNCOUT, eQEP1A, CAN-B TX, SPI-B SOMI and FSITX-A D0.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package LQFP-64(10x10)
Category Embedded Processors & Controllers
Pins 64

CAD (KiCad official)

  • Symbol: F280040PMQR
  • Footprint: Package_QFP:LQFP-64_10x10mm_P0.5mm
  • 3D model: LQFP-64(10x10) (KiCad packages3D, STEP)
  • 3D model files: f280040pmqr-etched.step / f280040pmqr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); f280040pmqr.step / f280040pmqr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (277 pp, sha256 867e7bb5ada6819c, retrieved 2026-10-08, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF